JPH0318757B2 - - Google Patents
Info
- Publication number
- JPH0318757B2 JPH0318757B2 JP15005183A JP15005183A JPH0318757B2 JP H0318757 B2 JPH0318757 B2 JP H0318757B2 JP 15005183 A JP15005183 A JP 15005183A JP 15005183 A JP15005183 A JP 15005183A JP H0318757 B2 JPH0318757 B2 JP H0318757B2
- Authority
- JP
- Japan
- Prior art keywords
- pads
- printed wiring
- wiring board
- pad
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010030 laminating Methods 0.000 claims description 16
- 239000010408 film Substances 0.000 claims description 13
- 239000013039 cover film Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000010425 asbestos Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229910052895 riebeckite Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明は、フレキシブルプリント配線板の製造
方法に関し、とくにラミネートプレスによるフレ
キシブルプリント配線板の製造方法の改良に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a flexible printed wiring board, and particularly to an improvement in the method for manufacturing a flexible printed wiring board using a laminate press.
フレキシブルプリント配線板は、一般に、第１
図に示すように、金属張積層板１をベース接着剤
２によつてベースフイルム３に貼合せ、該ベース
フイルム３に熱硬化性接着剤４を被着したカバー
フイルム５を積層してなる。このフレキシブルプ
リント配線板６が長尺である場合において、カバ
ーフイルム５を積層する方法として、ロールラミ
ネータを用いて連続的にラミネートしていく方法
がある。しかし、この方法は、導体パターンの形
状、使用材料の種類および厚み等によつて、導体
パターン間に空孔を発生させる。この空孔は、半
田付け時の熱による空気の膨張によつて、ベース
フイルム３とカバーフイルム５との間に「脹ら
み」を形成するので、プリント配線板６の耐熱性
に悪影響を及ぼす原因となつていた。そこで、従
来は、この空孔の発生を防ぐため、第２図に示す
ラミネートプレス７を使用している。このプレス
７のラミネート装置８は、上盤９と下盤１０に分
れ、それぞれボルト等によつて本体１１に固定さ
れている。上盤９および下盤１０は、アスベスト
１２、熱盤１３およびバツド１４を備えている。
上部パツド１４は、フツク１５によつて掛止され
ている。下盤１０は、シリンダ１６によつて上下
に移動する。しかし、従来のプリント配線板６の
製造方法は、カバーフイルム５を短尺化（例えば
半分ずつ）にしてこれをつなぎ合わせ、積層して
いたので、工程数が増え、また外観を悪くするの
みならず、つなぎ部分の段差による弊害を生じて
いた。すなわち、つなぎ部分は、応力が集中する
ために耐屈曲性が損われ、実装に際し鋭角に曲げ
ることが困難となり、しかもつなぎ部分が屈曲部
とならないように配慮しなければならず、煩雑で
あつた。 Flexible printed wiring boards generally have a first
As shown in the figure, a metal-clad laminate 1 is bonded to a base film 3 using a base adhesive 2, and a cover film 5 coated with a thermosetting adhesive 4 is laminated on the base film 3. When the flexible printed wiring board 6 is long, a method for laminating the cover films 5 is to continuously laminate them using a roll laminator. However, this method generates holes between the conductor patterns depending on the shape of the conductor patterns, the type and thickness of the material used, etc. These holes form "bulges" between the base film 3 and the cover film 5 due to air expansion due to heat during soldering, which adversely affects the heat resistance of the printed wiring board 6. It was the cause. Conventionally, a laminating press 7 shown in FIG. 2 has been used to prevent the generation of voids. The laminating device 8 of this press 7 is divided into an upper plate 9 and a lower plate 10, each of which is fixed to a main body 11 with bolts or the like. The upper plate 9 and the lower plate 10 are provided with an asbestos 12, a hot plate 13, and a butt 14.
The upper pad 14 is hung by a hook 15. The lower plate 10 is moved up and down by a cylinder 16. However, in the conventional manufacturing method of the printed wiring board 6, the cover film 5 is shortened (for example, in halves) and then joined and laminated, which not only increases the number of steps but also deteriorates the appearance. However, the difference in level between the joints caused problems. In other words, the bending resistance of the connecting portions is impaired due to the concentration of stress, making it difficult to bend at an acute angle during mounting, and care must be taken to prevent the connecting portions from becoming bent parts, which is complicated. .
本発明は上記問題点を解消するフレキシブルプ
リント配線板の製造方法を提供することを目的と
し、その特徴とするところは、ラミネートプレス
の熱盤上に固定するパツドの長さをカバーフイル
ム側パツドよりもベースフイルム側パツドを小さ
く形成し、このラミネートプレスを用いて空孔を
消失させる程度に接着処理し、次いで、上記パツ
ドに対応する寸法だけ送つて、順次積層していく
ことにある。 An object of the present invention is to provide a method for manufacturing a flexible printed wiring board that solves the above-mentioned problems, and the feature is that the length of the pad fixed on the hot platen of the laminate press is longer than that of the pad on the cover film side. Another method is to form small pads on the base film side, apply adhesive treatment to such an extent as to eliminate voids using this laminating press, and then feed the pads by the size corresponding to the pads and laminate them one after another.
以下、図示の実施例に基づき、本発明を説明す
る。なお、従来例と同一部位には、同一符号を付
する。 Hereinafter, the present invention will be explained based on illustrated embodiments. Note that the same parts as in the conventional example are given the same reference numerals.
第３図および第４図は、本発明の一実施例を示
したもので、図において、８はラミネート装置、
９は上盤、１０は下盤である。上盤９は、アスベ
スト１２、熱盤１３および上部パツド１４を備
え、これらを重合してなる。アスベスト１２およ
び熱盤１３は、ボルト（図示しない）によつて一
体的にプレス本体に取付けられている。上部パツ
ド１４は、熱盤１３に立設したフツク１５によつ
て熱盤１３に掛止されている。上部パツド１４
は、固定板、アルミニウム板、シリコンゴムおよ
び離型用フイルムからなり、この順序に重着して
成形されている。下盤１０は、アスベスト１２′、
熱盤１３′および下部パツド１４′を備え、これら
を重合してなる。上記アスベスト１２′、熱盤１
３′および下部パツド１４′は、ボルトによつて一
体的にプレス本体に取付けられている。下部パツ
ド１４′は、固定板、鉄板、シリコンゴムおよび
ガラスクロスからなり、この順序に重着して成形
されている。上部パツド１４は、下部パツド１
４′に比べて硬い。他方、プリント配線板６の送
り方向（第４図の矢印）の長さは、上部パツド１
４よりも下部パツド１４′の方が小さく形成され
ている。 FIG. 3 and FIG. 4 show an embodiment of the present invention, and in the figures, 8 is a laminating device;
9 is the upper board, and 10 is the lower board. The upper plate 9 includes an asbestos 12, a heating plate 13, and an upper pad 14, which are polymerized. Asbestos 12 and hot platen 13 are integrally attached to the press body with bolts (not shown). The upper pad 14 is hooked to the heating plate 13 by a hook 15 erected on the heating plate 13. Upper pad 14
consists of a fixing plate, an aluminum plate, silicone rubber, and a release film, which are stacked in this order and molded. The lower board 10 is made of asbestos 12',
It is provided with a heating plate 13' and a lower pad 14', which are polymerized. Above asbestos 12', heating plate 1
3' and the lower pad 14' are integrally attached to the press body by bolts. The lower pad 14' consists of a fixing plate, an iron plate, silicone rubber, and glass cloth, which are stacked in this order and molded. The upper pad 14 is the lower pad 1
Harder than 4'. On the other hand, the length of the printed wiring board 6 in the feeding direction (arrow in FIG. 4) is the same as that of the upper pad 1.
The lower pad 14' is formed smaller than the pad 4.
上記構成のラミネートプレスにおけるラミネー
ト装置８によつてフレキシブルプリント配線板６
を製造するには、まず、熱盤１３，１３′を170℃
〜190℃に加熱しておく。続いて、上下パツド１
４，１４′間に連続的に位置合せしたベースフイ
ルム３とカバーフイルム５とをセツトする。つい
で、下盤１０をシリンダによつて上方に移動させ
て、ベースフイルム３とカバーフイルム５とを上
下パツド１４，１４′間に挾持する。この状態で、
ベースフイルム３およびカバーフイルム５を30
Kg／cm2〜80Kg／cm2の圧力で20秒〜30秒間加圧して
空孔を消失させる程度に接着処理し、ベースフイ
ルム３にカバーフイルム５を積層する。そのの
ち、下盤１０を下方に移動させて上部パツド１４
と下部パツド１４′を離し（第４図参照）、積層し
た部分を下部パツド１４′よりやや小さい寸法だ
け矢印方向に送り、順次積層してプリント配線板
６を製造する。なお、接着剤２，４を完全硬化さ
せるためには、高温炉によりアフターキユアを行
う必要がある。 The flexible printed wiring board 6 is formed by the laminating device 8 in the laminating press having the above configuration.
To manufacture, first heat platens 13 and 13' to 170℃.
Heat to ~190℃. Next, upper and lower pads 1
A base film 3 and a cover film 5 are set in continuous alignment between 4 and 14'. Then, the lower plate 10 is moved upward by the cylinder, and the base film 3 and cover film 5 are sandwiched between the upper and lower pads 14, 14'. In this state,
30 base film 3 and cover film 5
The cover film 5 is laminated on the base film 3 by applying pressure at a pressure of Kg/cm 2 to 80 Kg/cm 2 for 20 to 30 seconds to the extent that the pores disappear. After that, move the lower plate 10 downward and press the upper pad 14.
The lower pad 14' is released (see FIG. 4), and the laminated portion is sent in the direction of the arrow by a size slightly smaller than the lower pad 14', and the printed wiring board 6 is manufactured by sequentially laminating the pads. Note that in order to completely cure the adhesives 2 and 4, it is necessary to perform after-curing using a high-temperature furnace.
本発明に係るフレキシブルプリント配線板の製
造方法によれば、長尺のまま積層することができ
るので、工程数を減少させることができる。ま
た、導体パターン間に生ずる空孔、パツド端縁に
よる折り目およびカバーフイルムにつなぎ合せ目
の形成を防ぐことができるとともに、ラミネート
プレスからの幅射熱によつて積層前に接着剤が硬
化することもなくなるので、製品の品質安定化が
図れる。 According to the method for manufacturing a flexible printed wiring board according to the present invention, since it is possible to laminate the boards as long as they are, the number of steps can be reduced. In addition, it is possible to prevent the formation of voids between conductor patterns, creases due to pad edges, and seams in the cover film, and the adhesive can be cured before lamination by the radiant heat from the laminating press. Since this also eliminates the presence of water, the quality of the product can be stabilized.
第１図は積層前のフレキシブルプリント配線板
の縦断面図、第２図は従来のラミネート装置を装
着したラミネートプレスを示す概念図、第３図は
本発明のラミネート装置を示す正面図、第４図は
本発明による積層方法を説明するため、一部を断
面にして示す正面図である。
１……金属張積層板、２，４……接着剤、３…
…ベースフイルム、５……カバーフイルム、６…
…フレキシブルプリント配線板、７……ラミネー
トプレス、１３……熱盤、１４……パツド。
FIG. 1 is a vertical cross-sectional view of a flexible printed wiring board before lamination, FIG. 2 is a conceptual diagram showing a laminating press equipped with a conventional laminating device, FIG. 3 is a front view showing a laminating device of the present invention, and FIG. The figure is a partially sectional front view for explaining the lamination method according to the present invention. 1...Metal-clad laminate, 2, 4...Adhesive, 3...
...Base film, 5...Cover film, 6...
...Flexible printed wiring board, 7... Laminating press, 13... Heat plate, 14... Padded.
Claims (1)
着剤を被着したカバーフイルムをラミネートプレ
スによつて積層するフレキシブルプリント配線板
の製造方法において、上記ラミネートプレスの熱
盤上に固定するパツドの長さをカバーフイルム側
パツドよりもベースフイルム側パツドを小さく形
成し、このラミネートプレスを用いて空孔を消失
させる程度に接着処理し、次いで、上記パツドに
対応する寸法だけ送つて、順次積層していくこと
を特徴とするフレキシブルプリント配線板の製造
方法。1. In a method for manufacturing a flexible printed wiring board in which a cover film coated with an adhesive is laminated on a base film on which a metal-clad laminate is laminated using a laminating press, the length of the pad fixed on the hot platen of the laminating press is The pads on the base film side are formed smaller than the pads on the cover film side, and the laminating press is used to bond the pads to such an extent that the holes disappear.Then, the pads are sent by the size corresponding to the above pads and laminated one after another. A method for manufacturing a flexible printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15005183A JPS6041284A (en) | 1983-08-17 | 1983-08-17 | Method of producing flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15005183A JPS6041284A (en) | 1983-08-17 | 1983-08-17 | Method of producing flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6041284A JPS6041284A (en) | 1985-03-04 |
| JPH0318757B2 true JPH0318757B2 (en) | 1991-03-13 |
Family
ID=15488425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15005183A Granted JPS6041284A (en) | 1983-08-17 | 1983-08-17 | Method of producing flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6041284A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5368054B2 (en) * | 2008-10-15 | 2013-12-18 | 日本メクトロン株式会社 | Method for manufacturing flexible circuit board and flexible circuit board |
| CN108177417A (en) * | 2017-11-28 | 2018-06-19 | 珠海市超赢电子科技有限公司 | Fpc block press |
-
1983
- 1983-08-17 JP JP15005183A patent/JPS6041284A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6041284A (en) | 1985-03-04 |
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