JPH03181149A - Semiconductor integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a standard cell type or cell-based type semiconductor integrated circuit device.

[Conventional technology]

FIG. 3 is a schematic plan view showing a conventional cell-based semiconductor integrated circuit device, and FIG. 4 is an enlarged plan view of part B in the semiconductor integrated circuit device shown in FIG. 3, where 1 is a semiconductor chip. , 2 indicates a module cell in which one unit cell is a predetermined group of functional blocks. On the semiconductor chip 1; one or more module cells 2 (only one is shown in the drawing) in the active area, and a grounding pad 3a and a power supply pad on the periphery. 3b, a transmission band 30, etc. are provided, for example, between the grounding terminal 14a connected to the grounding wire 14 of the module cell 2 and the grounding pad 3a, and the power terminal 15a connected to the power supply wire 15 of the module cell 2. Wires 17. and the power supply bonding pads 3b are connected to each other. 18
It is connected at.

[Problem to be solved by the invention]

By the way, in the conventional device as described above, only one ground terminal 14a connected to the ground wiring 14 of the module cell 2 and one power terminal 15a connected to the power supply wiring 15 are each provided in one corner of the module cell 2. Therefore, in the floor planning of the entire chip, there is little freedom in wiring between the grounding pad 3a, the power supplying pad 3b, and the grounding terminal 14a and power supply terminal 15a of the module cell 2, and the wiring 17. 18 becomes long, which causes problems such as deterioration of characteristics due to increased impedance.

The present invention has been made in view of the above circumstances, and its purpose is to increase the degree of freedom regarding ground wiring and power wiring in the floor planning of the entire chip, and to provide a semiconductor integrated circuit that can shorten the power wiring and ground wiring. To provide circuit equipment.

[Means to solve the problem]

In the semiconductor integrated circuit device according to the present invention, a module cell is provided with a plurality of ground terminals and a plurality of power supply terminals.

[Effect]

According to the present invention, this increases the degree of freedom in floor planning of the wiring connecting each bonding pad to the ground terminal and power supply terminal of the module cell, making it possible to shorten the wiring distance.

[Example] The present invention will be specifically described below based on drawings showing examples thereof.

FIG. 1 is a schematic diagram of a semiconductor integrated circuit device according to the present invention, and FIG. 2 is an enlarged plan view of the A6N area in FIG. 1. In the figure, 1 indicates a semiconductor chip, and 2 indicates a module cell. . The semiconductor chip 1 has one or more module cells 2 in its active area, and has a grounding pad 3a, a power supply pad 3b, and a signal input pad 30 on its periphery. A large number of bonding pads are provided. On the other hand, at the four corners of the module cell 2, there are two ground terminals 4a, 4b and a power terminal 6a each connected to the ground wiring 4 and power supply wiring 5.6 inside the module cell 2, as shown in FIG. 2, for example.
, 6b are provided. The ground wiring 4 is led to a corner of the semiconductor chip 1, and is connected to two corners of the semiconductor chip.
Ground terminal 4a along the edge.

4b is provided.

On the other hand, the power supply wiring 5 is connected to the power supply wiring 6 by a through hole 5a near a corner of the semiconductor chip l. The power supply wiring 6 is formed into an L-shape 7 when viewed from above, and its both ends intersect at right angles to the edges of the two sides of the semiconductor chip 1, and the power supply lines are connected parallel to the edges at the crossing positions. Terminals 6a and 6b are provided.

Such ground terminals 4a, 4b, power terminals 6a, 6
Although b is not specifically shown, the four corners of the semiconductor chip 1 are also provided in substantially the same manner.

In the device of the present invention, the grounding pad 3a and the power supply pad 3b are located at the negative corner of the module cell 2 located closest to the grounding pad 3a, for example, as shown in FIG. As shown, it is possible to connect the ground terminals 4a, 4b and the power terminals 6a, 6b provided at the upper left corner with wirings 7, 8.

In addition, in the above-mentioned embodiment, two
Although the configuration has been described in which the grounding terminals 4a, 4b and the power terminals 6a, 6b are provided, the present invention is not limited to this and may be provided in any two corners or any three corners. Of course.

〔Effect of the invention〕

As described above, in the present invention, since a plurality of ground terminals and a plurality of power supply terminals are provided, there is a large degree of freedom in wiring to connect between the ground terminal and power supply terminal of the module cell and the bonding pad. The present invention has excellent effects, such as being able to significantly shorten the length of the wire, reducing wiring impedance, and improving noise resistance.

[Brief explanation of drawings]

Fig. 1 is a schematic plan view of the device of the present invention, Fig. 2 is an enlarged view of section A in Fig. 1, Fig. 3 is a schematic plan view of the conventional device, and Fig. 4 is an enlarged view of section B in Fig. 3. It is an enlarged view. 1... Semiconductor chip 2... Module cell 3a
...Ponding pad for grounding 3b...Ponding pad for power supply 4...Grounding wiring 5.
6... Power supply wiring 7.8... Wiring In the drawings, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] (1) A semiconductor integrated circuit device comprising one or more module cells having a predetermined function, characterized in that a plurality of power supply terminals and a plurality of ground terminals are provided for each of the module cells.