JPH03215346A - Ceramic substrate - Google Patents
Ceramic substrateInfo
- Publication number
- JPH03215346A JPH03215346A JP2011461A JP1146190A JPH03215346A JP H03215346 A JPH03215346 A JP H03215346A JP 2011461 A JP2011461 A JP 2011461A JP 1146190 A JP1146190 A JP 1146190A JP H03215346 A JPH03215346 A JP H03215346A
- Authority
- JP
- Japan
- Prior art keywords
- aggregate
- ceramic substrate
- binder
- sorbitan monocaprylate
- badness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 17
- 239000000919 ceramic Substances 0.000 title claims abstract description 16
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 claims abstract description 9
- 239000011230 binding agent Substances 0.000 claims abstract description 8
- 238000002485 combustion reaction Methods 0.000 claims abstract description 6
- 238000010304 firing Methods 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 6
- 229920000609 methyl cellulose Polymers 0.000 abstract description 3
- 239000001923 methylcellulose Substances 0.000 abstract description 3
- 235000010981 methylcellulose Nutrition 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract 2
- 229910052727 yttrium Inorganic materials 0.000 abstract 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 abstract 1
- 239000002245 particle Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
Landscapes
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は各種電子素子の搭載基板等に用ｂられるセラミ
１ク基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a ceramic substrate used as a mounting substrate for various electronic devices.
従来、セラミ咋ク基板はアルミナ等の骨材に、メチルセ
ルローズ、水等のバインダーやタルク等の燃焼助剤を添
加、混合、混練％成形して得られる成形物を焼成して得
られるものであるが、緻密なセラミック基板とするため
、骨材粒径ｔ−１ミクロン以下にすることがあり、この
ため骨材粒子の凝集が激しく成形物表面に凹凸を発生し
，焼成藺乾燥に際して成形物端部にクラックを発生しな
り成形物の打抜加工時に衝激力で成形物内部にマイクロ
クラブクを発生する問題があった。Conventionally, ceramic substrates are obtained by adding, mixing, kneading, and molding a molded product to an aggregate such as alumina, a binder such as methyl cellulose, water, and a combustion aid such as talc. However, in order to make a dense ceramic substrate, the aggregate particle size is sometimes set to less than t-1 micron, which causes the aggregate particles to aggregate violently and cause unevenness on the surface of the molded product. There was a problem in that cracks were generated at the edges and microcracks were generated inside the molded product due to the impact force during punching of the molded product.
従来の技術で述べたようにセラミック基板の製造過程に
２いては不良が多発しゃす−。本発明は従来の技術に８
ける上述の間、題点に鑑みてなされたもので、その目的
とするところは、不良発生が減少するセラミ噌ク基板全
提供することにある。As described in the conventional technology section, defects occur frequently in the manufacturing process of ceramic substrates. The present invention has eight advantages over the conventional technology.
The above-mentioned invention has been made in view of the above problems, and its purpose is to provide a ceramic substrate with reduced occurrence of defects.
本発明は骨材、バインダー、燃焼助剤にソルビタンモノ
カプリレートを含有させた成形物を焼成してなることを
特徴とするセラミ９ク基板のため、配合物の分散性が著
るしく向上し、上紀目的を達成することができたもので
、以下本発明を詳細に説明する。The present invention is a ceramic substrate characterized by being made by firing a molded product containing sorbitan monocaprylate in aggregate, a binder, and a combustion aid, so that the dispersibility of the compound is significantly improved. This invention has been able to achieve the above objectives, and the present invention will be described in detail below.
本発明に用屠る骨材としては、アルミナ、窒化ケイ素、
窒化ボロン、マグネνア等のセラミ噌ク骨材全般を用い
ることができるが、好ましくはアルミナを用ｂることが
より分散性の点で効果があり望まし−ことである。バイ
ンダーとしては水、メチルセルロース、スターチ、アミ
ノ樹脂、フェノール樹脂、アクリル、酢酸ビニール、グ
リセリ・・ン、グリコール等のように液状、粉末状を問
わず用ｂられ、併用することもできる．燃焼助剤として
はタルク、カルシア、イ９トリウム等を用ｂることがで
き、特に限定するものではなー。ソルビタンモノカプリ
レートの添加量は骨材ｉｏｏ重量部（以下単に部と記す
）に対し２〜５部が好ましい。The aggregates used in the present invention include alumina, silicon nitride,
Although any ceramic aggregate such as boron nitride or magnetite can be used, it is preferable to use alumina because it is more effective in terms of dispersibility. As a binder, water, methyl cellulose, starch, amino resin, phenol resin, acrylic, vinyl acetate, glycerin, glycol, etc. can be used in either liquid or powder form, and they can also be used in combination. As the combustion aid, talc, calcia, i9thorium, etc. can be used, and there are no particular limitations. The amount of sorbitan monocaprylate added is preferably 2 to 5 parts per ioo parts by weight of the aggregate (hereinafter simply referred to as parts).
即ち２部未満では分散性が低下し、５部をこえるとセラ
ミヮクの緻密性が低下する幼向にあるからでアル。ソル
ビタンモノカプリレートはそのまま用ｂでもよいが，液
体バインダー中に予じめ分散させてから用偽ることが望
ましいことである。混合、混線、成形、焼成等について
は特に限定するものでなく、通常用いられるものをその
まま用ｂることができる。That is, if it is less than 2 parts, the dispersibility will decrease, and if it exceeds 5 parts, the compactness of the ceramic will decrease. Sorbitan monocaprylate may be used as it is, but it is preferable to disperse it in a liquid binder before use. There are no particular limitations on mixing, cross-wiring, molding, firing, etc., and commonly used ones can be used as they are.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
平均粒径２ミクロンのアルミナ１００部に対し、タルク
２部を加え混合後、粒度２５０メッシュのメチ）Ｌｔ
｛！ ／ｌ／ ａ−ス５部、ソルビタンモノカブリレー
ト３．５部を水δ部に分散させた液状バインダーを加え
混線後、厚さ１．１Ｍにシート化し、乾燥後、４００
Ｘ ４００ ！ＩＩに打抜ｂてグリーンシ一トを得た。Example 2 parts of talc were added to 100 parts of alumina with an average particle size of 2 microns, and after mixing, the mixture had a particle size of 250 mesh.
{! A liquid binder prepared by dispersing 5 parts of /l/a-su and 3.5 parts of sorbitan monofobrilate in δ parts of water was added, mixed, formed into a sheet with a thickness of 1.1M, and after drying, 400
X 400! I got a green seat by punching out II.
次に該グリーンシ一トをアルミナ製セ噌ター上にｌＯ枚
積層し１００℃膚間の昇温塞で１５７０℃迄昇温させ、
１５７０℃で３時間焼成後、降温しでセラミウク基板を
得た。Next, 10 sheets of the green sheets were stacked on an alumina setter, and the temperature was raised to 1570°C using a 100°C skin-to-skin heating plug.
After firing at 1570° C. for 3 hours, the temperature was lowered to obtain a ceramic substrate.
比較例
実施例のソルビタンモノ力プリレート全除去した以外は
実施例と同様に処理して七ラミック基板を得た。Comparative Example A seven ramic substrate was obtained in the same manner as in the example except that the sorbitan monoprelate in the example was completely removed.
実施例及び比較例のセラミック基板の性能は第１表のよ
うである。Table 1 shows the performance of the ceramic substrates of Examples and Comparative Examples.
本発明は上述した如く構成されてｈる。特許請求の範囲
に記載した構成を有するセラミック基板にお論では不曳
発生が低下する効果がある。The present invention is constructed as described above. The ceramic substrate having the structure described in the claims has the effect of reducing the occurrence of non-pulling.
Claims (1)
プリレートを含有させた成形物を焼成してなることを特
徴とするセラミック基板。(1) A ceramic substrate characterized by being made by firing a molded product containing sorbitan monocaprylate in aggregate, a binder, and a combustion aid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011461A JPH03215346A (en) | 1990-01-19 | 1990-01-19 | Ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011461A JPH03215346A (en) | 1990-01-19 | 1990-01-19 | Ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03215346A true JPH03215346A (en) | 1991-09-20 |
Family
ID=11778735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011461A Pending JPH03215346A (en) | 1990-01-19 | 1990-01-19 | Ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03215346A (en) |
-
1990
- 1990-01-19 JP JP2011461A patent/JPH03215346A/en active Pending
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