JPH03212989A - Double-sided patterned flexible circuit board and its connection body - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an insulating substrate made of ceramic or resin, a double-sided patterned flexible substrate to be connected by soldering, and a connection body thereof.

2. Description of the Related Art Conventionally, when a single-sided pattern flexible substrate is soldered to a connection terminal of an insulating substrate made of ceramic or resin, a configuration as shown in FIG. 3 is common. That is, as shown in FIG. 3, when a single-sided pattern flexible board having a front conductor 1 covered with a base board 3 and a front coverlay 5 is soldered to the insulating board via adhesives 2 and 6, respectively. After bending the ends of the flexible substrate and pasting the base substrate 3 together with double-sided tape 4, it was connected to the conductor electrode 8 of the insulating substrate 9 via the solder 7.

On the other hand, when connecting a conventional double-sided patterned flexible substrate to a connecting terminal such as an insulating substrate by soldering, a configuration as shown in FIG. 4 is common. That is, as shown in FIG. 4, the front conductor 1 covered with the base substrate 3 and the front coverlay 5 is connected to the base substrate 3 and the back side coverlay 11 through the adhesive 10 through the adhesives 2 and 6, respectively. When connecting a double-sided patterned flexible board having a covered backside conductor 12 to an insulating board 9 by soldering, the ends of the flexible board are bent and a backside cover lay 11 is bonded to the insulating board 9 using double-sided tape 4. It was connected to the conductor electrode 8 of No. 9 via solder 7.

Problems to be Solved by the Invention In this conventional structure, a flexible substrate with a single-sided pattern as shown in FIG.
In the case of a double-sided turn flexible substrate like the other conventional example shown in the figure, the total thickness of the flexible substrate is equal to
Therefore, the bending force (difficult) and the force (unable to make the soldered connection) were problematic.

The present invention solves these problems by bending a thick double-sided patterned flexible board (even if it is folded in the same configuration as a single-sided patterned flexible board), bonding it with double-sided tape, and then soldering it. The purpose is to

Means for Solving the Problems In order to solve this problem, the present invention removes the coverlay and adhesive of the package 1 from the folded portion of the double-sided/curved flexible circuit board, It has the same structure as a single-sided/cross-turn flexible circuit board.

Function: With this structure, bending of the double-sided pattern flexible substrate at the solder connection portion and soldering to the insulating substrate can be carried out with the same ease as with a single-sided pattern flexible substrate.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2. In the figure, 13 is an adhesive on the back side, 14 is a coverlay on the back side, and 15 is a conductor on the back side. In addition, the first
In FIGS. 3 and 2, parts that are equivalent to those in FIGS. 3 and 4 are given the same numbers, and their explanations are omitted.

Figure 1 shows a double-sided patterned flexible board before bending with the adhesive on the back side of the soldered connection part and the coverlay on the back side removed. When making a solder connection, this part is bent and the double-sided tape 4 is attached to the Heath board 3. Glue and fix.

FIG. 2 is a cross-sectional view of the connection body according to the present invention after the above-mentioned bonding operation has been performed, and the structure of the soldered connection portion is the same as that of the conventional example shown in FIG. 3.

Effects of the Invention According to the present invention, even in the case of a flexible board with a thick board and one side of the board, it is necessary to remove the adhesive on the back side of the soldered connection part and the cracks on the back side. The thickness of the board at the connection part is made smaller (the same thickness as the single-sided pattern 7 flexible board) to make it easier to bend, and the solderability (also in this case, the same thickness as the single-sided pattern flexible board) is obtained. It has the advantage of being able to

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view showing the solder (reverse side adhesive and back side cut-lay at the connection part) in an embodiment of the present invention, and Fig. 2 is a double-sided patterned flexible board with a bent solder plate. and a cross-sectional view showing the structure of its connection body,
FIG. 3 is a sectional view showing a soldered state of a conventional single-sided patterned flexible board, and FIG. 4 is a sectional view showing a state when a double-sided patterned flexible board is soldered as is. 7...Solder, 8...Conductor electrode of insulated substrate, 9...Insulated substrate, 13...Adhesive, 14...Cut (-Ray.

Claims (2)

[Claims] (1) A double-sided patterned flexible substrate with the coverlay and adhesive removed from the bent portion of one end. (2) A connected body of a double-sided patterned flexible substrate in which a conductive electrode of an insulating substrate is connected to the one end of the double-sided patterned flexible substrate from which the coverlay and adhesive at the bent portion of one end have been removed by soldering.