JPH03212944A - Apparatus and method for inspecting semiconductor device - Google Patents

Abstract

PURPOSE:To eliminate a need for the positioning means of a device under test and to stably measure a high-frequency characteristic by a method wherein, without using a socket and a contact, the device under test is inserted into a hole in a printed-circuit board of an inspection device with its back facing the board. CONSTITUTION:A conductive foil 2a formed on the surface of a printed-circuit board 2 is connected to a foil 2a which is used as pad parts by placing external leads 1a of a device 1 under test on the board 2. A foil 2a on the rear surface of the board 2 is made conductive to the foil 2a on the surface of the board 2. A measuring input signal, a bias and the like are applied to the individual leads 1a of the device 1 from an inspection apparatus. An output result from the leads 1a on the other side of the device 1 is taken out. At an actual inspection, the device 1 is inserted into a hole 3 in the board 2 with its back facing the board; it is placed in such a way that the leads 1a of the device 1 are hooked to the foil 2a at the pad parts on the surface of the board 2 by utilizing the rear of bent parts where the leads 1a of the device 1 are soldered to the board 2. A pressure is exerted on the leads 1a from the upper part by using a pressure means 8. Thereby, the positioning means of the device 1 is not required, and a high-frequency characteristic can be measured stably.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an inspection apparatus and inspection method for measuring the electrical characteristics of a completed semiconductor device.

In order to develop conventional technology communication technology and develop new media of advanced information technology, we are moving from the VHF band to the U.
The recent situation in the use of high frequency signals in the HF band is remarkable. Inspection of semiconductor devices is also required to guarantee quality in a frequency band of IGHz or higher.

Figures 2 (a) and (b) are a schematic sectional view and an enlarged sectional view of the same essential parts of a conventional inspection device, and are used for inspections up to approximately several hundred MHz, depending on the application of the semiconductor device. It is a device. This will be explained below based on FIG.

2 is a printed circuit board provided in the inspection device. A conductive cap 21 is inserted into a through hole 2b provided in the printed circuit board 2, and connected to the conductive foil 2a by solder 5. As shown in detail in FIG. 2(b), this cap 21 has a cylindrical cap body 21a with an opening at the top.
and a spring member 21b which is press-fitted into the inside, a part of which is pulled out from the opening of the cap body 21a, and whose tip is bent so as to follow the outer surface of the cap body 21a. The distal end portion of the spring member 21b is inserted into the through hole 2b of the printed circuit board 2 together with the center portion of the cap body 21a, and in this state the cap 21 is fixed to the conductive foil 2a with the solder 5.

The through holes 2b are formed in the printed circuit board 2 in a staggered manner, and therefore the caps 21 are also arranged in a staggered manner. A staggered terminal 13 provided on the socket 12 is press-fitted into each cap 21 in a detachable manner. In the above embodiment, the conductive foil 2a is formed on both sides of the printed circuit board 2 (only one side is shown in FIG. 2).

In the above configuration, as shown in FIG. 2, a semiconductor device (hereinafter referred to as a device) 1 is placed in the socket 12,
When the lid 12C is closed, the external lead 1a of the device 1 comes into contact with the upper end of the terminal 13.

In this state, conductive foil 2a, solder 5, cap 21. A measurement signal is applied to the external lead la of the device 1 via the terminal 13, and the other external leads la, cap 21 . Solder 5. By extracting the output signal through the conductive foil 2a, the electrical characteristics of the device 1 can be measured. When replacing the socket 12, the socket 12
Simply pull out the terminal 13 of the new socket 12 from the cap 21 and insert the terminal 13 of the new socket 12 into the cap 21. Therefore, the socket 12 can be replaced with one touch. Moreover, when replacing the socket, the resistance is 15. The direction of the capacitor 16 does not shift, the measurement accuracy of high frequency characteristics does not change, and the conductive foil 2a does not peel off.

Problems to be Solved by the Invention In general, semiconductor device testing consists of a testing device (measuring device), a handler, and sockets and contacts that are interposed in both and directly contact the device under test. However, both sockets and contacts had to be replaced due to wear and tear after being inspected tens of thousands of times.
The time loss associated with reinstallation work, and the socket,
Changes in the measured values of the device's high frequency characteristics are unavoidable due to removal of wiring between contacts and printed circuit boards, removal and reinstallation of device peripheral components, and the like.

In order to solve this problem, the conventional embodiments are configured such that a conductive cap is attached to the through hole of the printed circuit board, and the terminal of the socket is press-fitted into the cap in a detachable manner. However, in tests that handle frequencies of several hundred MHz to IGHz or higher, even the extended length of the socket lead and the cap that holds it has an impedance component that cannot be ignored at high frequencies, and it cannot be considered as a mere connection wire. There will be no. Therefore, it would be best to ideally test the device by soldering it directly to the printed circuit board in the same way as it is mounted on the printed circuit board of the actual set, but each time you test the device, the solder on the lead part of the device must be melted. Directly inserting and removing from a printed circuit board results in a large amount of loss.

Furthermore, there is a possibility that the device will be destroyed due to the heat generated by the solder, which is unrealistic. The present invention solves the above problems and provides an inspection device and an inspection method that do not use sockets or handler contacts.

Means for Solving the Problems The present invention provides a printed circuit board in which a first conductive foil section and a second conductive foil section are connected through a gas through hole, and the printed circuit board is provided with a circuit board so as to surround the device under test. providing a positioning means with a hole formed therein, loosely fitting the device under test into the hole facing backward, and then pressing the external lead of the device under test and the first conductive foil portion into contact with each other; This is an inspection apparatus and inspection method for a semiconductor device that is fixed with a means and inspects its electrical characteristics.

By doing so, it is easy to insert and take out the device into the inspection apparatus, and it is possible to arrange the components on the printed circuit board conductive foil at a closer distance from the device leads. In addition, this eliminates the need for a socket and allows connection from the device lead to the testing equipment at the shortest possible distance, making it possible to measure high-frequency characteristics more stably.

Embodiment FIGS. 1(a) and 1(b) are schematic cross-sectional views of an embodiment of the present invention.

The explanation will be based on a perspective view of main parts.

2 is a printed circuit board provided on the main body of the inspection device.

The printed circuit board 2 has external leads 1 larger than the resin-sealed portion 1b of the package of the device under test 1.
A hole (through hole) 3 of a size along the outer circumferential line of the package including up to the curved part of a is provided, and a pad portion corresponding to each external lead 1a of the package is provided on the top surface of this printed circuit board 2 using conductive foil 2a to make the through hole. It is electrically connected to the conductive foil 2a on the lower surface of the printed circuit board 2 through the hole conductor 2b.

The conductive foil 2a on the top surface of the printed circuit board is the device under test 1.
The external lead 1a is placed on the printed circuit board 2 and connected to the conductive foil 2a which becomes the pad part, and the conductive foil 2a on the lower surface of the printed circuit board 2 is connected to the printed circuit board 2.
It is electrically connected to the conductive foil 2 on the top surface, applies a measurement input signal, bias, etc. from the inspection device to each external lead 1a of the device under test 1, and extracts the output result from the other external lead 1 of the device under test 1. It is something. Also, device 1
Peripheral circuit components for measuring the functional characteristics of, e.g.
Chip resistance6. This is for connecting the chip capacitor 7. In actual testing, insert the package 1 of the device under test into the hole 3 of the printed circuit board with its back facing up, and use the back side of the curved part where the external lead portion 1a of the device package 1 to be tested is soldered to the printed circuit board. Since it is hooked onto and placed on the pad portion conductive foil 2a on the upper surface of the printed circuit board, no means for positioning the device under test 1 is required.

Furthermore, the package external lead 1a and the printed circuit board 2
In order to strengthen the adhesion of the conductive foil 2a on the upper surface, pressure is simultaneously applied from above to all the external leads 1a using a pressing means 8 made of, for example, semi-solid insulating rubber 8a. In this way, there is no intervening socket or contact between the device under test 1 and the printed circuit board 2 on the measurement head of the inspection equipment, and the device is almost the same as a set-mounted state, except that no soldering is performed. , it becomes possible to measure and inspect stable high-frequency characteristics of devices.

Effects of the Invention According to the present invention, in measurement and inspection of high frequency devices,
Device inspection equipment and inspection that can measure stable high-frequency characteristics without the need for device positioning means by inserting and mounting the device under test face-up into a hole on the inspection equipment printed circuit board without using sockets or contacts. method can be realized.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are a schematic sectional view and a perspective view of essential parts of a semiconductor device inspection apparatus according to an embodiment of the present invention, and FIGS. 2(a) and (b) are a schematic sectional view of a conventional example. , is an enlarged sectional view of the main part. 1...Device under test (including package), 1
a...Package external lead part, 1b...
...Package resin mold part, 2...Printed circuit board of inspection device (not shown), 2a...
Conductive foil on top and bottom of printed circuit board, 2b...Printed board (through-hole conductor), 3...Hole of printed board (positioning means), 5...Solder, 6 , 7... Resistor, capacitor, 8...
・Package pressing means, 12...Socket, 1
3...terminal, 21...cap.

Claims (2)

[Claims] (1) A first conductive foil portion provided on the top surface of the printed circuit board for contacting the external leads of the device under test, and a first conductive foil portion formed on the bottom surface of the printed circuit board and connected through-hole to the first conductive foil portion. Pressing to bring the first conductive foil section into contact with the second conductive foil section, a hole provided in the printed circuit board so as to arrange and surround the device under test, and an external lead of the device under test. 1. A semiconductor device inspection apparatus comprising: means. (2) A positioning means in which a printed circuit board is prepared in which a first conductive foil section and a second conductive foil section are connected through a gas through hole, and a hole is formed in the printed circuit board so as to surround the device under test. The device under test is loosely fitted into the hole facing backward, and then fixed with a pressing means that brings the external leads of the device under test into contact with the first conductive foil portion, and electrically A semiconductor device testing method characterized by testing characteristics.