JPH03215956A - Method and apparatus for testing semiconductor device - Google Patents

Abstract

PURPOSE:To lessen a contact resistance, to improve a measurement in accuracy, and to make a Kelvin type measurement accurate by a method wherein an external lead is brought into contact with a first and a second contact terminal as pinched between them when a pressing means is made to press the first and the second contact terminal against a holding member. CONSTITUTION:When a first and a second contact terminal, 5a and 5b, are pressed against a holding member 4 by a presser 6, outer leads 7a are brought into contact with the contact terminals 5a and 5b as being pinched between them. The two contact terminals 5a and 5b are brought into contact with the outer leads of a measured semiconductor element 7 as mentioned above, whereby a contact can be made large in area. Furthermore, a force line 2 and a sense line 3 are separately provided extending from a semiconductor measuring device 1 to a part above the outer leads 7a of the semiconductor element 7 as an object of measurement. By this setup, a contact resistance can be lessened, a measurement can be made high in accuracy, and a Kelvin type measurement can be improved in accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor device testing apparatus and method for testing the functionality of a semiconductor device by bringing contact terminals into contact with the semiconductor device.

BACKGROUND ART Conventionally, in this type of semiconductor device testing equipment, one contact terminal is arranged in correspondence with each external lead of a semiconductor device to be measured, and the contact terminal is pressed from the outside of the contact terminal by a contact drive device. Accordingly, the function of the semiconductor element is tested by bringing the contact terminal into contact with the positioned external lead of the semiconductor element.

However, conventionally, in power transistors, diodes, silices, etc., the number of external leads is small and the distance between each external lead is large.2, so the sense line and force line are connected to individual contact terminals. However, since semiconductor devices using DIL (Dual In Line) packages have many external leads, it is difficult to use separate contact terminals for the sense line and force line. method was not adopted.

A conventional semiconductor device testing apparatus and method will be described below with reference to FIG.

FIG. 2 shows a contact terminal portion of a conventional semiconductor device testing device. In FIG. 2, 1 is a semiconductor measuring device, 2 is a force line, and 3 is a sense line, and a pair of force line 2 and sense line 3 constitute one terminal of the semiconductor measuring device. 4c is a contact holding device that holds the contact terminal and connects force line 2 and sense line 3; 5 is a semiconductor element for measuring force line 2 and sense line 3 that are connected by contact holding device 4c; 6 is a contact terminal/drive device that brings the contact terminal 5 into contact with the external lead of the semiconductor device to be measured, 7 is the semiconductor device to be measured, and 8 is the semiconductor device to be measured. This is the base of the holding socket 1 (handler).

A semiconductor testing method using the semiconductor device testing apparatus configured as described above will be described.

First, the contact drive device 6 is attached to the semiconductor element 7 to be measured positioned on the base 8 of the socket (Handler)
By the pressing operation, the contact terminals 5 are brought into contact with the external leads 7c of the semiconductor element 7. At this time, the external lead 7c of the semiconductor element 7 to be measured, the contact I/terminal 5, the sense line 3, and the force line 2 are electrically connected.
Electric signals can be exchanged between the semiconductor measuring device 1 and the semiconductor element 7 to be measured. This makes it possible to test the semiconductor device 7 to be measured.

Problems to be Solved by the Invention However, in the conventional configuration, the contact terminal 5 is in line contact with the external lead 7c of the semiconductor element 7 to be measured, so the contact resistance is large due to the small contact area. Therefore, high precision measurement becomes impossible. Furthermore, since it is difficult to bring two pairs of contact terminals 5 into contact with one pair of external leads of a semiconductor element, the force line 2 and the sense line 3 are combined using a contact holding device 4C. Since there is a certain distance from the device 4C to the external lead 7C of the semiconductor element 7 to be measured, there is a problem in that accurate Kelvin measurement cannot be realized.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a semiconductor device testing device and testing method that can reduce contact resistance, enable high-precision measurement, and realize accurate Kelvin measurement. do.

Means for Solving the Problem In order to solve this problem, the semiconductor device inspection apparatus of the present invention includes a holding member that holds a semiconductor device as an object to be measured;
First and second contact terminals are arranged on both sides of the external lead of the semiconductor element so as to be spaced apart from the external lead so that the external lead is sandwiched therebetween, and the first and second contact terminals are arranged on both sides of the external lead of the semiconductor element. A suppressing means for suppressing the holding member side is provided, and when the suppressing means presses the first and second contact terminals toward the holding member side, the external lead is pressed between the first and second contact terminals. The contact terminal is configured to be contacted by the first and second contact terminals while being held between the terminals.

Further, in the semiconductor device testing method of the present invention, a semiconductor device as an object to be measured is held in a holding member, and first and second contact terminals are connected to both sides of the external lead of the semiconductor device between the two terminals. The semiconductor element is electrically connected to a semiconductor measuring device through these first and second contact terminals so that the semiconductor element can be measured.

Effect: With this configuration, two contact terminals come into contact with the external leads of the semiconductor element to be measured, increasing the contact area of the contacts. Furthermore, since the force line and sense line can be placed separately from the semiconductor measurement device to the external lead of the semiconductor device to be measured, it is possible to place the force line and sense line separately from the semiconductor measuring device to the external lead of the semiconductor device to be measured. Expression measurement can be realized.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIG.

FIG. 1 shows an overall view of a semiconductor device testing apparatus according to an embodiment of the present invention. In FIG. 1, ] is a semiconductor measuring device, 2 is a force line, and 3 is a sense line, which are the same as the configuration of the conventional example shown in FIG. 4a is a contact holding device that connects force line 2 and sense line 3 to the contact terminal and holds the contact terminal; 5a is a force contact terminal connected to force line 2; and 5b is a sense contact terminal connected to sense line 3. , 6 is a contact drive device, 7
Reference numeral 8 indicates a semiconductor device as an object to be measured, and 8 is a pedestal of a socket l- (handler) that holds the semiconductor device to be measured. Contact terminals 5a and 5b are arranged apart from external lead 7a so that external lead 7a is sandwiched between them.

An inspection method using the semiconductor device inspection apparatus of this embodiment configured as described above will be described.

First, the semiconductor element 7, which is an object to be measured, is sent to the pedestal 8 of the Sonoru 1 (Handler) and positioned on the pedestal 8. Next, the contact driving device 6 presses the force contact terminal 5a from the outside toward the external lead 7a of the semiconductor element 7 to be measured. At this time, the force contact terminal 5a and the sense contact terminal 5b are brought into contact with the external lead 7a of the semiconductor element 7 to be measured so as to sandwich the external lead 7a between them. The semiconductor measuring device 1 is electrically connected.

Furthermore, since the tip of the sense contact terminal 5b is curved into a U-shape, this U-shaped portion acts as a spring and reduces the suppressing load on the external leads of the semiconductor element 7 to be measured. This increases the contact area of the sense contact terminal 5b with the external lead of the semiconductor element 7 to be measured.

As described above, according to this embodiment, since the force contact terminals 5a and the sense contact terminals 5b are provided individually, the area of contact with the external leads 7a of the semiconductor element 7 to be measured becomes large. It is possible to reduce resistance and enable highly accurate measurement. Furthermore, since the force line and the sense line are separated up to the external lead 7a of the semiconductor element 7 to be measured, the Kerkhin method is accurate even if a voltage drop occurs due to contact resistance between the lead and the force line. measurement can be realized.

In this embodiment, the force contact terminals 5a and the sense contact terminals 5b are arranged on the left and right sides of the leads of the semiconductor element 7 to be measured, but in cases where horizontal arrangement is difficult as in the case of a flat package, they may be arranged above and below. Needless to say, it's a good thing.

Effects of the Invention As described above, according to the present invention, since the force contact terminal and the sense contact terminal are each provided separately, an excellent semiconductor device testing apparatus and method capable of reducing contact resistance is provided. realizable.

[Brief explanation of drawings]

FIG. 1 is a configuration diagram showing a semiconductor device testing apparatus according to an embodiment of the present invention, and FIG. 2 is a configuration diagram showing a conventional semiconductor device testing device. 1... Semiconductor measuring device, 2... Force line, 3... Sense line, 4a...
...Contact holding device, 5a...Force contact terminal, 5b...Sense contact terminal, 6...Contact drive device, 7...
Semiconductor element to be measured, 7a... External lead of semiconductor element to be measured, 8... Base of socket (handler 1/ler).

Claims (2)

[Claims] (1) A holding member that holds a semiconductor element as an object to be measured, and first and second members arranged on both sides of an external lead of the semiconductor element so as to be spaced apart from the external lead so as to sandwich the external lead therebetween. and a pressing means for pressing the first and second contact terminals toward the holding member, and when the pressing means presses the first and second contact terminals toward the holding member. . A semiconductor device testing device, wherein the external lead is sandwiched between the first and second contact terminals and is brought into contact with the first and second contact terminals. (2) Holding the semiconductor element as the object to be measured on the holding member,
First and second contact terminals are brought into contact with both sides of the external lead of the semiconductor element so that the external lead is sandwiched between the two terminals, and the semiconductor element is connected to the semiconductor element through the first and second contact terminals. A method for testing a semiconductor device, the device being electrically connected to a semiconductor measuring device to measure the semiconductor device.