JPH01143127U - - Google Patents
Info
- Publication number
- JPH01143127U JPH01143127U JP1988039172U JP3917288U JPH01143127U JP H01143127 U JPH01143127 U JP H01143127U JP 1988039172 U JP1988039172 U JP 1988039172U JP 3917288 U JP3917288 U JP 3917288U JP H01143127 U JPH01143127 U JP H01143127U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- bonding pad
- polycrystalline silicon
- insulating film
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/922—Bond pads being integral with underlying chip-level interconnections
- H10W72/9226—Bond pads being integral with underlying chip-level interconnections with via interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/923—Bond pads having multiple stacked layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例を示すアルミ・ボン
デイング・パツドの断面図、第２図および第３図
はそれぞれ従来半導体装置のボンデイング・パツ
ドの構造を示す断面図である。 １…シリコン基板、２…絶縁膜、３…薄膜の多
結晶シリコン膜、４…アルミ・ボンデイング・パ
ツド。
デイング・パツドの断面図、第２図および第３図
はそれぞれ従来半導体装置のボンデイング・パツ
ドの構造を示す断面図である。 １…シリコン基板、２…絶縁膜、３…薄膜の多
結晶シリコン膜、４…アルミ・ボンデイング・パ
ツド。
Claims (1)
- 半導体基板と、前記半導体基板上の絶縁膜上に
薄膜の多結晶シリコン膜を介して形成されるアル
ミ・ボンデイング・パツドとを含むことを特徴と
する半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988039172U JPH01143127U (ja) | 1988-03-24 | 1988-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988039172U JPH01143127U (ja) | 1988-03-24 | 1988-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01143127U true JPH01143127U (ja) | 1989-10-02 |
Family
ID=31265685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988039172U Pending JPH01143127U (ja) | 1988-03-24 | 1988-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01143127U (ja) |
-
1988
- 1988-03-24 JP JP1988039172U patent/JPH01143127U/ja active Pending