JPH03197668A - Evaporating source and evaporating device formed by using this source - Google Patents

Abstract

PURPOSE:To prevent the sticking of the granular matter of a material for vapor deposition on a film forming surface and to rapidly supply the material for vapor deposition by parting an evaporating source body and a covering body, fixing the same to respectively separate electrodes and allowing the movement of the positional relation between both. CONSTITUTION:A cover 21 (the covering body) is constituted by providing a perforated part 25 bored with many small holes 27 in nearly the central part of a flat plate covering part 23 and forming rising vane parts 29 on both side parts and cover vane parts 31 at both ends. A boat 11 (evaporating source body) which is provided with a box-shaped housing part 31 opened on the upper side in nearly the central part and is successively provided with planar boat vane pieces 15 at both ends is formed. The boat 11 is fixed respectively to a 2nd electrode 45 and a 1st electrode 41a in such a manner that the boat is positioned apart this cover 21 below the cover. SiO2 particles 61 are housed into the housing part 13 and are heated and evaporated by energizing the electrodes 45, 41a, by which the film is formed. The sticking of the granular matter to the film surface by the splashes of the SiO2 particles is prevented in this way and the supply of the SiO2 particles 61 is rapidly executed by moving only the boat 11 via a turret base 47.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an evaporation source that prevents the occurrence of splash and an evaporation device using the same.

With sublimable materials such as SiO, when they are placed in an evaporation source and heated and evaporated, Si0 particles scatter from the evaporation source and adhere to the film, impairing the quality of the film. There was a problem with putting it away. Furthermore, in an extreme case, almost all of the Si0 particles scatter from the evaporation source, making it no longer possible to continue the evaporation.

Therefore, in order to prevent such splash,
Using a boat body with a storage section for iO and a perforated lid plate with many small holes, the boat body is filled with granular SiO, and the perforated lid is tightly placed on top of the boat body, collinear with the electrode. It was vacuum-deposited using a resistance heating method. In this way, SiO evaporates from the small holes in the lid, while Si0 particles cannot pass through the small holes and splash is prevented.

However, when the SiO in the boat evaporated and disappeared, it was necessary to loosen the electrode bolts and remove the perforated cover plate. Therefore, in a continuous vapor deposition apparatus, it is difficult to supply supplementary Si0 particles to the boat, which has been a major obstacle to continuous deposition. Further, even in the patch type vapor deposition apparatus, it is troublesome to replenish and fill the boat with Si0 particles.

However, the present invention effectively prevents splashing even when using vapor deposition materials such as SiO that are prone to splashing.
The present invention provides an evaporation source and an evaporation device that allow easy supply or filling of O.

The evaporation source of the present invention has an open storage section for the evaporation material,
The evaporation source body has an evaporation source body to which the first heat source is attached, and a porous part that is arranged apart from the evaporation source body so as to cover the housing part of the evaporation source body, and is separate from the first heat source. and a covering to which a second heating source of the body is attached.

In addition to the evaporation source main body and the covering, the evaporation device of the present invention also includes the following: in addition to the above-mentioned evaporation source main body and the covering, at least one of the evaporation source main body and the covering is moved until the positional relationship is such that the covering does not cover the storage section of the evaporation source main body. , further comprising a transfer member for returning the two to their original positional relationship, and a supply member for supplying the vapor deposition material to the storage portion of the evaporation source main body in a state where the storage portion is not covered with the covering member. shall be.

Figure 1A is a plan view showing an embodiment of the cover 21 (covering body) of the present invention, and Figure 1B is a side view thereof.

The cover 21 is composed of a plate-like body as a whole,
The plate-like covering part 23 has a porous part 25 substantially in the center thereof, in which a large number of small holes 27 (through holes) are bored.

Both sides of the covering portion 23 are slightly bent to form rising wing portions 29.
is formed. Further, both ends rise upward and are bent again to be approximately horizontal with the covering portion 23 to form the cover wing piece 31.
is formed. Note that the rising wing portions 29 on both sides are for providing strength, and the rising edges at both ends toward the cover wing piece 31 are for convenience of attachment to the electrode near the boat 11. (See FIG. 4), these may be omitted and a simple flat plate may be used.

FIG. 2A is a plan view showing an embodiment of the boat 11 (evaporation source main body) of the present invention, and FIG. 2B is a side view thereof. boat 1
1 has a box-shaped storage section 13 with an open upper side in the center of the wing, and plate-shaped boat wing pieces 15 are connected to both sides. As seen in FIG. 2B, the storage portion 13 is formed so as to be lifted up by the boat wing pieces 15 on both sides, in order to fix the boat 11 to the electrode as close as possible to the cover 21. Yes (see Figure 4).

FIG. 3 is a plan view showing the structure of the evaporation source attached to the electrode and an embodiment of the evaporation device according to the present invention, and FIG. 4 is a sectional view taken along the line A--A. The turret stand 47, which has a substantially cross-shaped recess in the center, is equipped with four boats.
, llb, llc, and lid are fixed by a pair of first electrodes 41a, 41b, 41c, and 41d (heat source), respectively. The electrodes 41a to 41d are insulated and attached to a turret stand 47 via an insulator 43. This turret stand 47 is rotatably attached to a bottom hole (not shown) of the vacuum evaporation apparatus. On the other hand, the boat
A cover 21 is placed above the boat lla and slightly spaced apart from the boat lla. The cover 21 is fixed to a pair of second electrodes 45 (heating source).
5 is insulated and fixed at the bottom of the vacuum deposition apparatus. Furthermore, a supply pipe 57 of the SiO supply member 51 is located above the boat llb.

During vapor deposition, the first electrode 41a is placed on a boat lla made of tungsten, molybdenum, or the like.

A current is passed through 41a, and SiO particles 61 are heated by resistance heating.
Heat and evaporate. Similarly, a second electrode 45 is attached to the cover 21 made of tungsten, molybdenum, or the like.
．． A current is applied from 45 to resistance heating. The SiO evaporated from the boat lla flows through the small holes 27 of the porous portion 25 of the cover 21.
It scatters from the substrate and adheres to the substrate to form a thin film. cover 21
If the temperature is set higher than the evaporation temperature of SiO,
Good evaporation properties can be obtained.

Even if the SiO particles 61 are splashed for some reason and are about to fly away from the storage section 13 of the boat lla, they are blocked by the cover 21 and fall downward, thereby preventing the particles caused by the splash from adhering to the film surface. Also, the boat l
Since the accommodating part 13 of la and the porous part 25 of the cover 21 are close to each other, most of the Si0 particles ejected from the accommodating part 13 due to the splash can return to the accommodating part 13 again and be used for vapor deposition. From this point of view, it is desirable that the storage section 13 of the boat 11 and the porous section 25 of the cover 21 be placed as close as possible.

After the vapor deposition is completed, turn the turret table 47 1/4 turn to the right,
In Figure 3, bring the vapor-deposited boat to the position where boat llb is located. Next, the storage tank 53 of the SiO supply member 51 is opened, and the boat llb is passed through the supply gutter 53 and the supply pipe 57.
A fixed amount of SiO particles 61 is fed into the storage section 13 of. Since the cover 21 is not present on the boat storage section 13 at the position of the boat llb, the SiO particles 61 can be supplied using a conventional quantitative feeding device with a simple mechanism.

Therefore, without breaking the vacuum of the vacuum evaporation apparatus, the turret table can be rotated 1/4 at a time to continue evaporation, and thin films can be continuously formed on the substrate.

In the above explanation, by fixing the cover and moving the boat, the cover covers the upper part of the boat storage area during evaporation, and the boat storage area is exposed when Si0 particles are supplied. , the boat may be fixed and the cover may be moved.

Furthermore, when incorporating the evaporation source of the present invention into a batch-type device, the transfer mechanism and supply mechanism shown in FIGS. 3 and 4 are not necessary, and a structure that allows the cover to be moved from the boat can be adopted. This makes it possible to easily replenish the boat with Si0 particles without loosening the bolts on the electrodes and removing the lid as in the past.

According to the evaporation source of the present invention, by fixing the evaporation source body and the covering body separately and making the positional relationship between them movable, evaporation of evaporation materials that tend to cause splash, such as SiO, is reduced. In some cases, it is possible to prevent particulate matter from adhering to the film surface due to splash, and moreover, the vapor deposition material can be quickly supplied. Furthermore, by combining the evaporation source transfer mechanism and the evaporation material supply mechanism, an evaporation device suitable for incorporation into a continuous evaporation device can be realized.

[Brief explanation of drawings]

FIG. 1A is a plan view showing a cover used in the present invention, and FIG. 1B is a side view thereof. FIG. 2A is a plan view showing a boat used in the present invention, and FIG. 2B is a side view thereof. FIG. 3 is a plan view showing the evaporation source and evaporation device of the present invention;
FIG. 4 is a sectional view taken along the line A-A. 11, lla, l'lb, llc, 11d = boat 1
3...Storage section 15...Boat wing piece 21.
...Cover 23...Coating part 25...Porous part 27 River small hole 29...Rising wing part 3
1... Cover wing pieces 41a, 41b, 41ct41cl
...First electrode 43...Insulator 45...
Second electrode 47...turret stand 51...Si
O supply member 53... Storage tank 55... Supply gutter 57... Supply pipe 61... Si○ particles Figure 1A Figure 2A Figure 3 Figure 4

Claims (3)

[Claims] 1. An evaporation source main body having an open evaporation material storage part and to which a first heating source is attached, and a porous part provided apart from the evaporation source main body and covering the evaporation source main body storage part. 1. An evaporation source comprising: a covering body to which a second heating source separate from the first heating source is attached. 2. An evaporation source main body having an open evaporation material storage part and to which a first heating source is attached, and a porous part provided apart from the evaporation source main body and covering the evaporation source main body storage part. the evaporation source main body and the covering body to which a second heat source separate from the first heat source is attached, and the evaporation source main body and the covering body until the positional relationship is such that the covering body does not cover the housing part of the evaporation source main body. A transfer member that moves at least one side and returns the two to their original positional relationship, and a supply member that supplies vapor deposition material to the storage area of the evaporation source main body while the storage area is not covered with the covering. An evaporation device characterized by: 3. The evaporation device according to claim 2, wherein the transfer member transfers the evaporation source body.