JPH0320435U - - Google Patents
Info
- Publication number
- JPH0320435U JPH0320435U JP8030789U JP8030789U JPH0320435U JP H0320435 U JPH0320435 U JP H0320435U JP 8030789 U JP8030789 U JP 8030789U JP 8030789 U JP8030789 U JP 8030789U JP H0320435 U JPH0320435 U JP H0320435U
- Authority
- JP
- Japan
- Prior art keywords
- furnace
- heating furnace
- core tube
- transport mechanism
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000007723 transport mechanism Effects 0.000 claims 2
- 238000009529 body temperature measurement Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第１図は本考案の一実施例に用いるソフトラン
デイングフオークの斜視図、第２図は従来の半導
体基板熱処理装置の断面図である。
１……加熱炉、２……炉心管、３……シリコン
ウエハ、４……ソフトランデイングフオーク、７
……セツトボート、９……熱電対、１０……制御
ＣＰＵ。
FIG. 1 is a perspective view of a soft landing fork used in an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional semiconductor substrate heat treatment apparatus. 1...Heating furnace, 2...Furnace core tube, 3...Silicon wafer, 4...Soft landing fork, 7
...Set boat, 9...Thermocouple, 10...Control CPU.
Claims (1)
炉芯管に半導体基板を入れ出しするための搬送機
構を備えたものにおいて、搬送機構の半導体基板
支持部材付近に炉外の加熱炉入力制御装置に接続
される温度測定端子を備えたことを特徴とする熱
処理装置。 In a heating furnace, a furnace core tube surrounded by the heating furnace, and a transport mechanism for loading and unloading semiconductor substrates into the furnace core tube, a heating furnace input control outside the furnace is installed near the semiconductor substrate support member of the transport mechanism. A heat treatment device comprising a temperature measurement terminal connected to the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8030789U JPH0320435U (en) | 1989-07-07 | 1989-07-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8030789U JPH0320435U (en) | 1989-07-07 | 1989-07-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320435U true JPH0320435U (en) | 1991-02-28 |
Family
ID=31625248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8030789U Pending JPH0320435U (en) | 1989-07-07 | 1989-07-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320435U (en) |
-
1989
- 1989-07-07 JP JP8030789U patent/JPH0320435U/ja active Pending
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