JPH03211850A - Device and method for inspecting semiconductor device - Google Patents

Abstract

PURPOSE:To realize a semiconductor device inspecting method which does not use any socket and handler contact by providing a positioning means and pressing means which brings the external lead of a device to be measured into contact with the first conductive foil section. CONSTITUTION:A printed board 2 in which the first conductive foil section 2a is connected with the second conductive foil section 2a through a through hole 2b is prepared and a positioning means 3 provided with a hole which is formed to surround a device 1 to be measured is provided on the first conductive foil 2a side of the board 2. After the device 1 is loosely put on the means 3, the device 1 is fixed by means of a pressing means 8 which brings the external lead 1a of the device 1 into contact with the first conductive foil section 2a and the electric properties of the device 1 are inspected. Accordingly, insertion and removal of the device 1 into and from this inspection device become easier and peripheral parts can be arranged on the conductive foil 2a of the board 2 at distances shorter than that to the lead 1a of the device 1. Therefore, the device to be measured can be placed directly and brought into contact on and with the inspection device and can be measured stably for high-frequency characteristics without using any socket and contact.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an inspection apparatus and inspection method for measuring the electrical characteristics of a completed semiconductor device.

Toward the development of conventional communication technology and the development of advanced information-oriented new media, we are expanding the range from the VHF band to the U
Recent developments in the use of high frequency signals in the HF band are remarkable. Inspection of semiconductor devices is also required to guarantee quality in a frequency band of IGH2 or higher.

FIGS. 2(a) and 2(b) are sectional views of main parts of a conventional inspection apparatus, which is used for inspection of up to several hundred MH2, depending on the application of the semiconductor device. The following will explain based on FIG. 2(a). 2 is a printed circuit board provided on the main body of the inspection device. A conductive cap 21 is inserted into a through hole 2b provided in the printed circuit board 2 and connected to the conductive foil 2a with solder 5. As shown in detail in FIG. 2(b), this cap 21 includes a cylindrical cap body 21a having an opening at the top, and is press-fitted into the interior of the cylindrical cap body 21a, with a portion extending outward from the opening of the cap body 21a. The spring member 2 is pulled out and further bent so that its tip follows the outer surface of the cap body 21a.
1b, and the tip of this bent spring member is inserted into the through hole 2b of the printed circuit board 2 together with the center part of the cap body 21a, and in this state, the cap 21 is attached to the conductive foil 2a by the solder 5. It is fixed.

The through holes 2b are formed in the printed circuit board 2 in a staggered pattern, and therefore the caps 21 are also arranged in a staggered pattern. Then, the terminals 13 in the shape of a thousand and one legs provided in the socket 12 are press-fitted into each cap 21 in a detachable manner. In the above example, the conductive foil 2a is formed on both sides of the printed circuit board 2 (only one side is shown in FIG. 2).

In the above configuration, as shown in FIG. 2, a semiconductor device (hereinafter referred to as a device) 1 is placed in the socket 12,
When the lid 12c is closed, the external lead 1a of the device 1 comes into contact with the upper end of the terminal 13.

In this state, a measurement signal is applied from the measuring device to the external lead 1a of the device 1 via the conductive foil 2a, the solder 5, the cap 21, and the terminal 13.
1. By extracting the output signal via the solder 5 and the conductive foil 2a, the electrical characteristics of the device 1 can be measured.

When replacing the socket 12, pull out the terminal 13 of the socket 12 from the cap 21, and then replace the socket 12 with a new one.
Simply insert the terminal 13 into the cap 21. Therefore, the socket 12 can be replaced in one go. Furthermore, the directions of the resistor 15 and capacitor 16 will not shift when replacing the socket (also, the measurement accuracy of high frequency characteristics will not change, and furthermore, the conductive foil 2a will not peel off).

Problems to be Solved by the Invention In general, in the testing of semiconductor devices, components such as a testing device (measuring instrument), a handler, and a socket or contact that is interposed in both of them and directly contacts the device under test are required. However, both sockets and contacts have to be replaced due to wear and tear after being inspected tens of thousands of times, resulting in loss of time for reinstallation work, removal of the wiring between the sockets and contacts, and the printed circuit board. Changes in the measured values of the device's high frequency characteristics due to removal and reinstallation of peripheral parts of the device are unavoidable. In order to solve these problems, in the conventional example, a conductive cap is attached to the through hole of the printed circuit board, and the terminal of the socket is detachably press-fitted into the cap. However, in tests that handle frequencies of several hundred MH2 to IGH2 or higher, even the extended length of the socket lead and the cap that holds it cannot be considered as a mere connection wire at high frequencies. . Therefore, it is naturally best to test an ideal device by soldering it directly to the printed circuit board in the same way as it is mounted on an actual set of printed circuit boards. The loss of melting the solder and directly inserting and removing it onto the printed circuit board is enormous. Furthermore, there is a possibility that the device will be destroyed due to the heat generated by the solder, which is unrealistic. The present invention solves the above problems and provides an inspection device and an inspection method that do not use sockets or handler contacts.

Means for Solving the Problems The present invention provides a printed circuit board in which a first conductive foil portion and a second conductive foil portion are connected through holes, and a printed circuit board is provided on the first conductive foil portion side of the printed circuit board. A positioning means having a hole formed so as to surround the measuring device is provided, the device under test is loosely fitted onto the positioning means, and then an external lead of the device under test and the first conductive foil portion are brought into contact with each other. This is an apparatus and method for fixing with a pressing means and testing electrical characteristics.

Function: By doing so, it is easy to insert and remove the device in the inspection apparatus/\, and peripheral components can be placed on the printed circuit board conductive foil at a closer distance from the device leads. According to this, there is no need for a socket, it is possible to connect the device lead to the inspection equipment in the shortest possible distance, and the conductive foil portion of the printed circuit board on the bottom of the device can also be effectively used as a ground (GND) line, etc. It becomes possible to measure more stable high frequency characteristics.

Embodiment An embodiment of the present invention will be described based on the main part sectional view of FIG. Reference numeral 2 designates a printed circuit board provided in the main body of the inspection apparatus, in which a conductive board 752a is provided that independently corresponds to each lead 1a of the package of the device under test 1, and a through hole 2b is provided.
It is connected to the conductive foil 2a on the lower surface of the printed circuit board 2. The conductive foil 2a on the upper surface of the printed circuit board is for mounting the lead 1a of the device under test on the printed circuit board 2, and the conductive foil 2a on the lower surface of the printed circuit board is electrically connected to the conductive foil 22 on the upper surface. This is for applying a measurement input signal, bias, etc. from an inspection device to one lead 1a of the device 1, and extracting an output result from the other lead 1a of the device 1. Further, peripheral circuit components for measuring the functional characteristics of the device 1, such as a chip resistor 6 and a chip capacitor 7, are connected thereto.

On the upper surface of the printed circuit board 2, the lower conductive foil portion of the device 1 and the lower conductive foil portion of the printed circuit board 2 on the opposite side can be effectively utilized, and the chip resistor 6 and the chip capacitor 7, which are peripheral circuit components, can be installed. Grounding (GND)
) line, etc., making it more advantageous for stable high-frequency characteristic measurement and inspection of devices. To hold the device 1 on the printed circuit board 2, an insulating substrate 4, which serves as a means for positioning the device 1 and has a rectangular through hole 3 surrounding the package lead with a dimension that leaves a margin for the outer periphery of the package lead, is placed on the printed circuit board 2. and insert the device 1 into the through hole 3 of the insulating substrate 4 so as to fit it loosely,
The conductive foil 2a corresponding to each lead 1a of the package on the printed circuit board 2 is brought into contact with the conductive foil 2a.

Further, in order to improve the adhesion between the package lead 1a and the conductive foil 2a, the package 1 is pushed down from above by a pressing means 8 made of semi-solid insulating rubber 8a or the like. Therefore, the device under test 1 can be easily inserted into and removed from the printed circuit board on the inspection apparatus.

In addition, inserting the device 1 with the package surface facing up,
Since the product is taken out, the product name mark and pin number display on some of the devices can be constantly monitored, and there is no longer a risk of incorrectly inserting the measurement bottle due to the device being inserted after 18071 rotations. , it is also possible to prevent destruction of both the device and the inspection equipment.

Effects of the Invention According to the present invention, in measurement and inspection of high frequency devices,
Testing that allows stable high-frequency characteristics to be measured by placing and contacting the device under test directly onto the test equipment without using sockets or contacts, and making effective use of the space on both sides of the printed circuit board, which is the bottom surface of the device under test. The device and method can be realized.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a main part of a semiconductor device inspection apparatus according to an embodiment of the present invention, and FIGS. 2(b) and 2(b) are a sectional view of a main part and a partially enlarged sectional view of a conventional example. ■・・・Device under test (including package), 1
a...Package external lead part, 1b...
...package resin mold part, 2...printed circuit board of inspection device (not shown), 2a...
Conductive foil on the upper and lower surfaces of the printed circuit board, 2b...Through hole in the printed circuit board, 3...Through hole in the insulator board, 4... Insulator substrate of device package positioning means, 5... Solder, 6, 7... Resistor, capacitor, 8...
・Package pressing means, 12...Socket, 1
3...terminal, 21...cap.

Claims (2)

[Claims] (1) In order to place the device under test on the top surface of the printed circuit board, a first conductive foil portion corresponding to the external lead of the device under test is connected to the first conductive foil portion through a through hole and is connected to the bottom surface of the printed circuit board. a second conductive foil portion formed on the printed circuit board; a positioning means having a hole formed on the top surface of the printed circuit board so as to surround the device under test; an external lead of the device under test; and the first conductive foil. 1. A semiconductor device inspection apparatus comprising: a pressing means for bringing the parts into contact with each other; (2) Prepare a printed circuit board in which a first conductive foil section and a second conductive foil section are connected through a through hole, and the first conductive foil section side of the printed circuit board has a structure surrounding the device under test. A positioning means having a hole formed therein is provided, the device under test is loosely fitted onto the positioning means, and then fixed by a pressing means that brings the external lead of the device under test into contact with the first conductive foil part. A method for testing a semiconductor device, the method comprising testing the electrical characteristics of a semiconductor device.