JPH045656U - - Google Patents
Info
- Publication number
- JPH045656U JPH045656U JP4550190U JP4550190U JPH045656U JP H045656 U JPH045656 U JP H045656U JP 4550190 U JP4550190 U JP 4550190U JP 4550190 U JP4550190 U JP 4550190U JP H045656 U JPH045656 U JP H045656U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- semiconductor device
- leads
- lead
- auxiliary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 230000003321 amplification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図および第２図は本考案の半導体装置用パ
ツケージの平面図、第３図は従来の半導体装置用
パツケージの平面図である。
１……高周波増幅ＩＣペレツト、２……ペレツ
トマウント部、３，３ａ〜３ｄ……リード、４…
…ボンデイング部、５，５Ａ，５Ｂ……補助リー
ド、６……ボンデイングワイヤ、７……モールド
樹脂。
1 and 2 are plan views of a package for a semiconductor device according to the present invention, and FIG. 3 is a plan view of a conventional package for a semiconductor device. 1... High frequency amplification IC pellet, 2... Pellet mount section, 3, 3a to 3d... Lead, 4...
...bonding part, 5, 5A, 5B... auxiliary lead, 6... bonding wire, 7... mold resin.
Claims (1)
と、このペレツトマウント部の周囲に配設された
複数本の独立したリードとを備え、前記ＩＣペレ
ツトと前記各リードとをボンデイングワイヤで接
続し、かつこれらをモールド樹脂で封止してなる
半導体装置において、前記各リードの間に前記ペ
レツトマウント部の一部を突出させたボンデイン
グ部および補助リードを配設し、かつこれらボン
デイング部および補助リードを前記ＩＣペレツト
の接地電極に電気接続したことを特徴とする半導
体装置のパツケージ。 ２ ボンデイング部はモールド樹脂内に埋設し、
補助リードはその先端をモールド樹脂から突出さ
せてなる実用新案登録請求の範囲第１項記載の半
導体装置のパツケージ。[Claims for Utility Model Registration] 1. A pellet mount part on which an IC pellet is mounted, and a plurality of independent leads arranged around the pellet mount part, wherein the IC pellet and each lead are connected to each other. in a semiconductor device in which a bonding part and an auxiliary lead from which a part of the pellet mount part protrudes is disposed between each of the leads; A package for a semiconductor device, characterized in that the bonding portion and the auxiliary lead are electrically connected to the ground electrode of the IC pellet. 2 The bonding part is buried in the mold resin,
A package for a semiconductor device according to claim 1, wherein the auxiliary leads have their tips protruding from the molding resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4550190U JPH045656U (en) | 1990-04-28 | 1990-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4550190U JPH045656U (en) | 1990-04-28 | 1990-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH045656U true JPH045656U (en) | 1992-01-20 |
Family
ID=31559736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4550190U Pending JPH045656U (en) | 1990-04-28 | 1990-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH045656U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193182A (en) * | 1993-12-24 | 1995-07-28 | Nec Corp | Semiconductor device |
| CN101944522A (en) * | 2009-07-03 | 2011-01-12 | 瑞萨电子株式会社 | The electronic unit of lead frame and use lead frame |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298166A (en) * | 1988-10-04 | 1990-04-10 | Nec Corp | Package for semiconductor |
-
1990
- 1990-04-28 JP JP4550190U patent/JPH045656U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298166A (en) * | 1988-10-04 | 1990-04-10 | Nec Corp | Package for semiconductor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07193182A (en) * | 1993-12-24 | 1995-07-28 | Nec Corp | Semiconductor device |
| CN101944522A (en) * | 2009-07-03 | 2011-01-12 | 瑞萨电子株式会社 | The electronic unit of lead frame and use lead frame |
| JP2011014758A (en) * | 2009-07-03 | 2011-01-20 | Renesas Electronics Corp | Lead frame and electronic component using the same |