JPH0320440U - - Google Patents
Info
- Publication number
- JPH0320440U JPH0320440U JP7935389U JP7935389U JPH0320440U JP H0320440 U JPH0320440 U JP H0320440U JP 7935389 U JP7935389 U JP 7935389U JP 7935389 U JP7935389 U JP 7935389U JP H0320440 U JPH0320440 U JP H0320440U
- Authority
- JP
- Japan
- Prior art keywords
- ring
- push
- bar
- sheet
- compression spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第１図および第２図はこの考案の一実施例によ
る自動エキスパンド装置を示す断面側面図、第３
図はこの考案の他の実施例による自動エキスパン
ド装置の断面側面図、第４図は従来の自動エキス
パンド装置を示す断面側面図である。
図において、１……粘着シート、２……ウエハ
、３……ウエハリング、４……エキスパンドリン
グ、５……押し上げ板、６……受けリング、７…
…シート押えリング、８……押し上げ棒、９……
圧縮バネ、１０……引張バネである。なお、図中
、同一符号は同一、または相当部分を示す。
1 and 2 are cross-sectional side views showing an automatic expanding device according to an embodiment of this invention;
The figure is a cross-sectional side view of an automatic expanding device according to another embodiment of the present invention, and FIG. 4 is a cross-sectional side view showing a conventional automatic expanding device. In the figure, 1... adhesive sheet, 2... wafer, 3... wafer ring, 4... expand ring, 5... push-up plate, 6... receiving ring, 7...
... Sheet holding ring, 8 ... Push-up bar, 9 ...
Compression spring, 10... tension spring. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
、ダイシングされたウエハを引き伸ばすエキスパ
ンドリングと、ウエハリングの粘着シードを押し
つけるシート押えリングと、シート押えリングを
押し上げる押し上げ棒と、押し上げ棒に垂直上方
への力を与える圧縮バネと、圧縮バネとエキスパ
ンドリングを押し上げる押し上げ板と、これらを
上方で受ける受けリングとを備えた自動エキスパ
ンド装置。 An expander ring that stretches the diced wafer after being pasted on the adhesive sheet, a sheet presser ring that presses the adhesive seed on the wafer ring, a push-up bar that pushes up the sheet-pressure ring, and a push-up bar that moves vertically upward to the push-up bar. An automatic expanding device comprising a compression spring that applies force, a push-up plate that pushes up the compression spring and expand ring, and a receiving ring that receives them above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7935389U JPH0320440U (en) | 1989-07-04 | 1989-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7935389U JPH0320440U (en) | 1989-07-04 | 1989-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320440U true JPH0320440U (en) | 1991-02-28 |
Family
ID=31623437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7935389U Pending JPH0320440U (en) | 1989-07-04 | 1989-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320440U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012182342A (en) * | 2011-03-02 | 2012-09-20 | Fuji Electric Co Ltd | Expand device and expand processing method of semiconductor substrate |
-
1989
- 1989-07-04 JP JP7935389U patent/JPH0320440U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012182342A (en) * | 2011-03-02 | 2012-09-20 | Fuji Electric Co Ltd | Expand device and expand processing method of semiconductor substrate |
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