JPH03184890A - Electrode pattern formation method - Google Patents

Abstract

PURPOSE:To accurately form a high density electrode pattern by patternwise applying printing ink mainly constituted of an organometal compound, a resin and a solvent to a substrate being an object by transfer printing using a waterless planographic plate and baking the printed pattern. CONSTITUTION:Printing ink mainly constituted of a mixed organometal compound based on an organogold compound, a resin and a solvent is supplied to the recessed parts of a waterless planographic plate using a rubber roller and the ink in the recessed parts is subsequently transferred to a transfer blanket while the ink on the blanket is printed on an alumina glazed substrate 11 being an object in a zigzag pattern of a line & space to the dried and baked to form conductive pattern electrodes 13. As the organometal compound to be used, ester of 20 or less C lower fatty acid, alcoholate, mercaptide, a polycyclic organometal compound, other resinate, rosinate or a mixture thereof are designated. By this method, high density electrode patterns can be directly formed by pattern printing and high density electrodes can be obtained in low cost.

Description

[Detailed Description of the Invention] Field of Application of Industry-1- The present invention relates to a method for forming electrode patterns used in hybrid ICs, thermal heads, flat panel displays such as liquid crystal display devices, etc. A conductive thin film of metal is formed on a substrate using a vacuum thin film forming process such as vapor deposition or sputtering.A thin film pattern electrode is formed using a photolithography method, and a screen printing method is used on the substrate. There are two types of thick film pattern electrodes that are formed by printing and baking, the former being used for flat displays such as thermal heads and liquid crystal displays, and the latter being often used for hybrid ICs. The two types of patterned electrodes mentioned in Section 2 have their own advantages and disadvantages.In other words, the thin-film type has the advantage of high pattern accuracy. equipment costs, production methods such as batch production, etc. There are many problems that need to be solved from the point of view of cost reduction (t) On the other hand, the thick film type uses a printing and baking method, so equipment costs are low and continuous production is easy. However, the pattern accuracy of conventional screen printing method is ±
It is about 50 μm, and there is a problem with pattern accuracy.However, the present invention aims to solve the above problem. According to the present invention, a high-density electrode pattern is formed by transferring printing ink onto a substrate, which is a subject, in a pattern using printing ink, and then baking the ink to form an electrode group. Direct pattern printing is possible, the photolithography process can be simplified, and high-density electrodes can be obtained at lower cost than conventional patterned electrodes.

Example (Example-1) Printing ink mainly composed of a mixed organometallic compound resin and a solvent, mainly composed of an organic compound of gold, was applied onto an alumina substrate onto a concave part of a Minamilithographic plate (manufactured by Toshi) using a rubber roller. Next, after transferring the ink in the recesses onto a transfer blanket, the ink on the blanket is printed on the substrate 1, which is the subject, in a staggered pattern with lines and spaces of 50 μm, and after drying, it is baked at 700°C to make it conductive. The transfer amount of the ink that formed the patterned electrode was 3 μm in transfer thickness, and the electrode thickness after firing was 0.5 μm.
The electrode was 2μm in diameter, but instead of the 25μm line/25μm space in the design pattern, a 30μm line/20μm space can be formed, and a fine pattern that cannot be formed by screen printing can be created by inking a metal organic compound using the waterless lithography method. It was found that they can be distantly related as organometallic compounds. (Example 2) In Example 1, as the mixed organometallic compound, the weight ratio of the metals contained after firing was 80 parts to 98 parts of gold, 0 to 5 parts of bismuth, and 0 parts of rhodium. Part ~ 1° starvation Vanadium is 0
It has been found that by using a mixed organometallic compound of 5 parts to 5 parts, a gold conductive pattern electrode with good film formability and high conductivity can be obtained. In addition, silicon is 0 to 8 parts and lead is 0.
It is clear that the adhesion to the substrate is improved by adding 8 parts to 8 parts.

The optimal organometallic compound for gold electrodes is ζ.The metal weight ratio after firing is 88 to 98 parts for gold and 0.0 parts for silicon.
0.011 parts to 5 parts Lead 0.055 parts to 2 parts Bismuth 0.05 parts to 2 parts
A mixed organometallic compound containing 0 to 5 parts of rhodium was preferred (Example 3) As the organometallic compound, instead of gold in Example 1, white was used.
Organometallic compounds of silver, nickel, tungsten, molybdenum, titanium, and tantalum are made into ink, printed using a nailless lithography method, and fired in a semi-reducing atmosphere to obtain each metal electrode, which is then used as a round film co-phase (to be implemented). In addition to the examples shown in Example 2, black metal, silicon, aluminium, zirconyl, and boron were effective (Example 4) The method shown in Example 1 was made by forming an ink from an organometallic compound of indium and tin. Similarly, by printing on a glass substrate using the nailless lithography method and baking it in air at about 550°C,
A transparent conductive pattern electrode was obtained.As an organometallic compound, the metal weight ratio after firing is 90 parts to 98 parts of indium, 0.5 parts to 10 parts of tin, and 0 parts of lead.
IK Silicon is 0 to 1 enemy Antimony is 0 to 1
A simple matrix type liquid crystal device was fabricated using the transparent conductive patterned electrode substrate, in which a mixed organometallic compound was preferable. Using organometallic compounds as film-forming aids such as silicon and zirconyl, it was made into an ink together with an organometallic compound containing bismuth, printed on a substrate by the nailless lithography method in the same manner as in Example 1, and printed in air. By firing, a conductive pattern electrode of ruthenium oxide was obtained.
The patterned electrode could be used as a resistor (Example-6) As the resin necessary for ink formation, natural monk's clothes, natural resin derivatives, phenol monk's clothes, rosin-modified phenol & J BL
Xylene resin Melamine monk's clothing Ketone resin Terpene monk's clothing Cyclized rubber Gon chloride Alkyd tree B'tL
Polyamide monk's robe acrylic wood 111. Polyvinyl chloride monk's clothing Polyvinyl acetate K Polyvinyl alcohol, epoxy tree Jl! , polyvinyl butyral, polyurethane, and cellulose derivatives can be used, and L and L are especially compatible with organometallic compounds and are excellent for forming into inks.
T, Natural resin Phenol robe Rosin-modified phenol robe Alkyd robe Rosin-modified alkyd resin
Acrylic monk's robe made of polyvinyl alcohol and epoxy resin (Example 7) As shown in Figure 1, an alumina substrate (11) with a thickness of 0.801111 and a glass glaze layer (12) of 50/ljm to 100 μm was used. ), a printing ink mainly composed of a mixed organometallic anvil having the composition shown in Example 2, a rosin-modified resin, and a petroleum-based solvent was applied to a staggered electrode of 81 ines/im using the waterless lithographic printing method. Electrodes (13) were formed by printing in a pattern, drying and firing. After forming an electrode group using the above film formation method, a line-shaped resistor (14) was formed on the screen opening door 1 of RuO2 frit paste by firing. On top of this, a wear-resistant layer (approximately 5 μm) is added by printing and baking glass paste.
(15) After fabrication, the resistance variation of each dot resistance value was ±13%, and the resistance value of each dot was adjusted by the current overload trimming method (self-generated joule treatment of the heating resistor). By trimming using the method of
Electrical formation printed on thermal paper under YCL driving conditions Uniform printing was achieved (Example-8) To the pattern number shown in Figure 2, a 0.8n+m thick sheet with a glass glaze layer (22) of 50μm-100μm A mixture of the composition shown in Example 2 on the alumina substrate (21) was printed at 81 ines/mm by a nailless planographic printing method using a printing ink mainly composed of a mixed organometallic compound (4), a rosin-modified resin, and a petroleum solvent. The electrode (23) was formed by printing a counter electrode pattern, drying and firing.
After forming the electrode group by the above film-forming method, the RuO2 dot-shaped resistor (24) was formed using the method described in Example 5.
Finally, a wear-resistant layer (approximately 5 μrn) (25) was formed by printing and baking glass paste.The resistance variation of each dot resistance after fabrication was ±8%, especially during trimming. As described above, according to the present invention, a metal is treated as an organic compound 1.
Using printing ink mainly composed of resin and solvent, the ink is transferred and printed in a pattern onto the substrate (substrate) using a nailless lithographic plate, and then baked to form a highly precise electrode pattern of i+'a-, +3. It becomes possible to print patterns, simplify the photolithography process, and continuously produce conductive patterned electrodes with high 11-density at low cost.

[Brief explanation of drawings]

FIG. 1 and FIG. 2C are configuration diagrams of a conductive pattern electrode according to an embodiment of the present invention.

Claims (6)

[Claims] (1) Printing ink mainly composed of a metal organic compound, resin, and solvent is supplied to the recesses on the waterless lithographic plate using a rubber roller, and then the ink in the recesses is transferred onto the transfer blanket. 1. A method for forming an electrode pattern, comprising transferring and printing ink onto a substrate as a subject in a pattern, and baking the resulting electrode group. (2) Organometallic compounds selected from platinum group elements, gold, silver, nickel, chromium, silicon, germanium, tantalum, aluminum, zirconium, titanium, boron, bismuth, vanadium, lead, indium, tin, tungsten, and molybdenum. 2. The method of forming an electrode pattern according to claim 1, wherein (3) A claim characterized in that the organometallic compound is a single substance or a mixture of esters of lower fatty acids having up to 20 carbon atoms, alcoholades, mercaptides, polycyclic organometallic compounds, and other resinates and rosinates. Item 2. The method for forming an electrode pattern according to Item 2. (4) The method for forming an electrode pattern according to claim 2, wherein the resin is a natural resin, phenol resin, rosin-modified phenol resin, alkyd resin, rosin-modified alkyd resin, acrylic resin, polyvinyl alcohol, or epoxy resin. (5) As an organometallic compound, gold is 88 parts to 98 parts, silicon is 0.01 parts to 5 parts, in metal weight ratio after firing;
A printing ink mainly composed of a mixed organometallic compound containing 0.05 to 2 parts of lead, 0.5 to 3 parts of bismuth, and 0 to 5 parts of rhodinium, a resin, and a solvent is applied using a waterless lithography method. 3. The method of forming an electrode pattern according to claim 2, wherein the electrode pattern is formed by printing a pattern on a substrate using a substrate and firing the electrode pattern. (6) As an organometallic compound, the metal weight ratio after firing is 90 parts to 98 parts of indium and 0.5 parts to 1 part of tin.
Using a waterless lithography method, a printing ink mainly composed of a mixed organometallic compound containing 0 parts of lead, 0 parts to 1 part of silicon, and 0 parts to 1 part of antimony, a resin, and a solvent is used. 3. The method of forming an electrode pattern according to claim 2, wherein the electrode pattern is formed by printing a pattern on a substrate and firing the electrode pattern.