JPH0319337A - Removing device for wafer contamination - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a wafer foreign matter removal device, and more particularly to a wafer foreign matter removal device that removes foreign matter from the wafer surface by bringing liquid into contact with the wafer surface and causing friction. Regarding.

[Prior Art] FIGS. 3A and 3B show a conventional wafer foreign matter removing apparatus, in particular, FIG. 3A is a front view and FIG. 3B is a plan view. FIG. 4 is an enlarged view of area (2) shown in FIG. 3A. Next, a conventional wafer foreign matter removing apparatus will be described with reference to FIGS. 3A, 3B, and 4.

A conventional wafer future removal device includes a wafer support 2 for illegally placing a silicon wafer 1, a brush roll 4 having a large number of brushes formed on its outer circumferential surface, and a system for pouring pure water onto the surface of the silicon wafer 1. A pure water vibrator 7 is provided. The wafer support table 2 has a suction mechanism (not shown) for fixing the silicon wafer 1 placed thereon, and has a rotation shaft 3.
It is possible to rotate around the center. Rotating force is applied to the rotating shaft 3 by an electric motor or the like (not shown). The brush roll 4 is also rotatable around a rotating shaft 6, and the rotating shaft 6 is provided with a rotational force by an electric motor or the like (not shown). Next, the operation will be explained.

A silicon wafer 1 is placed on a wafer support 2 with its surface 11 to be cleaned facing upward, and is fixed onto the wafer support 2 by a suction mechanism provided on the wafer support 2. Next, the wafer support table 2 is rotated at several thousand times per minute, the brush roll 4 is rotated, and pure water is poured from the pure water pipe 7 onto the wafer surface 11.

As a result, the wafer surface 11 is rubbed by the brush 3,
The scraped material on the wafer is removed by washing away the scraped material with pure water.

[Problems to be Solved by the Invention] Since the conventional wafer foreign matter removal device is configured as described above, when removing foreign matter from the wafer 1 by rotating the brush roll 4, one of the tips of the brushes 5 is removed. For example, as shown in FIG.
There is a problem in that the foreign matter is not completely removed because it collects in the corners 91 and the grooves 92 between the steps.

Therefore, this invention was made to solve the above-mentioned problems, and it is possible to remove foreign matter by preventing foreign matter from remaining in the corners of the steps on the wafer or in the grooves between the steps. It is an object of the present invention to provide a wafer foreign matter removal device that can completely remove foreign matter from a wafer.

[Means for Solving the Problems] The present invention is a wafer foreign matter removal device for removing foreign matter from the wafer surface. A wafer foreign matter removal apparatus according to the present invention includes a liquid storage section for storing a liquid for cleaning a wafer surface, and an ultrasonic generation means for applying ultrasonic vibration to the liquid stored in the liquid storage section. , so that the wafer surface can be ultrasonically cleaned by the liquid,
The wafer holding member is configured to include a rotatable wafer holding member capable of holding a wafer with the surface to be cleaned facing downward, and a rotation driving means for rotationally driving the wafer holding member.

[Operation] In this invention, the wafer is immersed in a cleaning liquid and rotated with the surface to be cleaned facing downwardly. Ultrasonic vibrations are applied to this liquid. As a result, foreign matter adhering to the wafer surface is removed from the rewafer surface by the frictional force between the liquid and the wafer surface and ultrasonic vibration, and is washed away by the liquid.

[Embodiments of the invention] An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a wafer foreign matter removal device according to an embodiment of the present invention, and FIG. 2 is an enlarged view of area (2) shown in FIG. 1.

As shown in FIG. 1, the wafer foreign matter removal apparatus includes a container 10 containing a liquid such as pure water 12 for cleaning a silicon wafer 1, and an ultrasonic vibrator 13 provided at the bottom or side of the container 10. and a rotatable holding member 21 capable of holding the silicon wafer 1 with the surface to be cleaned facing downward. The holding member 21 is capable of holding and fixing the silicon wafer 1 by, for example, adsorbing it. Further, the holding member 21 is attached to a rotating shaft 23 that can be raised and lowered, and a rotational force is applied to the rotating shaft 23 by an electric motor or the like (not shown).

Therefore, the holding member 21 can move up and down while rotating concavely. The rotation of the holding member 21 is in the range of 1000 to 6000 times/min, and the frequency of the ultrasonic vibrator 13 is 10
It can be changed in the range of 0 kHz to 10 MHz using a controller (not shown).

In the wafer hole removal apparatus configured in this way, the silicon wafer 1 to be cleaned is held by the holding member 21 with the surface to be cleaned facing downward.

Next, the holding member 21 is lowered while being rotated at a predetermined number of rotations, and the surface 11 of the silicon wafer 1 is immersed in the pure water 12. Further, the pure water 12 is ultrasonically vibrated by the ultrasonic vibrator 13 . As a result, foreign matter on the silicon wafer 1 is removed from the wafer surface by the frictional force between the pure water l2 and the surface of the wafer 1 and ultrasonic vibration, and is washed away by the pure water 12. In this manner, when removing foreign matter from the silicon wafer, it is possible to prevent foreign matter from gathering in the corners of the steps 8 on the wafer surface and in the grooves between the steps 8. After the cleaning process, the silicon wafer 1 is raised together with the holding member 21. As a result, the silicon wafer 1 leaves the surface of the pure water 12, and the water droplets attached to the surface of the silicon wafer 1 are scattered by the high speed rotation. Thereafter, the silicon wafer 1 is recovered.

In the above embodiment, water is used as the cleaning liquid, but a highly viscous liquid may be used as the cleaning liquid and the same effect can be obtained.

[Effects of the Invention] As described above, according to the present invention, due to the presence of the frictional force between the wafer surface and the liquid and the ultrasonic vibration to the wafer surface, steps on the wafer surface can be removed when removing foreign objects from the wafer. It is possible to prevent foreign matter from collecting in corners and grooves between steps, and to completely remove foreign matter.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a wafer foreign matter removing apparatus according to an embodiment of the present invention. FIG. 2 is an enlarged view of region H shown in FIG. FIGS. 3A and 3B are diagrams showing a conventional wafer foreign matter removal apparatus. FIG. 4 is an enlarged view of area (2) shown in FIG. 3A. In the figure, 1 is a silicon wafer, 10 is a container, 11 is a wafer surface, 12 is pure water, 13 is an ultrasonic vibrator, 21 is a holding member, and 23 is a rotating shaft. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

[Scope of Claims] A wafer foreign matter removal device for removing foreign matter from a wafer surface, comprising: a liquid storage section for storing a liquid for cleaning the wafer surface; an ultrasonic generator for applying ultrasonic vibrations to a liquid; holding the wafer with the surface to be cleaned facing downward so that the wafer surface can be ultrasonically cleaned by the liquid; A wafer foreign matter removing apparatus, comprising: a rotatable wafer holding member capable of rotating; and a rotational drive means for rotationally driving the wafer holding member.