JPH0320975A - Hybrid ic connecting terminal - Google Patents

Abstract

PURPOSE:To facilitate the direct mounting into a package and automatic assembly by flattening the bottom face of a connecting device provided on a substrate formed with a hybrid IC, and making it leadless. CONSTITUTION:The first conductor 3A, a dielectric substance 4, the second conductor 3B, a resistor 4 and a protector 6 are formed on a ceramic substrate 2 by thick-film printing to constitute a pattern circuit. Electronic components are fitted on the thick-film-printed substrate formed with the pattern circuit to form a hybrid IC, which is installed into a package, the bottom face of a hybrid IC connecting terminal 1 is flattened against the installation pad of the package, thereby direct surface mounting is allowed. The connecting terminal 1 is made leadless, automatic assembly and high-density mounting can be realized, the package side is not damaged, thus the reliability of electric connection can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid IC connection terminal, and particularly to a hybrid IC connection terminal that realizes planar mounting of a package. [Prior Art] Conventionally, a clip terminal having a discrete type lead has generally been used as a connection terminal for mounting a package of this type of hybrid IC. FIG. 3 is a longitudinal cross-sectional view of a hybrid IC having discrete tie clip terminals for explaining an example of such a conventional technique.

As shown in FIG. 3, the conventional hybrid IC has a first conductor 3A formed by thick film printing on a ceramic substrate 2, and a dielectric 4 formed for a capacitor on the first conductor 3A.
, a thick film printed second conductor 3 formed on the dielectric 4
A resistor 5 is formed by B or thick film printing, and a protector 6 such as a protective film is coated thereon. The ceramic substrate 2 on which such a hybrid IC is formed also includes pads 7 for electrical connection to other substrates.
A clip terminal 9 having a discrete type lead for mounting the package on another board is connected to the pad 7. In short, conventional hybrid IC connection terminals are generally of a type having leads.

[Problem to be solved by the invention]

The conventional hybrid IC connection terminals mentioned above are discrete-type connection terminals, so when assembling them into a package, the discrete-type connection terminals may be deformed or otherwise distorted when inserted into the through-hole of the package, making it difficult to mount. There are disadvantages in that automation is difficult, and problems such as electrical connection failure due to bending and decreased productivity occur.

An object of the present invention is to provide a connection terminal for a hybrid IC that enables direct mounting and automatic integration into such a package, and improves reliability of electrical connection and productivity.

[Means to solve the problem]

The hybrid IC connection terminal of the present invention is a hybrid IC connection terminal according to the present invention.
In the hybrid IC connection terminal for package mounting the hybrid IC, the bottom surface of the connection means provided on the substrate on which the hybrid IC is formed is flattened and leadless.

[Example] Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a longitudinal sectional view of a hybrid IC having connection terminals formed by thick film printing to explain a first embodiment of the present invention.

As shown in FIG. 1, the hybrid I in this embodiment
Similarly to the conventional example described above, the first conductor 3A, dielectric material 4. A second conductor 3B, a resistor 5, and a protector 6 are formed to constitute a pattern circuit. In this example, electronic components are mounted on a thick film printed circuit board on which this pattern circuit is formed, and a hybrid IC is created.
This is then mounted on a package, but by flattening the bottom surface of the hybrid IC connection terminal l to the mounting pad of the package, direct planar mounting is possible. Therefore, the connection terminal 1 of this embodiment is leadless, which enables automation of assembly and high-density mounting, and also improves the reliability of electrical connection because the package side is not damaged.

FIG. 2 is a longitudinal sectional view of a hybrid IC having connection terminals using clip terminals for explaining a second embodiment of the present invention.

As shown in FIG. 2, the hybrid I in this embodiment
The pattern circuit formation of C is the same as that described in the conventional example and the first embodiment. In this embodiment, the package is mounted using a flat mount type clip terminal 8 for connecting the pads 7 formed on the front and back surfaces of the ceramic substrate 2, and the bottom surface of the clip terminal 8 is flattened. . Therefore, it can be leadless, automation during assembly is possible, and it is possible to mount the package simultaneously with other planar mount components. Another advantage is that a hybrid IC can be mounted in a single soldering process.

[Invention and effect]

As explained above, the hybrid IC connection terminal of the present invention does not provide a connection lead to the package, and by flattening the bottom surface of the pad or clip terminal as a connection means, the component mounting pad on the package side can be used as a flat mount type. Since it can be changed to a mounting pad, direct mounting on the package and automation during assembly are easy, and soldering can be done in the same way as other mounted electronic components, improving productivity and making electrical connections. This has the effect of improving the reliability of the system.

[Brief explanation of drawings]

FIG. 1 is a vertical cross-sectional view of a hybrid IC having connection terminals formed by thick film printing for explaining the first embodiment of the present invention, and FIG. 2 is a clip for explaining the second embodiment of the present invention. FIG. 3 is a vertical cross-sectional view of a hybrid IC having connection terminals using discrete clip terminals, for explaining a conventional example.

Claims (1)

[Claims] A hybrid IC connection terminal for packaging a hybrid IC, characterized in that a bottom surface of a connection means provided on a substrate on which the hybrid IC is formed is flattened and leadless.