JPH03181143A - Substrate for mounting electronic part - Google Patents
Substrate for mounting electronic partInfo
- Publication number
- JPH03181143A JPH03181143A JP1321973A JP32197389A JPH03181143A JP H03181143 A JPH03181143 A JP H03181143A JP 1321973 A JP1321973 A JP 1321973A JP 32197389 A JP32197389 A JP 32197389A JP H03181143 A JPH03181143 A JP H03181143A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- base material
- component mounting
- sealing resin
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、互いに電気的に独立した複数のリードと、こ
のリードの内側に一体的に形成した内部接続部と、この
内部接続部に一体的に形成した基材とを備え、電子部品
が搭載された後、その表裏面が樹脂封止される電子部品
搭載用基板に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention provides a plurality of leads that are electrically independent from each other, an internal connection portion integrally formed inside the leads, and an internal connection portion integrally formed with the internal connection portion. The present invention relates to a substrate for mounting electronic components, the front and back surfaces of which are sealed with resin after electronic components are mounted thereon.
（従来の技術）
近年、半導体素子を代表とする電子部品にあっては、よ
り一層の高密度化及び小型化が図られてきており、この
ような電子部品を機能させるためには、電子部品搭載用
基板に実装して装置化しなければならない。そして、電
子部品が搭載される電子部品搭載用基板には、外部接続
端子となるリードを形成し、このリードを利用して他の
装置等との電気的接続が容易に行えるようにしなければ
ならない。(Prior Art) In recent years, electronic components such as semiconductor devices have become more densely packed and more compact. It must be mounted on a mounting board and turned into a device. The electronic component mounting board on which electronic components are mounted must be provided with leads that serve as external connection terminals, and these leads must be used to facilitate electrical connections with other devices, etc. .
従来、このような電子部品搭載用基板としては、第５図
〜第７図に示すようなものが知られている。Conventionally, as such electronic component mounting boards, those shown in FIGS. 5 to 7 are known.
この電子部品搭載用基板（２０）にあっては、搭載した
電子部品（Ａ）の接続端子と各リード（２１）の内部接
続部（２２）とをボンディングワイヤ（２８）を介して
電気的に接続するようになっている。また、この電子部
品搭載用基板（２０）にあっては、電子部品（Ａ）を搭
載した後、その表裏面に金型をセットし、金型の端部よ
り封止樹脂を高圧で注入することにより、その表裏面を
樹脂封止するようになっている。In this electronic component mounting board (20), the connection terminal of the mounted electronic component (A) and the internal connection portion (22) of each lead (21) are electrically connected via bonding wires (28). It is supposed to connect. In addition, in this electronic component mounting board (20), after mounting the electronic component (A), a mold is set on the front and back surfaces of the electronic component (A), and a sealing resin is injected at high pressure from the end of the mold. This allows the front and back surfaces to be sealed with resin.
（発明が解決しようとする課題）
しかしながら、従来の電子部品搭載用基板（２０）にあ
っては、前述のように電子部品（Ａ）を搭載してその表
裏面を樹脂封止した場合、表面側の封止樹脂（２５ａ）
と裏面側の封止樹脂（２５ｂ）とが基材（２３）によっ
て完全に部分され、一体化されないといった問題があっ
た。従って、表面側及び裏面側の封止樹脂（２５ａ）（
２５ｂ）は、特に引っ掛かる部分がないまま、単に基材
（２３）に接合された状態となるため、基材（２３）と
封止樹脂（２５ａ） （２５ｂ）との間にクラックが発
生したり、基材（２３）から封止樹脂（２５ａ）（２５
ｂ）が剥離してしまうことがあった。(Problem to be Solved by the Invention) However, in the conventional electronic component mounting board (20), when the electronic component (A) is mounted and its front and back surfaces are sealed with resin as described above, the surface Side sealing resin (25a)
There was a problem that the sealing resin (25b) on the back surface side was completely separated by the base material (23) and not integrated. Therefore, the sealing resin (25a) on the front side and the back side (
25b) is simply joined to the base material (23) without any particularly caught parts, so cracks may occur between the base material (23) and the sealing resin (25a) (25b). , from the base material (23) to the sealing resin (25a) (25
b) sometimes peeled off.
また、前述のように樹脂封止する際、金型内に高圧で注
入される封止樹脂（２５）の圧力が、基材（２３）や電
子部品（Ａ）の接続端子とリード（２１）の内部接続部
（２２）とを電気的に接続しているボンディングワイヤ
（２８）にそのまま加わることがあるため、基材（２３
）が波打ったり、ボンディングワイヤ（２３）が切れて
しまうといった問題があった。In addition, when performing resin sealing as described above, the pressure of the sealing resin (25) injected into the mold at high pressure is applied to the connection terminals and leads (21) of the base material (23) and the electronic component (A). The base material (23) may be directly connected to the bonding wire (28) electrically connecting the internal connection portion (22) of the
) was wavy and the bonding wire (23) was broken.
本発明は以上のような実状に鑑みてなされたものであり
、その目的は、表裏面を樹脂封止した場合に基材と封止
樹脂との間にクラックが発生したり、封止樹脂が基材か
ら剥離することがなく、また樹脂封止の際に基材が波打
ったり、ボンディングワイヤが切れてしまうことがない
電子部品搭載用基板を提供することにある。The present invention has been made in view of the above-mentioned circumstances, and its purpose is to prevent cracks from occurring between the base material and the sealing resin when the front and back surfaces are sealed with resin, and the sealing resin from being damaged. It is an object of the present invention to provide a substrate for mounting electronic components that does not peel off from a base material, and also prevents the base material from waving or bonding wires from breaking during resin sealing.
（課題を解決するための手段）
以上のような課題を解決するために本発明の採った手段
は、第１図〜第４図に示すように、「互いに電気的に独
立した複数のリード（１１）と、このリード（１１）の
内側に一体的に形成した内部接続部（１２）と、この内
部接続部（１２）に一体内に形成した基材（１３）とを
備え、
電子部品（Ａ）が搭載された後、その表裏面が樹脂封止
される電子部品搭載用基板であって、少なくとも前記リ
ード（１１）の内部接続部（１２）の近傍に位置する基
材（１３）に開口（１４）を形成したことを特徴とする
電子部品搭載用基板（１０）Ｊである。(Means for Solving the Problems) The means taken by the present invention to solve the above-mentioned problems is as shown in FIGS. 1 to 4. 11), an internal connection part (12) integrally formed inside this lead (11), and a base material (13) formed integrally with this internal connection part (12), A) is a substrate for mounting electronic components whose front and back surfaces are sealed with resin after mounting A) on the base material (13) located at least in the vicinity of the internal connection portion (12) of the lead (11). This is an electronic component mounting board (10) J characterized by having an opening (14) formed therein.
（作用）
本発明が上述のような手段を採ることにより、以下に示
すような作用がある。(Function) By adopting the above-mentioned means, the present invention has the following effects.
少なくともリード（１１）の内部接続部（１２）の近傍
に位置する基材（１３）に開口（１４）を形成したこと
により、この電子部品搭載用基板（１０）の表面側と裏
面側とが開口（１４）部分で連通ずる。従って、この電
子部品搭載用基板（１０）に電子部品（Ａ）を搭載して
その表裏面を樹脂封止した場合、開口（１４）を通じて
表面側の封止樹脂（１５ａ）と裏面側の封止樹脂（１５
ｂ）とが一体化され、表面側の封止樹脂（１５ａ）は裏
面側の封止樹脂（１５ｂ）の、また裏面側の封止樹脂（
１５ｂ）は表面側の封止樹脂（１５ａ）の掛止部として
作用する。By forming the opening (14) in the base material (13) located at least in the vicinity of the internal connection part (12) of the lead (11), the front side and the back side of this electronic component mounting board (10) are connected. Communication occurs at the opening (14). Therefore, when an electronic component (A) is mounted on this electronic component mounting board (10) and its front and back surfaces are sealed with resin, the sealing resin (15a) on the front side and the sealing resin on the back side are connected through the opening (14). Stopper resin (15
b) are integrated, and the sealing resin (15a) on the front side is the sealing resin (15b) on the back side, and the sealing resin (15b) on the back side is integrated with the sealing resin (15b) on the back side.
15b) acts as a hook for the sealing resin (15a) on the front side.
また、樹脂封止する際、金型内に高圧で注入され、基材
（１３）やボンディングワイヤ（１８）に当たっていた
封止樹脂（１５）のうちのいくらかが開口（１４）より
反対側に抜けるため、基材（１３）やボンディングワイ
ヤ（２８）に加わる圧力が軽減される。Also, when sealing with resin, some of the sealing resin (15) that is injected into the mold at high pressure and has hit the base material (13) and bonding wire (18) escapes to the opposite side through the opening (14). Therefore, the pressure applied to the base material (13) and the bonding wire (28) is reduced.
（実施例）
以下、図面に示す実施例に従って本発明の詳細な説明す
る。(Example) Hereinafter, the present invention will be described in detail according to an example shown in the drawings.
第１図〜第３図は、本発明の第一実施例に係る電子部品
搭載用基板（ｌＯ）を示すものであり、この電子部品搭
載用基板（１０）は、互いに電気的に独立した複数のリ
ード（１１）と、このリード（１１）の内側に一体的に
形成した内部接続部（１２）と、この内部接続部（１２
）に一体内に形成した基材（１３）とを備えている。こ
の電子部品搭載用基板（１０）には、その略中心部に電
子部品（Ａ）を搭載するための電子部品搭載部（１６）
が形成してあり、各リード（１１）の内部接続部（１２
）は、電子部品搭載部（１６）に向けて形成しである。1 to 3 show an electronic component mounting board (10) according to a first embodiment of the present invention, and this electronic component mounting board (10) includes a plurality of electrically independent A lead (11), an internal connection part (12) integrally formed inside this lead (11), and an internal connection part (12) formed integrally inside this lead (11).
) and a base material (13) formed integrally with the base material (13). This electronic component mounting board (10) has an electronic component mounting portion (16) for mounting the electronic component (A) approximately in the center thereof.
is formed, and the internal connection part (12) of each lead (11) is formed.
) is formed toward the electronic component mounting section (16).
そして、この電子部品搭載用基板（１０）を構成してい
る基材（１３）には、電子部品搭載部（１６）の周囲に
台形状の開口（１４）が形成しである。なお、本発明に
おいて基材（１３）とは、この電子部品搭載用基板（１
０）に電子部品（Ａ）を搭載して樹脂封止し、電子部品
搭載装置とした後にも存在する部分のみを指し、装置化
した後に除去される図中−点鎖線外の部分は含まれない
。従って、−点鎖線外に形成され、外部接続端子となる
リード（１１）を露出させるための切欠部（１７）は、
本発明でいう開口（１４）ではない。また、本発明にあ
っては、開口（１４）の形状は特に限定されず、リード
（１１）の内部接続部（１２）によって完全に塞がれて
しまうことがなく、樹脂封止した際に、表面側の封止樹
脂（１５ａ）と裏面側の封止樹脂（１５ｂ）とを一体化
する封止樹脂（１５ｃ）が侵入し得るものであればよく
、例えば第４図に示すように、微細な円形状の開口（１
４）を複数形成するようにしてもよい。A trapezoidal opening (14) is formed around the electronic component mounting portion (16) in the base material (13) constituting the electronic component mounting board (10). In addition, in the present invention, the base material (13) refers to this electronic component mounting board (1
This refers only to the parts that remain even after the electronic parts (A) are mounted on 0) and resin-sealed to make it into an electronic parts mounting device, and the parts outside the dotted chain line in the figure that are removed after being made into a device are not included. do not have. Therefore, the notch (17) formed outside the - dotted chain line and used to expose the lead (11) serving as an external connection terminal is
This is not the opening (14) as used in the present invention. Further, in the present invention, the shape of the opening (14) is not particularly limited, and the opening (14) is not completely blocked by the internal connection part (12) of the lead (11), and when sealed with resin. The sealing resin (15c) that integrates the sealing resin (15a) on the front side and the sealing resin (15b) on the back side may penetrate, for example, as shown in FIG. Fine circular opening (1
4) may be formed in plurality.
このような電子部品搭載用基板（１０）に電子部品（Ａ
）を搭載し、電子部品（Ａ）の接続端子とリード（１１
）の内部接続部（１２）とをワイヤーボンディングによ
って電気的に接続した後、樹脂封止したところ、樹脂封
止の際に基材（１３）が波打ったり、ボンディングワイ
ヤ（１８）が切れてしまうことがなく、また環境試験を
行ったところ、基材（１３）と封止樹脂との間にクラッ
クが発生したり、封止樹脂が基材（１３）から剥離する
ことがなかった。Electronic components (A) are mounted on such an electronic component mounting board (10).
), and the connection terminal and lead (11) of the electronic component (A) are installed.
) was electrically connected to the internal connection part (12) by wire bonding and then sealed with resin, but the base material (13) was wavy or the bonding wire (18) was cut during resin sealing. When an environmental test was conducted, no cracks were generated between the base material (13) and the sealing resin, and the sealing resin did not peel off from the base material (13).
なお、本発明に係る電子部品搭載用基板（１０）にあっ
ては、基材（１３）上にリード（１１）の内部接続部（
１２）を保護するソルダーレジスト等の被膜を形成して
もよく、このような被膜を形成する場合には、この被膜
によって開口（１４）が塞がれてしまうことがないよう
、被膜にも基材（１３）の開口（１４）に対応する開口
を形成する必要がある。In addition, in the electronic component mounting board (10) according to the present invention, the internal connection portions (11) of the leads (11) are provided on the base material (13).
12) may be formed, such as a solder resist film, to protect the opening (14). When such a film is formed, the film may also contain a base so that the opening (14) will not be blocked by this film. It is necessary to form an opening corresponding to the opening (14) in the material (13).
（発明の効果）
以上のように本発明に係る電子部品搭載用基板にあって
は、少なくともリードの内部接続部の近傍に位置する基
材に開口を形成したことにより、この電子部品搭載用基
板の表面側と裏面側とが開口部分で連通ずる。従って、
この電子部品搭載用基板に電子部品を搭載してその表裏
面を樹脂封止した場合、開口を通じて表面側の封止樹脂
と裏面側の封止樹脂とが一体化され、表面側の封止樹脂
は裏面側の封止樹脂の、また裏面側の封止樹脂は表面側
の封止樹脂の掛止部として作用する。すなわち、本発明
に係る電子部品搭載用基板にあっては、基材と封止樹脂
との間にクラックが発生したり、封止樹脂か基材から剥
離することがない信頼性の優れた電子部品搭載装置を提
供することができる。(Effects of the Invention) As described above, in the electronic component mounting board according to the present invention, by forming an opening in the base material located at least in the vicinity of the internal connection portion of the lead, the electronic component mounting board The front side and the back side communicate through the opening. Therefore,
When electronic components are mounted on this electronic component mounting board and the front and back surfaces are sealed with resin, the sealing resin on the front side and the sealing resin on the back side are integrated through the opening, and the sealing resin on the front side is integrated. acts as a hook for the sealing resin on the back side, and the sealing resin on the back side acts as a hook for the sealing resin on the front side. That is, in the electronic component mounting board according to the present invention, there is no cracking between the base material and the sealing resin, and the sealing resin does not peel off from the base material, and has excellent reliability. A component mounting device can be provided.
また、本発明に係る電子部品搭載用基板にあっては、樹
脂封止する際、金型内に高圧で注入され、基材やボンデ
ィングワイヤに当たっていた封止樹脂のうちのいくらか
が開口より反対側に抜けるため、基材やボンディングワ
イヤに加わる圧力が軽減され、基材が波打ったり、ボン
ディングワイヤが切れたりすることがない。Further, in the electronic component mounting board according to the present invention, when resin sealing is performed, some of the sealing resin that is injected into the mold at high pressure and that has hit the base material and the bonding wire is on the side opposite to the opening. The pressure applied to the base material and bonding wire is reduced, and the base material does not wave or the bonding wire breaks.
第１図は本発明に係る電子部品搭載用基板を示す平面図
、第２図は第１図の■−■線に沿ってみた断面図、第３
図は第１図の電子部品搭載用基板を樹脂封止した状態を
示す断面図、第４図は本発明に係る別の電子部品搭載用
基板を示す平面図、第５図は従来の電子部品搭載用基板
を示す平面図、第６図は第５図のＶＩ−ＶＩ線に沿って
みた断面図、第７図は第５図の電子部品搭載用基板を樹
脂封止した状態を示す断面図である。
符 号 の 説 明
１０・・・電子部品搭載用基板、１１・・・リード、１
２・・・内部接続部、１３・・・基材、１４・・・開口
、１５・・・封止樹脂、１６・・・電子部品搭載部、１
７・・・切欠部、１８・・・ボンディングワイヤ、Ａ・
・・電子部品。
以
上FIG. 1 is a plan view showing a board for mounting electronic components according to the present invention, FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1, and FIG.
The figure is a cross-sectional view showing a state in which the electronic component mounting board of FIG. 1 is sealed with resin, FIG. 4 is a plan view showing another electronic component mounting board according to the present invention, and FIG. 5 is a conventional electronic component mounting board. 6 is a sectional view taken along line VI-VI in FIG. 5, and FIG. 7 is a sectional view showing the electronic component mounting substrate shown in FIG. 5 sealed with resin. It is. Explanation of symbols 10...Electronic component mounting board, 11...Lead, 1
2... Internal connection part, 13... Base material, 14... Opening, 15... Sealing resin, 16... Electronic component mounting part, 1
7... Notch, 18... Bonding wire, A.
...Electronic parts. that's all
Claims (1)
内側に一体的に形成した内部接続部と、この内部接続部
に一体的に形成した基材とを備え、電子部品が搭載され
た後、その表裏面が樹脂封止される電子部品搭載用基板
であって、 少なくとも前記リードの内部接続部の近傍に位置する基
材に開口を形成したことを特徴とする電子部品搭載用基
板。[Claims] An electronic component comprising a plurality of electrically independent leads, an internal connection portion integrally formed inside the leads, and a base material integrally formed with the internal connection portion. An electronic component mounting board whose front and back surfaces are resin-sealed after being mounted, the electronic component having an opening formed in the base material located at least in the vicinity of the internal connection portion of the lead. Mounting board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32197389A JP2794212B2 (en) | 1989-12-11 | 1989-12-11 | Substrate for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32197389A JP2794212B2 (en) | 1989-12-11 | 1989-12-11 | Substrate for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03181143A true JPH03181143A (en) | 1991-08-07 |
| JP2794212B2 JP2794212B2 (en) | 1998-09-03 |
Family
ID=18138498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32197389A Expired - Lifetime JP2794212B2 (en) | 1989-12-11 | 1989-12-11 | Substrate for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2794212B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141576A (en) * | 1977-05-16 | 1978-12-09 | Matsushita Electric Ind Co Ltd | Fixing device of semiconductor |
| JPS54137971A (en) * | 1978-04-18 | 1979-10-26 | Toshiba Corp | Resin-sealed type semiconductor device |
| JPS62179196A (en) * | 1986-01-31 | 1987-08-06 | 三菱電機株式会社 | Semiconductor mounting apparatus |
| JPH01113334U (en) * | 1988-01-27 | 1989-07-31 |
-
1989
- 1989-12-11 JP JP32197389A patent/JP2794212B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141576A (en) * | 1977-05-16 | 1978-12-09 | Matsushita Electric Ind Co Ltd | Fixing device of semiconductor |
| JPS54137971A (en) * | 1978-04-18 | 1979-10-26 | Toshiba Corp | Resin-sealed type semiconductor device |
| JPS62179196A (en) * | 1986-01-31 | 1987-08-06 | 三菱電機株式会社 | Semiconductor mounting apparatus |
| JPH01113334U (en) * | 1988-01-27 | 1989-07-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2794212B2 (en) | 1998-09-03 |
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