JPH0487674U - - Google Patents
Info
- Publication number
- JPH0487674U JPH0487674U JP12960190U JP12960190U JPH0487674U JP H0487674 U JPH0487674 U JP H0487674U JP 12960190 U JP12960190 U JP 12960190U JP 12960190 U JP12960190 U JP 12960190U JP H0487674 U JPH0487674 U JP H0487674U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- back side
- main board
- adhesive
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 239000002356 single layer Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
- SYIRQWIOOCVBTC-UHFFFAOYSA-N pentyl pyridine-3-carboxylate Chemical compound CCCCCOC(=O)C1=CC=CN=C1 SYIRQWIOOCVBTC-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案によるプリント基板の一実施例
を示す分解斜視図、第２図は第１図の実施例に置
ける補助基板の部分拡大断面図である。
１０……プリント基板、１１……主基板、１１
ａ……導電層、１２……補助基板、１２ａ……絶
縁層、１２ｂ……導電層。
FIG. 1 is an exploded perspective view showing an embodiment of a printed circuit board according to the present invention, and FIG. 2 is a partially enlarged sectional view of an auxiliary board in the embodiment of FIG. 10...Printed circuit board, 11...Main board, 11
a... Conductive layer, 12... Auxiliary substrate, 12a... Insulating layer, 12b... Conductive layer.
Claims (1)
を備えた単層の主基板と、該主基板の裏面に対し
て順次着脱可能に接着、粘着等により装着され得
るようにした該主基板側の絶縁層及び該絶縁層の
裏面に備えられた導電層とを含む単層の補助基板
とから成り、適宜の枚数の補助基板を前記主基板
に対して装着することにより、複数層の導電層を
含む多層基板を構成し得るようにした、プリント
基板。 A single-layer main board made of an insulating material and having a conductive layer on the back side, and a main board side that can be detachably attached to the back side of the main board by adhesive, adhesive, etc. It consists of a single-layer auxiliary substrate that includes an insulating layer and a conductive layer provided on the back side of the insulating layer, and by attaching an appropriate number of auxiliary substrates to the main substrate, multiple conductive layers can be formed. A printed circuit board capable of configuring a multilayer board including:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12960190U JPH0487674U (en) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12960190U JPH0487674U (en) | 1990-11-30 | 1990-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0487674U true JPH0487674U (en) | 1992-07-30 |
Family
ID=31876996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12960190U Pending JPH0487674U (en) | 1990-11-30 | 1990-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0487674U (en) |
-
1990
- 1990-11-30 JP JP12960190U patent/JPH0487674U/ja active Pending