JPH03214637A - Integrated-circuit chip mounting film - Google Patents

Abstract

PURPOSE:To obtain an integrated-circuit chip mounting film which can simultaneously operate many LSI chips by a method wherein conductive materials, for test signal input use, which correspond to individual integrated circuit chips and conductive materials for power-supply use are connected in common. CONSTITUTION:Conductive materials 11 on a film 10 are formed so as to correspond to individual integrated circuit chips 12. Conductive materials 11', for test-signal input use, of the individual integrated circuit chips 12 and conductive materials 13 for power-supply use are connected in common. Consequently, a test signal and a power supply can be supplied, form the outside of the film 10, to the conductive materials for test-signal input use and the conductive materials for power-supply use which are common to all the integrated circuit chips 12 on the film 10. Thereby, all the integrated circuit chips 12 can be simultaneously operated in a state that they are mounted on the film 10; the film as a single body can be tested.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention is directed to a semiconductor integrated circuit in which a plurality of integrated circuit chips are mounted in the manufacturing stage of the semiconductor integrated circuit, and the integrated circuit chips are electrically connected to a conductive material on a film. The present invention relates to integrated circuit chip mounting films that are electrically connected to each other, and particularly relates to circuit connections of conductive materials on the film.

(Prior Art) As one method for mounting LSIs (Large Scale Integrated Circuits) with a large number of pins and high density, as shown in FIG. 2, conventionally, as shown in FIG. A pad (terminal) part of the LSI chip 22 is connected to a part (tip part) of the conductive pattern 21 by bonding, and a plurality of L
SI chips 22... are mounted on the film 20 at regular intervals.
ed Bonding) technology.

The LSI chip 2 mounted on the film 20 in this way
2... are packaged (sealed) with potting resin, transfer molding, etc., and then separated into individual integrated circuits.

However, the conventional conductive pattern 21 is
Since the patterns formed in correspondence with each other are independent of each other, all LSI chips 22 are operated simultaneously while mounted on the film 20 during a burn-in test, etc. In order to do this, a test signal input device such as an independent socket is required for each LSI chip 22, and the test device becomes large-scale. Therefore, it is possible to reduce the number of test signal input devices by dividing the film 20 into multiple pieces and connecting a socket etc. to each divided film, or to manufacture a dedicated test rack etc. according to the size of the film. However, the test equipment will still be large-scale.

(Problem to be solved by the invention) As mentioned above, the conventional integrated circuit chip mounting film
This requires a large number of test signal input devices to operate all the LSI chips simultaneously while mounted on the film, resulting in a problem that the test device becomes large-scale.

The present invention has been made to solve the above problems, and its purpose is to input test signals for simultaneously operating all LSI chips mounted on the film while they are still mounted on the film. The equipment can be extremely simplified, the test equipment can be simplified, and it can operate even when the film is wrapped, making it possible to operate a large number of LSI chips at the same time even in a relatively small space. The purpose of the present invention is to provide an integrated circuit chip-mounted film.

[Structure of the Invention] (Means for Solving the Problems) The present invention connects a pad portion of an integrated circuit chip to a part of the conductive material on a film formed with a conductive material, and connects a plurality of integrated circuit chips to the film. In the integrated circuit chip mounting film mounted above, the conductive material is formed in correspondence with each integrated circuit chip, and the conductive materials for test signal input and the conductive materials for power supply of each integrated circuit chip are formed in correspondence with each other. It is characterized by being commonly connected.

(Function) By supplying test signals and power from outside the film to the test signal input conductive material and the power supply conductive material that are common to all integrated circuit chips on the film, the This makes it possible to operate all integrated circuit chips simultaneously and test individual films.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIGS. 1(a) and 1(b) schematically show the layout of the front and back sides of the integrated circuit chip mounting film.

This integrated circuit chip mounting film, like the conventional example, connects the pad portion of the LSI chip 2 to a part of the conductive material 11 on the film 10 on which the conductive material 11 is formed, and
A plurality of LSI chips 12... are mounted on the film 10 at regular intervals, and the conductive material 11 is formed correspondingly to each LSI chip 12. The conductive materials for test signal input and the conductive materials for power supply of each of the five LSI chips 12 in the material 11 are commonly connected.

Here, as the conductive material 11, a conductive plate-like body (hereinafter referred to as conductive pattern 11) patterned by etching, for example, is used. And each LSI chip 1
A conductive pattern 11 for every 2 is formed on the surface of the film 10, and a common connection pattern 11' of the conductive pattern for test signal input and the conductive pattern for power supply is formed on the surface of the film 10.
Corresponding patterns on both sides of the film are connected to each other via through holes 13.

LSI chip 1 mounted on film 10 in this way
2... is packaged (sealed) with potting resin, transfer molding, etc. before or after the burn-in test, and after the burn-in test, includes a part of the conductive pattern 11 near the LSI chip 12 (the through-hole 13 area is ) area and separated as individual integrated circuits.

6 According to the integrated circuit chip mounting film of the above embodiment, the test signal input conductive material 11' and the power supply conductive material 11' common to all the LSI chips 12 on the film 10 are connected from the outside of the film. By supplying test signals and power to the film 10, it is possible to operate all the LSI chips 12 simultaneously while mounted on the film 10, and to test the film alone.

Therefore, the test signal input device can be extremely simplified and the test equipment can be simplified.Moreover, it is possible to operate even when the film 10 is wrapped, and a large number of LSI chips 12 and 12 can be connected even in a relatively narrow space. ...can be operated simultaneously.

Note that the patterned conductive plate-like body 11 in the above embodiments is not limited to etching, and may be formed by vapor deposition, pasting, etc., and the present invention can be applied even when a wire is used as the conductive material 11. Needless to say, it can be done.

Further, in the above embodiment, the common connection pattern 11' of the conductive material for test signal input and the conductive material for power supply is formed on the back surface of the film, but these may be formed on the surface or both sides of the film. .

[Effects of the Invention] As described above, according to the present invention, the test signal input device for simultaneously operating all the LSI chips mounted on the film while still being mounted on the film is extremely simplified. A film equipped with integrated circuit chips that can simplify test equipment, operate even when the film is wrapped, and allow multiple LSI chips to operate simultaneously even in a relatively small space. can be realized.

[Brief explanation of drawings]

1(a) and 1(b) are structural explanatory diagrams schematically showing the front and back side layouts of an embodiment of the integrated circuit chip-mounted film of the present invention, and FIG. 2 is a conventional integrated circuit chip-mounted film. FIG. 1 is a configuration explanatory diagram showing an example of a film. 10...Film, 11...Conductive material (conductive node)
) 1 1'...Common connection pattern for conductive material for test signal input and conductive material for power supply, 1 2...LS ■chip, 1 3...Through hole.

Claims (3)

[Claims] (1) In an integrated circuit chip mounting film in which a pad portion of an integrated circuit chip is connected to a part of the conductive material on a film formed with a conductive material, and a plurality of integrated circuit chips are mounted on the film, the conductive material is , an integrated circuit characterized in that it is formed corresponding to each integrated circuit chip, and that corresponding test signal input conductive materials and power supply conductive materials of each integrated circuit chip are commonly connected. Chip-loaded film. (2) The integrated circuit chip mounting film according to claim 1, wherein the conductive material is a patterned conductive plate-like body. (3) The integrated circuit chip mounting film according to claim 1 or 2, wherein the test signal input conductive material is formed on both or one side of the film.