JPH03215968A - Semiconductor cooling device - Google Patents

Abstract

PURPOSE:To enable a cooling device to be improved in cooling power and easily assembled or disassembled and to surely trap a cooling fluid inside it by a method wherein a heat sink is fixed to a semiconductor device, a base which is long in an axial direction is provided to the heat sink, and the side face of the base is connected to a cooling fluid feed header with a an O-ring. CONSTITUTION:Heat released from a semiconductor device 3 is conducted to a heat sink 4 through the intermediary of a solder layer 5. The heat sink 4 is connected to a header 7 with a base 6 and an O-ring 9, and heat transferred to the heat sink 4 is removed by fluid which is made to flow into the heat sink 4 through a nozzle 10. The fluid flowing out of the heat sink 4 is made to flow into the lower jacket of the header 7 of a double structure and discharged outside of the header 7. The trapping of the cooling fluid is made through the O-ring 9 between the side face of the heat sink base 6 and the side of a header opening 8. By this setup, a cooling device of this design can be improved n cooling capacity and easily assembled or disassembled and a cooling fluid can surely be trapped.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to cooling equipment, and more particularly to a semiconductor cooling device suitable for cooling semiconductor chips or packages with high heat generation density.

[Conventional technology]

``LSI chips mounted in large numbers on multilayer wiring boards'' Second,
U has a structure in which a heat sink consisting of flat fins perpendicular to the chip surface is attached, and two bellows-shaped tubes with elliptical cross sections are attached to this for cooling fluid to flow in and out.
It is described in S P 4686606. In this prior art, the bellows is metallically fixed by solder or the like to the bottom surface of a header for supplying cooling fluid.

On the other hand, a structure in which the bellows is screwed onto the cooling water supply header using an O-ring is proposed, for example, in JP-A-61-7.
It is described in Publication No. 1650.

In addition, a structure in which a refrigerant reservoir is mounted on a semiconductor element and the tip of the refrigerant reservoir is brought into contact with a sealing material provided in a refrigerant supply header section to seal the refrigerant is disclosed in Japanese Patent Laid-Open No. 60-7225.
It is disclosed in Publication No. 2.

[Problem to be solved by the invention]

The above conventional technology has the following problems.

With the technology disclosed in USP 4,686,606, the thermal resistance between the fins and the cooling fluid can be made extremely small, so in order to take advantage of this cooling performance, the thermal resistance between the chip and the heat sink must be made sufficiently small. It is important to hold down. At present, the most promising method for keeping the thermal resistance between the chip and the heat sink low enough to match the cooling performance of the heat sink is to bond them metallically using solder or the like. In this conventional technology, the bellows attached to the heat sink is fixed to the cooling fluid supply header, so if this configuration is attempted, there will be two fixed points: between the header bellows and between the heat sink and the sink chip, making assembly and disassembly very difficult. The problem arises that it becomes difficult to Generally, this problem is extremely serious because a large number of LSIs mounted on a large board often require maintenance work.

Even in the conventional technology described in JP-A-60-71650, a method of metallically fixing the bellows and the semiconductor element is effective in reducing the contact thermal resistance between the bellows and the semiconductor element to a sufficiently small value. However, in this cooling technology, the bellows are screwed to the cooling water supply header using a circle ring, so this configuration makes assembly and disassembly extremely difficult.

3 The technique disclosed in JP-A-60-72252 is easy to assemble and disassemble, but because the tip of the refrigerant reservoir is sealed against the sealing material, the pressure required for sealing is not applied directly. , added to semiconductor devices. Semiconductor devices are often mounted on a substrate via tiny solder balls, and in this case, it is generally not possible to apply large pressure to the solder balls, so the pressure required to maintain sufficient seal reliability is limited. It is difficult to ensure that Also,
The pressure applied to the sealant varies slightly depending on the refrigerant reservoir attached to each semiconductor element, due to the warpage of the substrate and variations in the tilt and height of individual semiconductor elements.
Problems may also arise in terms of seal reliability.

An object of the present invention is to provide a cooling device for solving the problems of the prior art described above. That is, the object of the present invention is to provide a cooling device that improves cooling performance by directly fixing a heat sink to a semiconductor element, is easy to assemble and disassemble, and has reliable sealing of cooling fluid.

4 [Means for Solving the Problems] The above purpose is to provide a pipe with a certain length for introducing cooling fluid into a heat sink, and to connect this cap to an opening provided in a cooling fluid supply header. This is achieved by inserting the cap into the cap and sealing the side of the mouthpiece with an O-ring.

Furthermore, in order to improve the sealing performance, it is effective to use a double ring structure using two O-rings.

To reduce the stress applied to semiconductor devices, a bellows is installed in the opening of the cooling fluid supply header. Attach a cylindrical coupler with an O-ring on the cylindrical surface to the tip of this 9k#! - It is true.

[Effect]

A mouthpiece having a certain axial length provided on a pipe for introducing cooling fluid into the heat sink has a side surface that connects the cooling fluid to the O-ring provided in the opening of the cooling fluid supply header. act to provide the necessary and sufficient radial pressure to seal the
In the axial direction, it acts to form a sliding surface that easily slides on the contact surface with the O-ring. In addition, since the cap has a certain length in the axial direction, it can easily absorb dimensional errors such as warpage of the board on which the semiconductor element is mounted and variations in the mounting height. It is not affected by errors and always works to keep it constant. As a result, when assembling the cooling device, by simply inserting the mouthpiece into the opening of the cooling fluid supply header, it is possible to apply the necessary and sufficient uniform sealing pressure to the O-ring, and to protect the semiconductor element surface. It is possible to avoid applying excessive axial stress to the Therefore, the cold fluid can be reliably sealed without applying excessive stress to the individual semiconductor elements, and assembly work can be extremely facilitated. Furthermore, when disassembling the device, since the base portion is simply pulled out from the opening, the work can be done extremely easily without applying excessive stress to the semiconductor element.

Further, the bellows attached to the opening of the cooling fluid supply header has the effect of reducing in-plane stress applied to the semiconductor element.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2. A semiconductor element 34 is mounted on a multilayer wiring board 1 via minute solder poles 2. A heat sink 4 is fixed to the upper surface of the semiconductor element 3 with solder 5. heat sink 4
has a cap portion 6 having a certain length in the axial direction. A header 7 for supplying cooling fluid is attached to the wiring board 1, and an opening 8 is provided on the bottom surface of the header 7 at a position corresponding to the mounting position of each semi-sensor element 1. An O-ring 9 is provided. The header 7 has a double structure, and nozzles 10 extend individually from the upper jacket 1 toward the heat sink 4.

Next, the operation of this embodiment will be explained. The heat generated in the semiconductor element is transferred to the heat sink 4 via the solder layer 5. The heat sink 1 and the sink 4 are connected to the header 7 by a base 6 and a ring 9. The heat transferred to the heat sink is removed by the fluid flowing into the heat sink 4 through the nozzle 10. The fluid flowing out from the heat sink 4 flows into the lower jacket of the header having a double structure and is discharged to the outside of the header. A cooling fluid seal is formed by a ring 9 between the side surface of the heat sink metal part 6 and the side surface of the header opening 8. FIG. 2 is an enlarged view of the cap structure.

FIG. 3 shows a second embodiment of the invention. ○It has a double ring structure using two rings, increasing the seal reliability of the cooling fluid.

FIG. 4 shows a third embodiment of the present invention. The O-ring is provided on the base side of the heat sink, making it easy to attach the O-ring.

FIG. 5 shows a fourth embodiment of the present invention. A bellows 11 was attached to the opening 8, and a cylindrical coupler 12 with an O-ring provided on the cylindrical surface was provided at the tip of the bellows 11. This embodiment has the effect of reducing in-plane stress applied to the semiconductor element 4.

〔Effect of the invention〕

According to the present invention, the heat sink fixed to the semiconductor element is provided on the heat sink, and the cooling fluid is sealed with an O-ring on the side surface of the cap part having the length in the sleeve direction, so that the cooling performance is high. Furthermore, it is easy to assemble and disassemble, and the sealing of the cooling fluid is reliable.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of one embodiment of the present invention, FIG. 2 is a partial detailed view thereof, FIG. 3 is a cross-sectional view of a second embodiment of the present invention, and FIG.
The figure is a sectional view of a third embodiment of the invention, and FIG. 5 is a sectional view of a fourth embodiment of the invention. 1...Multilayer wiring board, 2...Solder ball, 3...Semiconductor element, 4...Heat sink, 5...Solder, 6...
Base part, 7... Header, 8... Opening part, 9...○
Ring, 1o...1 JP3 215968 (5)

Claims (1)

[Scope of Claims] 1. A semiconductor cooling device comprising a semiconductor element mounted on a substrate and a cooling fluid supply header attached to the substrate, further comprising: a heat sink fixed to the semiconductor element; A semiconductor cooling device characterized in that a heat sink is provided with a base portion having an axial length, and a side surface of the base portion is connected to a cooling fluid supply header by an O-ring.