JPH0317643U - - Google Patents
Info
- Publication number
- JPH0317643U JPH0317643U JP7846689U JP7846689U JPH0317643U JP H0317643 U JPH0317643 U JP H0317643U JP 7846689 U JP7846689 U JP 7846689U JP 7846689 U JP7846689 U JP 7846689U JP H0317643 U JPH0317643 U JP H0317643U
- Authority
- JP
- Japan
- Prior art keywords
- tab
- chip
- frame
- present
- grounding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
本考案によるアース用ワイヤの断線保護を説明す
る断面図、第３図は本考案におけるタブ上側部分
の樹脂の大きさを説明する断面図、第４図は本考
案による樹脂のタブへの咬み込みを説明する図、
第５図は本考案の他の実施例の要部の平面図、第
６図は従来の一例の平面図、第７図は従来例によ
るアース用ワイヤの断線を説明する断面図である
。
２…ＩＣチツプ、６…電極、７ａ…アース用ワ
イヤ、１０…リードフレーム、１１…タブ、１１
ａ…タブアース、１１ｂ…孔、１３…リード、１
６…樹脂、１７，１８…凹部。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a sectional view illustrating the disconnection protection of the grounding wire according to the present invention, and Fig. 3 is an illustration of the size of the resin in the upper part of the tab in the present invention. FIG. 4 is a diagram illustrating the biting of the resin into the tab according to the present invention.
FIG. 5 is a plan view of essential parts of another embodiment of the present invention, FIG. 6 is a plan view of a conventional example, and FIG. 7 is a sectional view illustrating disconnection of a grounding wire according to the conventional example. 2...IC chip, 6...electrode, 7a...earth wire, 10...lead frame, 11...tab, 11
a...Tab ground, 11b...hole, 13...lead, 1
6...Resin, 17, 18...Recessed portion.
Claims (1)
、アース用ワイヤをボンデイングするためのタブ
アースをフレーム状に突出して設けた構成として
なるＩＣチツプ用リードフレーム。 A lead frame for an IC chip having a frame-like structure in which a tab ground for bonding a grounding wire is provided protruding from the side of a tab for mounting and fixing an IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7846689U JPH0317643U (en) | 1989-07-03 | 1989-07-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7846689U JPH0317643U (en) | 1989-07-03 | 1989-07-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317643U true JPH0317643U (en) | 1991-02-21 |
Family
ID=31621764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7846689U Pending JPH0317643U (en) | 1989-07-03 | 1989-07-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317643U (en) |
-
1989
- 1989-07-03 JP JP7846689U patent/JPH0317643U/ja active Pending