JPH03212811A - Jig for dry etching of magnetic head - Google Patents

Abstract

PURPOSE:To form protective films having a uniform film thickness on work pieces and jig surface by inserting the work pieces into the groove shape parts of the holding jig and regulating the clearances and steps between the work pieces and the holding jig. CONSTITUTION:The groove shapes are formed in the holding jig 1 and the clearances (b) and steps (a) of the work pieces 2 and the upper surface of the holding jig 1 are regulated. An org. resist or silicone resin is injected into the spaces between the walls of the work pieces 2 and the holding jig 1 and is impregnated therein. Namely, the relations between the clearances and the steps between the holding jig 1 and the work pieces 2 and the fluctuation in the thickness of the protective films are regulated within the prescribed range. The protective film is uniformly formed atop the work pieces and the holding jig in this way and the protective film is formed on the side faces of the work pieces.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a jig for machining a head block in a dry etching process of a thin film magnetic head.

[Conventional technology]

The conventional processing method for thin film magnetic heads is disclosed in Japanese Patent Application Laid-Open No. 60136.
As described in Publication No. 025, it is characterized in that a protective film is formed on the end face of the head slider to prevent etching.

[Problem to be solved by the invention]

The above conventional technology describes the formation of a protective film on the end face of the head slider, but it is also possible to form a protective film in the gap between the head slider and the slider, or between the head slider and its holding jig. No consideration was given to the formation of the head slider and the jig surface was etched.

The purpose of the present invention is to prevent etching of the head slider side surface and jig surface, and to form a protective film of uniform thickness on the head slider and jig surface. An object of the present invention is to provide a magnetic head and a magnetic disk device with excellent flying properties by improving the etching dimensional accuracy of a head slider.

[Means to solve the problem]

In order to achieve the above object, a groove shape is formed in a holding jig for a workpiece, and a gap and a step between the workpiece and the upper surface of the holding jig are defined.

In addition, an organic resist or a silicone resin is injected and impregnated between the walls of the workpiece and the holding jig.

Furthermore, a uniform etching-resistant protective film is formed by continuously connecting the workpiece and the holding jig as described above. By specifying the gap and level difference between the object and the holding jig,
The etching-resistant protective film can be formed continuously without cutting between the workpiece and the holding jig.

In addition, by injecting and impregnating organic resist or silicone resin into the gap between the workpiece and the holding jig, a protective film can be formed on the side surface of the workpiece. Etching of the element circuit can be prevented.

Furthermore, by uniformly coating the organic resist on the workpiece and the holding jig, the dimensional accuracy of etching the workpiece can be improved, and a protective film can also be formed on the holding jig. Therefore, by preventing etching of the holding jig, the shape and dimensions of the holding jig can be maintained, resulting in the effect that it can be used repeatedly.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 to 5. In FIG. 1, a workpiece 2 is inserted into a groove-shaped portion of a holding jig 1. When an organic protective film is applied to the upper surfaces of the workpiece 2 and the holding jig 1, the relationship between the gap between the holding jig 1 and the workpiece 2, and the difference in level and the film thickness variation of the protective film is determined by the second method. As shown in Fig. and Fig. 3. In order to make the protective film thickness uniform, for example, in order to keep the variation in film thickness within 10%, the gap between the workpiece 2 and the holding jig 1 should be set to 250 mm.
It is necessary to specify the level difference within 30 μm.
This regulation is effective in making the protective film uniform.

Next, this embodiment will be explained with reference to FIG. The workpiece 2 is inserted into the groove portion of the protection jig 1.

An organic resist or silicone resin 3 is injected into the gap between the protective jig 1 and the workpiece 2. According to this embodiment, since the filled organic resist or silicon resin 3 protects the side surfaces of the workpiece 2, it is possible to prevent the side surfaces of the workpiece 2 from being etched.

In addition, FIG. 5 shows the gap between the workpiece 2 and the holding jig 1,
A step is defined, a protective film is injected and filled into the gap, and an organic resist is evenly applied to the upper surfaces of the workpiece 2 and the holding jig 1.

Further, other embodiments will be explained with reference to FIGS. 6 and 7. When workpieces 2 of different thicknesses are inserted into the holding jig 1, the level difference becomes large. The holding jig l has a groove depth setting jig 5 built therein.

By moving this depth setting jig 5 up and down,
The height difference between the workpiece 2 and the holding jig 1 can be within the specified value of 30 μm. By adjusting the vertical position, the thickness of the protective film on the upper surfaces of the workpiece 2 and the holding jig 1 can be made uniform.

Furthermore, another embodiment will be explained with reference to FIG.

When inserting a workpiece 2 that is smaller than the width of the groove of the holding jig 1, the sheets 6 and 7 made of organic resist or silicone resin are inserted.
It is inserted into the groove portion according to the thickness of the workpiece 2. sheet 6
Even if the thickness of the workpiece 2 varies, the gap can be defined to be within 2501 tm, and the required thickness of the protective film can be made uniform.

Furthermore, one of the other embodiments will be explained with reference to FIG. The wall surface of the groove portion of the holding jig 1 has a porous portion 8 and a through hole 9 that communicates with the holding jig. When drying the resist or silicone resin by heating, when the solvent contained in the solution evaporates, it can be removed from the porous portion 8 and the through hole 9 to the outer periphery of the holding jig 1. It is possible to reduce the amount of particles that escape in the direction of the upper surface of the workpiece 2. Therefore, it is possible to reduce the occurrence of vaporization marks (foam) on the upper surface of the workpiece 2 due to the vaporization of the solvent, which is effective in making the thickness of the protective film on the upper surface uniform.

[Effects of the Invention] According to the present invention, the gap and step between the workpiece and the holding jig are defined, the gap is filled with a protective film, and the upper surfaces of the workpiece and the holding jig are uniformly coated. A protective film can be formed, and moreover, a protective film can be formed on the side surface of the workpiece. By forming the film as described above, etching of the side surface of the workpiece can be prevented, and the protective film of the workpiece can be made uniform, so that the dimensional accuracy of the etching of the workpiece can be improved.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view showing the holding state of a workpiece according to an embodiment of the present invention, and FIGS. 2 and 3 are characteristic diagrams showing the relationship between the holding conditions of the workpiece and variations in the protective film. Figure 4 is a cross-sectional view showing how the protective film is filled into the gap between the workpiece and the holding jig, and Figure 5 is a cross-sectional view showing how the protective film is formed on the upper surfaces of the workpiece and the holding jig □, □6 □51.24, Yu. □It is a sectional view showing the relationship between the workpiece and the holding jig. l...Holding jig 2...Workpiece 3...Organic resist or silicone resin 4...・・・Organic resist toy 1 figure penalty 2 figures size 5 disturbance (pm) Crotch L Cμm 4 figure ¥ J5 figure de ○ figure

Claims (4)

[Claims] 1. In the workpiece holding jig, when the workpiece is inserted into the jig groove-shaped portion and held,
A gap and a step difference between the workpiece and the holding jig are defined, and an organic resist, silicone resin, etc. is injected and filled into the gap between the workpiece and the holding jig, and the gap between the workpiece and the holding jig is filled. A jig for dry etching a magnetic head, characterized in that the fixed-term resist is uniformly applied on the workpiece and the holding jig. 2. 2. The jig for dry etching a magnetic head according to claim 1, further comprising a function of adjusting a step difference between the workpiece and the holding jig. 3. 2. A jig for dry etching a magnetic head according to claim 1, wherein a sheet made of the organic resist or the silicon resin is inserted into a gap between the workpiece and the holding jig. 4. 2. The jig for dry etching a magnetic head according to claim 1, wherein a through hole communicating with an outer circumferential surface of the holding jig is provided in a wall surface of a groove portion of the holding jig.