JPH03212475A - Adhesive for metal foil-clad laminate - Google Patents
Adhesive for metal foil-clad laminateInfo
- Publication number
- JPH03212475A JPH03212475A JP896090A JP896090A JPH03212475A JP H03212475 A JPH03212475 A JP H03212475A JP 896090 A JP896090 A JP 896090A JP 896090 A JP896090 A JP 896090A JP H03212475 A JPH03212475 A JP H03212475A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- adhesive
- metal foil
- pts
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 14
- 239000002184 metal Substances 0.000 title claims abstract description 14
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 229920003180 amino resin Polymers 0.000 claims abstract description 12
- 239000011256 inorganic filler Substances 0.000 claims abstract description 11
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 11
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 9
- 239000011888 foil Substances 0.000 claims abstract description 8
- 239000011342 resin composition Substances 0.000 claims abstract description 8
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 5
- 239000004640 Melamine resin Substances 0.000 claims abstract description 4
- 229920006324 polyoxymethylene Polymers 0.000 claims abstract description 3
- 239000005010 epoxy-amino resin Substances 0.000 claims abstract 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 4
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims description 2
- 239000011354 acetal resin Substances 0.000 claims description 2
- 150000007974 melamines Chemical class 0.000 claims description 2
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 6
- 238000002156 mixing Methods 0.000 abstract description 6
- 239000000203 mixture Substances 0.000 abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000377 silicon dioxide Substances 0.000 abstract description 3
- 238000006116 polymerization reaction Methods 0.000 abstract description 2
- 229930182556 Polyacetal Natural products 0.000 abstract 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000005062 Polybutadiene Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229920002857 polybutadiene Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- -1 002 Chemical compound 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 239000004843 novolac epoxy resin Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 1
- 241000156978 Erebia Species 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は金属箔張り積層板を製造する際に、金属箔と積
層板を接着するのに用いる接着剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an adhesive used for bonding a metal foil and a laminate when manufacturing a metal foil-clad laminate.
民生用電子機器の小型化、高機能化が進み、それに用い
られる印刷配線板は、ますます高密度化する傾向にある
。これに伴い、印刷配線板に用いられる金属箔張り積層
板には高密度実装が可能であることが要求されている。2. Description of the Related Art Consumer electronic devices are becoming smaller and more sophisticated, and the printed wiring boards used therein are becoming increasingly dense. Accordingly, metal foil-clad laminates used for printed wiring boards are required to be capable of high-density mounting.
そのため、特に細線化された金属導体の引き剥がし強さ
や、実装時のはんだ耐熱性の向上が強く望まれている。Therefore, there is a strong desire to improve the peel strength of thin metal conductors and the solder heat resistance during mounting.
またテレビのように高電圧が印加されるものには、安全
性を確保する立場から、耐トラツキング性が要求される
ようになってきた。Furthermore, in order to ensure safety, devices such as televisions to which high voltage is applied have come to be required to have tracking resistance.
従来は、金属箔と積層板との接着には、引き剥がし強さ
、はんだ耐熱性に優れているポリビニルブチラール樹脂
とフェノール樹脂とからなる接着剤が主に使用されてき
た。Conventionally, adhesives made of polyvinyl butyral resin and phenol resin, which have excellent peel strength and soldering heat resistance, have been mainly used to bond metal foils and laminates.
しかし、このフェノール樹脂は炭化しやすいため、トラ
ック形成が容易であり、絶縁破壊の原因となっていた。However, since this phenol resin easily carbonizes, tracks are easily formed, causing dielectric breakdown.
その為、このフェノール樹脂に代わる材料として炭化し
にくいメラミン樹脂やエポキシ樹脂を用いることが特開
昭６２−１１６６８２号公報等で提案されている。確か
にメラミン樹脂やエポキシ樹脂を用いることで耐トラツ
キング性は向上するが、近年の高性能化の要求には応え
られない状況がしばしば見受けられる。Therefore, it has been proposed in Japanese Patent Application Laid-Open No. 116682/1982 to use melamine resin or epoxy resin, which are difficult to carbonize, as a material to replace the phenol resin. It is true that tracking resistance is improved by using melamine resins and epoxy resins, but it is often seen that they cannot meet the recent demands for higher performance.
本発明は、上記のことを考慮して耐トラツキング性を一
層向上させるような金属箔張り積層板用接着剤を提供す
ることを目的とする。In view of the above, an object of the present invention is to provide an adhesive for metal foil-clad laminates that further improves tracking resistance.
（課題を解決するための手段〕
本発明は、上記の目的に合致した金属箔張り積層板用接
着剤であって、ポリビニルアセタール樹脂、エポキシ樹
脂およびアミノ樹脂からなる樹脂組成物に無機充填剤を
添加することを特徴とする。(Means for Solving the Problems) The present invention is an adhesive for metal foil-clad laminates that meets the above-mentioned objectives, and which comprises adding an inorganic filler to a resin composition consisting of a polyvinyl acetal resin, an epoxy resin, and an amino resin. It is characterized by adding.
本発明において用いられるポリビニルアセクール樹脂と
しては、ポリビニルホルマール、ポリビニルブチラール
があり、特に比較的安価な有機溶剤であるアセトン、メ
チルチルケトン、メタノール、トルエンなどにン容解す
るポリビニルブチラールが好ましい。ポリビニルブチラ
ール樹脂のブチラール化度は、特に制限されないが、ブ
チラール化度６０〜７０％、重合度１５００〜２５００
のものが好ましい。具体的な樹脂としては、エスレック
ＢＸ−１、ＢＸ−２、ＢＸ−５５、ＢＸ−５、ＫＳ−５
（種水化学工業■製、商品名）、電化ブチラール４００
０．５０００−Ａ、６０００−Ｃ（電気化学工業■製、
商品名）などが挙げられる。The polyvinyl acecool resin used in the present invention includes polyvinyl formal and polyvinyl butyral, and polyvinyl butyral which is soluble in relatively inexpensive organic solvents such as acetone, methyl thyl ketone, methanol, and toluene is particularly preferred. The degree of butyralization of the polyvinyl butyral resin is not particularly limited, but the degree of butyralization is 60 to 70%, and the degree of polymerization is 1500 to 2500.
Preferably. Specific resins include S-LEC BX-1, BX-2, BX-55, BX-5, and KS-5.
(manufactured by Tanemizu Chemical Industry ■, product name), Denka Butyral 400
0.5000-A, 6000-C (manufactured by Denki Kagaku Kogyo ■,
product name), etc.
これらの樹脂は単独または２種以上混合して用いられる
。These resins may be used alone or in a mixture of two or more.
本発明に用いるエポキシ樹脂としては、フェノールノボ
ラック型エポキシ樹脂、タレゾールノボラック型エポキ
シ樹脂、レゾール型エポキシ樹脂、ビスフェノール型エ
ポキシ樹脂などのフェノール類のグリシジルエーテルで
あるエポキシ樹脂（フェノール型エポキシ樹脂）や脂環
式エポキシ樹脂エポキシ化ポリブタジェン、ハロゲン化
エポキシ樹脂、可とう性エポキシ樹脂、多官能エポキシ
樹脂などエポキシ樹脂であればどれでも用いることが出
来るが、フェノール型エポキシ樹脂、又はフェノール型
エポキシ樹脂と多官能エポキシ樹脂との混合物、あるい
はエポキシ化ポリブタジェンがはんだ耐熱性、接着力の
低下がなく好ましい。具体的なフェノール型エポキシ樹
脂として、エピコート−８１５，８２８，１００１，１
００２，１００４，１００７（油化シェルエポキシ社製
、商品名）などのビスフェノール型エポキシ樹脂、エピ
コート１５２．１５４（油化シェルエポキシ社製、商品
名）などのフェノールノボラック型エポキシ樹脂、エピ
コート１８０３６５（油化シェルエポキシ社製、商品名
）などのオルソクレゾールノボラック型エポキシ樹脂な
どがある。多官能エポキシ樹脂としては、ＴＥＰＩＣ（
日産化学■製、商品名）などが挙げられる。エポキシ化
ポリブタジェンとしては、ＢＦ−１０００（アデカアー
ガス社、商品名）、Ｒ−４５ＥＰＩ （出光石油化学社
、商品名）などが挙げられる。これらのエポキシ樹脂は
単独または２種以上混合して用いられる。Epoxy resins used in the present invention include epoxy resins (phenolic epoxy resins) that are glycidyl ethers of phenols, such as phenol novolac epoxy resins, talesol novolac epoxy resins, resol epoxy resins, and bisphenol epoxy resins. Any epoxy resin can be used, such as cyclic epoxy resin, epoxidized polybutadiene, halogenated epoxy resin, flexible epoxy resin, and polyfunctional epoxy resin, but phenolic epoxy resin or phenolic epoxy resin and polyfunctional epoxy resin can be used. A mixture with an epoxy resin or epoxidized polybutadiene is preferable because it does not reduce soldering heat resistance or adhesive strength. As a specific phenolic epoxy resin, Epicoat-815, 828, 1001, 1
Bisphenol type epoxy resins such as 002, 1004, 1007 (manufactured by Yuka Shell Epoxy Co., Ltd., trade name), phenol novolac type epoxy resins such as Epicote 152.154 (manufactured by Yuka Shell Epoxy Co., Ltd., trade name), Epicoat 180365 (trade name) There are orthocresol novolac type epoxy resins such as (trade name, manufactured by KaShell Epoxy Co., Ltd.). As a polyfunctional epoxy resin, TEPIC (
Examples include Nissan Chemical Co., Ltd. (product name). Examples of the epoxidized polybutadiene include BF-1000 (trade name, manufactured by Adeka Argus) and R-45EPI (trade name, manufactured by Idemitsu Petrochemical Co., Ltd.). These epoxy resins may be used alone or in a mixture of two or more.
本発明に用いるアミノ樹脂としては、メラミン樹脂やヘ
ンゾグアナミン樹脂及びこれらをアルキルエーテル化し
たアルキルエーテル化メラミン樹脂、アルキルエーテル
化ヘンゾグアナミン樹脂などがあり、アルキルエーテル
化メラミン樹脂が好ましく用いられる。具体的にはメチ
ル化メラミン樹脂のＭＷ−３０、ＭＳ−００１、ＭＸ−
００２、ＭＸ−７０５、混合エーテル化メラミン樹脂の
ＭＸ−４０８（いずれも三相ケミカル社製、商品名）な
どが挙げられる。Examples of the amino resin used in the present invention include melamine resins, henzoguanamine resins, alkyl etherified melamine resins obtained by alkyl etherification of these, and alkyl etherified henzoguanamine resins, and alkyl etherified melamine resins are preferably used. Specifically, methylated melamine resins MW-30, MS-001, MX-
002, MX-705, mixed etherified melamine resin MX-408 (all manufactured by Sanso Chemical Co., Ltd., trade names), and the like.
本発明に用いられる無機物の充填剤としては、水酸化ア
ルミニウム、ケイ酸ジルコニウム、シリカ、カオリンク
レー、タルク、アルミナ、雲母などがある。特にはんだ
耐熱性の低下が見られない水酸化アルミニウム、アルミ
ナ、シリカが好ましい。水酸化アルミニウムとしては、
ハイシライトＨ−１０、Ｈ−３０、Ｈ−４０（昭和電工
■製、商品名）＾１ｃｏａ Ｈｙｄｒａｔｅｄ Ａｌｕ
ｍｉｎａ（＾１ｃｏａ社、商品名）などがある。Inorganic fillers used in the present invention include aluminum hydroxide, zirconium silicate, silica, kaolin clay, talc, alumina, and mica. Particularly preferred are aluminum hydroxide, alumina, and silica, which do not cause a decrease in soldering heat resistance. As aluminum hydroxide,
Hysilite H-10, H-30, H-40 (manufactured by Showa Denko ■, product name) ^1coa Hydrated Alu
There are products such as mina (product name, manufactured by ^1coa).
以上の樹脂及び無機物の充填剤の混合比率は特に限定す
るものでないが、好ましくはポリアセクール樹脂１００
重量部に対してエーテル樹脂１０〜４０重量部、アミノ
樹脂３０〜１００重量部をう配合した樹脂組成物を作製
する。無機物の充填剤は、この樹脂組成物１００重量部
に対して３０〜２００重量部、好ましくは５０〜１００
重量部を配合して接着剤とする。The mixing ratio of the above resin and inorganic filler is not particularly limited, but preferably polyacecool resin 100%
A resin composition is prepared by blending 10 to 40 parts by weight of an ether resin and 30 to 100 parts by weight of an amino resin. The inorganic filler is used in an amount of 30 to 200 parts by weight, preferably 50 to 100 parts by weight, based on 100 parts by weight of this resin composition.
Parts by weight are blended to form an adhesive.
さらに、アミン樹脂の硬化剤を添加することは銅張り積
層板の特性向上になるので好ましい。Furthermore, it is preferable to add an amine resin curing agent because it improves the properties of the copper-clad laminate.
アミノ樹脂の硬化剤としては、Ｐ−）ルエンスルフォン
酸、酢酸、安息香酸などのカルボン酸、しゅう酸、イタ
コン酸などのジカルボン酸、イミドジスルフォン酸塩、
ニトリロスルフォン酸塩などが挙げられる。アミノ樹脂
の硬化剤の添加量はアミノ樹脂の固形分の０．０１〜５
％、特に０．１〜３％が好ましい。As curing agents for amino resins, carboxylic acids such as P-)luenesulfonic acid, acetic acid and benzoic acid, dicarboxylic acids such as oxalic acid and itaconic acid, imidodisulfonic acid salts,
Examples include nitrilosulfonate. The amount of curing agent added to the amino resin is 0.01 to 5 of the solid content of the amino resin.
%, especially 0.1 to 3%.
本発明の接着材料は、上記材料に必要に応して有機溶剤
を加え混合することにより得られる。有機溶剤としては
上記材料を溶解するものであればよく、特に限定するも
のでないが、接着剤塗布工程を考えるとメタノール、ア
セトン、トルエン、メチルエチルケトンのように比較的
安価で低沸点の溶剤を使用することが望ましい。The adhesive material of the present invention can be obtained by adding and mixing an organic solvent to the above-mentioned materials, if necessary. The organic solvent is not particularly limited as long as it can dissolve the above materials, but considering the adhesive application process, relatively inexpensive and low boiling point solvents such as methanol, acetone, toluene, and methyl ethyl ketone are used. This is desirable.
〔作用］
耐トランキング性の改良に効果のあるアミノ樹脂は、耐
トラツキング性の良好な無機充填剤と組合わせることに
より、より一層、耐トラツキング性が向上する。[Function] When the amino resin that is effective in improving trunking resistance is combined with an inorganic filler that has good tracking resistance, the tracking resistance is further improved.
（実施例〕
以下、本発明を実施例を基づいて詳細に説明するが、本
発明はこれに限定されるものではない。(Examples) Hereinafter, the present invention will be described in detail based on Examples, but the present invention is not limited thereto.
実施例１〜３、比較例１〜２
表１に示す樹脂配合で溶剤に均一に溶解させて金属箔張
り積層板用接着剤を得た。この接着剤をロールコータで
厚さ３５μｍのｗ４箔に塗布し乾燥硬化させて接着剤厚
み４０μｍの接着剤付銅箔を得た。この銅箔の接着剤側
にフェノール樹脂含浸基板８枚を重ねて積層体とし、ス
テンレス鏡板に挟んで１６０°Ｃ１１００ｋｇ／ｃｔｌ
で６０分間加熱加圧成形して銅張り積層板を得た。この
銅張り積層板の特性を表１に示す。Examples 1 to 3, Comparative Examples 1 to 2 The resin compositions shown in Table 1 were uniformly dissolved in a solvent to obtain adhesives for metal foil-clad laminates. This adhesive was applied to W4 foil with a thickness of 35 μm using a roll coater, and dried and cured to obtain an adhesive-coated copper foil with an adhesive thickness of 40 μm. Eight phenolic resin-impregnated substrates were stacked on the adhesive side of this copper foil to form a laminate, and sandwiched between stainless steel mirror plates at 160°C and 1100kg/ctl.
A copper-clad laminate was obtained by heat-pressing molding for 60 minutes. Table 1 shows the properties of this copper-clad laminate.
比較例には無機充填剤を添加しない接着剤を用いた場合
の特性を示す。The comparative example shows the characteristics when using an adhesive to which no inorganic filler is added.
表１
接着剤配合と銅張積層板の特性
＊１
ＩＥｃ法（Ｂ液）で接着剤面で測定した。印加電圧：６
００Ｖ実施例と比較例の耐トランキング性は表１で明白
なように本発明のものが優れていることを確認した。Table 1 Adhesive formulation and properties of copper-clad laminate *1 Measured on the adhesive surface using the IEc method (liquid B). Applied voltage: 6
As is clear from Table 1, it was confirmed that the trunking resistance of the 00V example and the comparative example is superior to that of the present invention.
本発明の金属張積層板用接着剤は、耐トラツキング性を
大幅に向上させることができ、その工業的価値は極めて
大である。The adhesive for metal-clad laminates of the present invention can significantly improve tracking resistance, and its industrial value is extremely large.
Claims (1)
て、ポリビニルアセタール樹脂、エポキシ樹脂、アミノ
樹脂からなる樹脂組成物に無機物の充填剤を添加するこ
とを特徴とする金属箔張り積層板用接着剤。 ２、アミノ樹脂がアルキル化メラミン樹脂である請求項
１記載の金属箔張り積層板用接着剤。 ３、無機物の充填剤が水酸化アルミニウムである請求項
１記載の金属箔張り積層板用接着剤。[Claims] 1. An adhesive used for bonding metal foil to a laminate, characterized in that an inorganic filler is added to a resin composition consisting of polyvinyl acetal resin, epoxy resin, and amino resin. Adhesive for metal foil laminates. 2. The adhesive for metal foil laminates according to claim 1, wherein the amino resin is an alkylated melamine resin. 3. The adhesive for metal foil laminates according to claim 1, wherein the inorganic filler is aluminum hydroxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP896090A JPH03212475A (en) | 1990-01-18 | 1990-01-18 | Adhesive for metal foil-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP896090A JPH03212475A (en) | 1990-01-18 | 1990-01-18 | Adhesive for metal foil-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03212475A true JPH03212475A (en) | 1991-09-18 |
Family
ID=11707240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP896090A Pending JPH03212475A (en) | 1990-01-18 | 1990-01-18 | Adhesive for metal foil-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03212475A (en) |
-
1990
- 1990-01-18 JP JP896090A patent/JPH03212475A/en active Pending
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