JPH03211765A - Semiconductor integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor integrated circuit device suitable for application to, for example, a B1CMOS analog-digital mixed integrated circuit device in which bipolar elements and CMO3 elements are mixed.

[Summary of the invention]

The present invention is a B1CMOS analog-digital mixer in which bipolar elements and CMO5 elements coexist, for example! ! Regarding a semiconductor integrated circuit device suitable for application to an integrated circuit device, in a semiconductor integrated circuit device having a plurality of signal processing circuits and a test line, there is a connection between the output side of each of the plurality of signal processing circuits and the test line. A test switch is provided between each of the signal processing circuits, and by controlling each test switch to test the characteristics of each of the plurality of signal processing circuits, it is possible to test the characteristics of each of the plurality of signal processing circuits. Since the characteristics of each of the plurality of signal processing circuits provided can be tested, test design becomes easy.

[Prior Art] Generally, a single semiconductor integrated circuit device is provided with signal processing circuits constituting an extremely large number of functional blocks, and the circuit configuration of electronic equipment is extremely miniaturized.

[Problems to be Solved by the Invention] Such semiconductor integrated circuit devices have a limited number of terminals, and conventionally, due to the small number of terminals, it was not possible to test the analog circuit by dividing it into necessary functional blocks, and test design was difficult. was difficult.

The present invention aims to facilitate test design in view of the above points.

[Means to solve the problem]

The semiconductor integrated circuit device of the present invention is a semiconductor integrated circuit device (11) having a plurality of signal processing circuits (la), (Ib)... and a test line (3) as shown in FIG. Processing circuit (la) (lb)...
Test switches (4a) (4b)... are provided between the output side of each of the test lines (3) and the test switches (4a) (4b)...
・This plurality of signal processing circuits (la) (lb
)... is designed to test the characteristics of each of them.

[Operation] According to the present invention, a plurality of signal processing circuits (la) (lb)
Test switches (4a) (4b) provided between each output side of ... and the test line (3)...
Test line (3) by turning on one after another.
Multiple measurement signals allow multiple signal processing circuits (LA)
It is possible to know the characteristics of each of (lb)...

[Embodiment] An embodiment of the semiconductor integrated circuit device of the present invention will be described below with reference to the drawings.

In FIG. 1, (1) shows the semiconductor integrated circuit device according to this example as a whole, and (la) (lb) (lc)
(ld) and (Ie) respectively indicate analog signal processing circuits made of bipolar transistors, ie, linear circuits such as operational amplifier circuits, and in this example, the linear circuits (la) (
Ib) and (1c) are connected in series, linear circuits (1d) and (le) are connected in series, and the input terminal (
The input signal from 5a) is supplied to the linear circuit (la), and the human input signal from the input terminal (5b) is supplied to the linear circuit (1d). In addition, the output side of this linear circuit (lc) is connected to other circuits such as an AND circuit, and the output side of the linear circuit (1e) is connected to an output terminal (5
c) Connect to. Further, (5d), (5e), and (5f) are also terminals of the semiconductor integrated circuit device (1), and are connected to a capacitor, a resistor, a power supply, etc. as necessary.

In this example, the test line (2) consists of lotus lines.
and (3), and this test line (2) and (3)
One end of each is connected to test terminals (2a) and (3a), respectively, which constitute the terminals of the semiconductor integrated circuit device (1).

In addition, the test terminal (2d) is supplied with a measurement signal from the measurement signal generator (6), and the test terminal (3d) is supplied with a measurement signal from the measurement signal generator (6).
The measurement signal from a) is supplied to the measuring device (7). In addition, in this example, the test line (2) for human power is connected to the input end of the linear circuit (1a) via the connection switch (8a), and the test line (2) for input is connected to the input end of the linear circuit (1a) via the connection switch (8b). ) through the linear circuit (1
Connect to the input side of d). In addition, in this example, linear circuits (la) (lb) (lc) (ld) and (1e
) connect the respective output sides of the switch (4a) (4b
) (4c) Connect to the output test line (3) via (4d) and (4e).

In this example, these connection switches (8a) (8b)
(4a)<4b) (4c) (4d) and (4e) are each controlled by a control signal from a test switch control logic circuit (9) composed of a MOS transistor or the like provided in this semiconductor integrated circuit device (]). Control on/off.

Since this example is configured as described above, the linear circuits (la) (lb) (lc) (l
d) and (le) are tested as follows. That is, when testing the linear circuit (1a), turn on the connection switches (8a) and (4a), and turn on the other connection switches (8b) (4b) (4c) (4d) (4
e) is off. At this time, the semiconductor integrated circuit device (1
) is supplied to the linear circuit (la) via the test terminal (2a), the test line (2) and the connection switch (8a), and this linear The measurement signal that has passed through the circuit (1a) is supplied to the measuring device (7) provided outside the semiconductor integrated circuit device (1) via the connection switch (4a), the test line (3), and the test terminal (3a). and this linear circuit (
The properties of 1a) can be tested. Next time when testing the linear circuit (lb), use the connection switch (8a).
and (4b), and turn on the other connection switches (8b
) (4a) (4c) (4d) (4e) are turned off.

At this time, the measurement signal that has passed through the above-mentioned linear circuit (1a) is supplied to the linear circuit (1b), and this linear circuit (
lb) is supplied to the measuring device (7) via the connection switch (4b), the test line (3) and the test terminal (3a), and the measurement result is obtained. In this case, since the characteristics of the linear circuit (1a) at the previous stage are known, the characteristics of this linear circuit (lb) can be found from the measurement results, and the characteristics of this linear circuit (lb) can be tested. When testing a linear circuit (IC), turn on the connection switches (8a) and (4C) in the same manner as above, and turn on the other connection switches (8b) (4a) (4b).
)(4d) The characteristics of this linear circuit (lc) can be tested in the same manner as described above by turning off (4e).

When testing the linear circuit (ld), turn on the connection switches (8b) and (4d), and turn on the other connection switches (8a) (4a) (4b) (4c) (4
e) is turned off. At this time, the measurement signal is sent from the measurement signal generator (6) to the test terminal (2a) and the test line (2).
and the linear circuit (ld) via the connection switch (8b)
The measurement signal passed through this linear circuit (1d) is supplied to the measuring instrument (7) via the connection switch (4d), the test line (3) and the test terminal (3a), ) characteristics can be tested. Also, when testing the linear circuit (1e), turn on the connection switches (8b) and (4e), and turn on the other connection switches (8a) (4a) (4b) (4c) (4
d) is turned off. In this case, the above linear circuit (ld
) is supplied to this linear circuit (1e), and the measurement signal that has passed through this linear circuit (le) is measured via the connection switch (4e), the test line (3) and the test terminal (3a). This measurement result is obtained by supplying the sample to a device (7). In this case, since the characteristics of the previous stage linear circuit (1d) are known, the characteristics of this linear circuit (1e) can be found from this measurement result, and this linear circuit (1e)
characteristics can be tested.

Therefore, according to this example, if provided in one semiconductor integrated circuit device (1), a plurality of, for example, five linear circuits (la) (
Since the characteristics of lb), (lc), fd, and (le) can be tested by simply providing the test terminals (2a) and (3a), there is an advantage that test design is easy.

In addition, test lines (2) (3) consisting of the lotus lines mentioned above.
) can also be used as a data line for testing digital circuits.

FIG. 2 also shows another embodiment of the invention. This figure 2 shows the test line (2) for inputting the measurement signal in the example in figure 1.
), test terminal (2a) and connection switch (8a)
(8b) is omitted, and the measurement signal from the measurement signal generator (6) is passed through the input terminal (5a) to the linear circuit (
la). To explain this example in Fig. 2, parts corresponding to those in Fig. 1 are given the same reference numerals.
A detailed explanation thereof will be omitted.

In the example shown in FIG. 2, analog signal processing circuits such as bipolar transistors, i.e., linear circuits (la), (lb), and (IC) such as operational amplifier circuits are connected in series, and the input signal from the input terminal (5a) is connected in series. A linear circuit (la
) is provided (in this example, a test line (3) consisting of )\sline is provided, and this test line (
3) is connected to the test terminal (3a), and the measurement signal from the test terminal (3a) is supplied to the measuring device (7). In addition, the output sides of the linear circuits (la) (lb) and (1c) are connected to the respective connection switches (4a) (
Test line (3) for output via (4b) and (4c)
).

In this example, linear circuits (la) (lb) and (IC
), a measurement signal from a measurement signal generator (6) is supplied to the input terminal (5a). When testing this linear circuit (1a), use the connection switch (4a)
) and turn on the other connection switches (4b) (4c
) is turned off. At this time, the measurement signal from the measurement signal generator (6) is input to the linear circuit (l) from the input terminal (5a).
a), and the measurement signal passed through this linear circuit (la) is supplied to the measuring instrument (7) via the connection switch (4a), the test line (3) and the test terminal (3a),
The characteristics of this linear circuit (la) can be tested. When testing the linear circuit (lb), turn on the connection switch (4b) and turn on the other connection switches (4b).
a) Turn off (4c). At this time, the measurement signal that has passed through the linear circuit (1a) is supplied to the linear circuit (1b), and the measurement signal that has passed through this linear circuit (1b) is sent to the connection switch (4b), the test line (3), and the test terminal. (3a) is supplied to the measuring device (7), and this measurement result is obtained. In this case, the front linear circuit (1a)
Since the characteristics of this linear circuit (1b) are known, the characteristics of this linear circuit (1b) can be determined from this measurement result.
) characteristics can be tested. Also, a linear circuit (
lc), the connection switch (4c) is turned on, the other connection switches (4a) (4h) are turned off, and the characteristics of this linear circuit (1c) can be tested in the same manner as described above.

It is easy to understand that the same effect as the example in FIG. 1 can be obtained in the example shown in FIG. In the example shown in FIG. 2, since there is only one test line (3), there is an advantage that the configuration is simpler and more compact than the example shown in FIG.

It goes without saying that the present invention is not limited to the above-described embodiments, and that various other configurations can be adopted without departing from the gist of the present invention.

(Effects of the Invention) According to the present invention, a plurality of signal processing circuits (la) (lb)... provided in one semiconductor integrated circuit device (1)...
By sequentially turning on the test switches (4a), (4b), etc. provided between the output side of each of These plural signal processing circuits (la) (I
b) It is possible to test the characteristics of each of these multiple signal processing circuits (la), (lb), etc. without externally connecting the terminals according to the number of signal processing circuits (la), (lb), etc. Since the characteristics of each of the processing circuits (la), (lb), etc. can be tested, there is an advantage that test design becomes easy.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing one embodiment of the semiconductor integrated circuit device of the present invention, and FIG. 2 is a block diagram showing another embodiment of the present invention. (1) is a semiconductor integrated circuit device, (Ia) (Ib) (
lc) (ld) and (1e) are linear circuits, (2
) and (3) are the test lines, (2a) and (3a
) are test terminals, (4a) (4b) (4c) (
4d) and (4e) are connection switches, (5a) and (5b) are input terminals, (6) is a measurement signal generator, (
7) is a measuring device, and (9) is a test switch control logic circuit. Agent Hidemori Matsukuma

Claims (1)

[Claims] In a semiconductor integrated circuit device having a plurality of signal processing circuits and a test line, a test switch is provided between the output side of each of the plurality of signal processing circuits and the test line, and A semiconductor integrated circuit device characterized in that characteristics of each of the plurality of signal processing circuits are tested by controlling each test switch.