JPH0370397B2 - - Google Patents
Info
- Publication number
- JPH0370397B2 JPH0370397B2 JP22378982A JP22378982A JPH0370397B2 JP H0370397 B2 JPH0370397 B2 JP H0370397B2 JP 22378982 A JP22378982 A JP 22378982A JP 22378982 A JP22378982 A JP 22378982A JP H0370397 B2 JPH0370397 B2 JP H0370397B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- fluid
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012530 fluid Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 238000009461 vacuum packaging Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は多層プリント配線板の製造方法に係
り、特にプリント配線板の積層接着に好適な多層
化成形に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method for manufacturing a multilayer printed wiring board, and particularly to multilayer molding suitable for lamination adhesion of printed wiring boards.
従来の多層プリント配線板の多層化成形方法
は、多層プリント配線板成形プレスを用いて積層
接着をしていたので、接着中の多層プリント配線
板内の温度分布および圧力分布が十分均一にでき
ず、そのため多層プリント配線板内の圧力が小さ
い部分に気泡が生じたり、また多層プリント配線
板が変形したりして導通不良になるような欠点が
あつた。このうち気泡の発生については、真空パ
ツク技術により防止できるようになつたが、多層
プリント配線板の変形については対策がなされて
いなかつた。
The conventional multilayer molding method for multilayer printed wiring boards uses a multilayer printed wiring board molding press to bond the layers, so the temperature and pressure distribution within the multilayer printed wiring board during adhesion cannot be made sufficiently uniform. As a result, there were drawbacks such as bubbles being generated in areas of the multilayer printed wiring board where the pressure was low, and the multilayer printed wiring board being deformed, resulting in poor conductivity. Among these, the generation of bubbles can be prevented by vacuum packing technology, but no measures have been taken to prevent deformation of multilayer printed wiring boards.
〔発明の目的〕
本発明の目的は、かかる従来方法における欠点
を除去するために、多層プリント配線板の積層接
着中に多層プリント配線板内の温度分布および圧
力分布を均一化できるような多層プリント配線板
の多層化成形方法を提供することにある。[Object of the Invention] In order to eliminate the drawbacks of such conventional methods, the object of the present invention is to provide a multilayer printed wiring board that can equalize the temperature distribution and pressure distribution within the multilayer printed wiring board during lamination bonding of the multilayer printed wiring board. An object of the present invention is to provide a multilayer molding method for a wiring board.
本発明は、プリント配線板と接着シートを積層
し、該積層物を可とう性のある材料でおおつた後
該材料でおおわれた内部を脱気し、流体中に位置
せしめ、この流体を加圧・加熱することにより、
気泡がなくかつ変形の小さな多層プリント配線板
を得る製造方法を特徴とする。
The present invention laminates a printed wiring board and an adhesive sheet, covers the laminate with a flexible material, evacuates the interior covered with the material, positions it in a fluid, and pressurizes the fluid.・By heating,
The present invention is characterized by a manufacturing method for obtaining a multilayer printed wiring board that is free of bubbles and has little deformation.
以下図面によつて本発明の一実施例について説
明する。第１図、第２図および第３図は本発明に
よる多層プリント配線板の成形方法を順番に示す
ものである。
An embodiment of the present invention will be described below with reference to the drawings. FIGS. 1, 2, and 3 sequentially illustrate a method for forming a multilayer printed wiring board according to the present invention.
第１図は、導体回路パターンを形成したプリン
ト配線板１と、加熱によつて硬化反応が進む性質
の半硬化状態の接着シート２（図中波形で模式的
に示されている）とが位置合せピン３に交互に通
して重ね合わせられた状態を示す横断面図であ
る。各プリント配線板１は基体の両側に導体をも
つものであるが、第１図は最も外側の面には回路
パターンは未形成で、その他の面には回路パター
ン（図中凸部として模式的にされている）が形成
されていることを示している。 FIG. 1 shows the positions of a printed wiring board 1 on which a conductor circuit pattern is formed and a semi-cured adhesive sheet 2 (schematically indicated by a waveform in the figure) that undergoes a curing reaction when heated. FIG. 3 is a cross-sectional view showing a state in which the dowel pins are passed through dowel pins 3 alternately and overlapped. Each printed wiring board 1 has conductors on both sides of the base, but in Figure 1, no circuit pattern is formed on the outermost surface, and circuit patterns (schematically shown as convex portions in the figure) are formed on the other surfaces. This shows that the formation of
第２図は、第１図に示すプリント配線板１と接
着シート２との積層物（横断面で示す）を可とう
性を有するフイルム４で包み、真空脱気装置５に
よつてフイルム４内の空気を除いている状態を示
す模式図である。 In FIG. 2, a laminate (shown in cross section) of the printed wiring board 1 and adhesive sheet 2 shown in FIG. 1 is wrapped in a flexible film 4, and the inside of the film 4 is FIG. 2 is a schematic diagram showing a state in which air is removed.
第３図は、流体プレス６、温度・圧力制御機構
およびこれらをつなぐ流体回路を示すブロツク図
である（ただし真空パツクされた積層物は横断面
で示す）。油タンク１３から供給される高温油１
４は、流体プレス６を通過し、再び油タンク１３
に戻るように循環する。モータ９によつて駆動さ
れるポンプ８は、油タンク１３から供給される高
温油１４を加圧する。絞り弁１２は、油タンク１
３に戻る高温油１４の流れを絞るものである。リ
リーフ弁１１は、該流体の圧力制御をするための
弁である。温度制御装置７は、高温油１４の温度
を制御するものである。たとえばあるタンクの中
にこの流体を通すパイプを引き込み、加温の時は
タンクの中に蒸気を入れ、冷却の時は水を入れる
ような装置である。切換弁１０は、加圧時と加圧
終了時によつて流体回路を切換えるためのもので
ある。 FIG. 3 is a block diagram showing the fluid press 6, the temperature/pressure control mechanism, and the fluid circuit connecting them (although the vacuum-packed laminate is shown in cross section). High temperature oil 1 supplied from oil tank 13
4 passes through the fluid press 6 and returns to the oil tank 13
cycle back to . A pump 8 driven by a motor 9 pressurizes high temperature oil 14 supplied from an oil tank 13. The throttle valve 12 is connected to the oil tank 1
This is to restrict the flow of high temperature oil 14 returning to step 3. The relief valve 11 is a valve for controlling the pressure of the fluid. The temperature control device 7 controls the temperature of the high temperature oil 14. For example, a device is such that a pipe for passing this fluid is placed inside a tank, and steam is introduced into the tank for heating, and water is introduced for cooling. The switching valve 10 is for switching the fluid circuit depending on when pressurizing and when pressurizing ends.
以下上記構成によつて、多層プリント配線板の
製造方法の手順を説明する。 The steps of the method for manufacturing a multilayer printed wiring board will be explained below using the above configuration.
まず第１図に示すように、プリント配線板１と
接着シート２とを位置合わせピン３に交互に通し
て重ね合わせる。次にこの積層物を第２図に示す
ように、フイルム４で包み、真空脱気装置５によ
つてフイルム４内の空気を抜いて真空パツク状態
にする。 First, as shown in FIG. 1, printed wiring boards 1 and adhesive sheets 2 are passed alternately through alignment pins 3 and overlapped. Next, as shown in FIG. 2, this laminate is wrapped in a film 4, and the air inside the film 4 is removed by a vacuum degassing device 5 to form a vacuum packed state.
次にこの真空パツクされた積層物を第３図に示
す流体プレス６に入れ、絞り弁１２および切換弁
１０を調節した状態でポンプ８によつて加圧し、
多層プリント配線板の積層接着を行う。このとき
流体プレス６内の圧力を測定する圧力計（図示せ
ず）によりリリーフ弁１１を調節して圧力制御す
る。また流体プレス６内の温度を測定する温度計
（図示せず）により温度制御装置７によつて高温
油１４の温度を制御する。温度は170℃で、圧力
は５Kg／cm2程度が適当である。 Next, this vacuum-packed laminate is put into a fluid press 6 shown in FIG.
Performs lamination bonding of multilayer printed wiring boards. At this time, the pressure is controlled by adjusting the relief valve 11 using a pressure gauge (not shown) that measures the pressure inside the fluid press 6. Further, the temperature of the high-temperature oil 14 is controlled by a temperature control device 7 using a thermometer (not shown) that measures the temperature inside the fluid press 6. The appropriate temperature is 170°C and the pressure is approximately 5 kg/cm 2 .
本実施例によれば、今までのような多層プリン
ト配線板成形用プレスを用いて積層接着をする時
に得られなかつた低圧力の下で多層プリント配線
板内の圧力分布が均一となり、特に多層プリント
配線板の変形を小さくできる効果がある。また低
圧力の積層接着をする場合には、従来多層プリン
ト配線板内の気泡の発生が問題になつていたが、
真空パツクをすることで気泡の発生する核が除か
れるので、本発明の方法により気泡が発生しない
という効果もある。以上の理由により、従来技術
である積層物の真空パツク技術が、本発明の方法
によつて一層効果的に生かされることになる。 According to this embodiment, the pressure distribution inside the multilayer printed wiring board becomes uniform under the low pressure that could not be obtained when laminating and bonding using a conventional press for forming multilayer printed wiring boards, and the pressure distribution in the multilayer printed wiring board becomes uniform. This has the effect of reducing deformation of the printed wiring board. In addition, when using low-pressure lamination adhesives, the generation of air bubbles in multilayer printed wiring boards has traditionally been a problem.
Vacuum packing removes the nucleus where air bubbles are generated, so the method of the present invention also has the effect of not generating air bubbles. For the above reasons, the prior art vacuum packing technology for laminates can be utilized more effectively by the method of the present invention.
本発明によれば、多層プリント配線板内の温度
分布および圧力分布を均一にすることができるの
で、気泡がなくかつ変形の小さな多層プリント配
線板が得られ、プリント配線板の導通不良を低減
させる効果がある。
According to the present invention, since the temperature distribution and pressure distribution within the multilayer printed wiring board can be made uniform, a multilayer printed wiring board without bubbles and with small deformation can be obtained, and conduction defects in the printed wiring board can be reduced. effective.
第１図は多層プリント配線板の積層方法を示す
断面図、第２図は多層プリント配線板の真空パツ
ク方式を示す模式図、第３図は流体プレスによる
多層プリント配線板の接着方法を示すブロツク図
である。
１…プリント配線板、２…接着シート、４…フ
イルム、５…真空脱気装置、６…流体プレス、７
…温度制御装置、８…ポンプ、１１…リリーフ
弁、１３…油タンク、１４…高温油。
Figure 1 is a cross-sectional view showing a method for laminating a multilayer printed wiring board, Figure 2 is a schematic diagram showing a vacuum packing method for a multilayer printed wiring board, and Figure 3 is a block diagram showing a method for bonding a multilayer printed wiring board using a fluid press. It is a diagram. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Adhesive sheet, 4... Film, 5... Vacuum deaerator, 6... Fluid press, 7
...Temperature control device, 8...Pump, 11...Relief valve, 13...Oil tank, 14...High temperature oil.
Claims (1)
させて積層し圧着によつて成形する多層プリント
配線板の製造方法において、前記プリント配線板
と接着シートとを積層し、当該積層物を可とう性
のある材料でおおつた後該材料でおおわれた内部
を脱気し、流体中に位置せしめ、前記流体を加
圧・加熱することを特徴とする多層プリント配線
板の製造方法。1. A method for manufacturing a multilayer printed wiring board in which the printed wiring boards are laminated with an adhesive sheet interposed between them and formed by pressure bonding, in which the printed wiring board and the adhesive sheet are laminated, and the laminate is made flexible. 1. A method for manufacturing a multilayer printed wiring board, which comprises covering the board with a certain material, deaerating the interior covered with the material, placing the board in a fluid, and pressurizing and heating the fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22378982A JPS59114894A (en) | 1982-12-22 | 1982-12-22 | Method for manufacturing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22378982A JPS59114894A (en) | 1982-12-22 | 1982-12-22 | Method for manufacturing multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59114894A JPS59114894A (en) | 1984-07-03 |
| JPH0370397B2 true JPH0370397B2 (en) | 1991-11-07 |
Family
ID=16803732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22378982A Granted JPS59114894A (en) | 1982-12-22 | 1982-12-22 | Method for manufacturing multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59114894A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61159718A (en) * | 1984-12-29 | 1986-07-19 | 株式会社村田製作所 | Manufacture of laminated ceramic electronic component |
| JPS61159719A (en) * | 1984-12-29 | 1986-07-19 | 株式会社村田製作所 | Manufacture of laminated ceramic electronic component |
| JPH01208103A (en) * | 1988-02-16 | 1989-08-22 | Murata Mfg Co Ltd | Method of molding laminated ceramic block |
| JPH085052B2 (en) * | 1992-08-11 | 1996-01-24 | 日本特殊陶業株式会社 | Method for manufacturing ceramic laminate |
-
1982
- 1982-12-22 JP JP22378982A patent/JPS59114894A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59114894A (en) | 1984-07-03 |
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