JPH0354472B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a cooling structure for cooling an integrated circuit package mounted on a substrate.

[Background Art] A conventional method for cooling an integrated circuit package such as a large-scale integrated circuit (LSI) package mounted on a substrate such as a printed wiring board or a ceramic board is to provide a blower in the device. This is a forced air cooling method that pumps air through the system.

[Problems with the Background Art] However, due to the improvement in the degree of integration of the elements themselves or the progress in high-density packaging technology, the power density has significantly increased, and it has become difficult to cope with this using conventional air cooling systems. In other words, it is necessary to exhaust a large amount of heat from the densely packed interior, which requires a large blower with a large air volume and high pressure.However, this large blower has the disadvantage of generating extremely loud noise, and also There are problems such as a large air volume being required for the air conditioner in the equipment room.

On the other hand, it is known that liquid cooling systems have much higher cooling capacity than air cooling systems, but they cannot efficiently transfer heat from the heat generating part to the refrigerant.
There are maintenance problems because the LSI package mounting section and the cold leg section cannot be easily attached and detached.

[Object of the Invention] The present invention has been made by paying attention to the problems of the above-mentioned conventional example, and aims to provide a liquid cooling type cooling structure that has a small temperature drop and is easy to maintain. be.

[Summary of the Invention] In order to achieve the above object, the present invention provides a plurality of integrated circuit packages having columnar heat sinks, an integrated circuit module having the integrated circuit packages mounted on a substrate, and a package mounting surface of the substrate. A lower frame is formed of an elastic highly heat conductive material having a shape that can be expanded or contracted depending on the pressure of a refrigerant; The heat sink is made up of a conduit that is expanded by the heat sink and comes into contact with the columnar heat sink, and an upper frame that cooperates with the lower frame to cover the conduit.

[Embodiments of the Invention] The present invention will be described in detail below based on embodiments shown in the accompanying drawings.

FIG. 1 is an exploded perspective view showing one embodiment of the present invention. Broadly speaking, this embodiment consists of an LSI module 1 and a cooling plate 2, both of which are tightened with screws 3.

Figure 2 is a sectional view taken along line A-A in Figure 1.
FIG. 2 is a cross-sectional view of module 1. FIG. LSI module 1
A signal pin 10 is provided on one side of a ceramic substrate 4, and an LSI package 5 is mounted on the opposite side. A columnar heat sink 6 is soldered to this LSI package 5. The tip of this heat sink 6 has a tapered shape B. This tapered shape B allows the LSI package 5 to be easily attached to the cooling plate 2. A base frame 8 and a plate 9 are fixed around the ceramic substrate 4 with screws 11. The base frame 8 is provided with guide pins 13 shown in FIG. 3 for guiding when the cooling plate 2 is attached.

Further, a protective cover 7 is fixed to the base frame 8 with screws 12. This protective cover 7 protects the LSI package 5 and the signal wiring surface C of the ceramic substrate 4.

FIG. 4 is a cross-sectional view of the cooling plate 2, and is a cross-sectional view taken along line GG in FIG. Also, Figures 5 and 6 show the 4th
Each of the figures is a HH sectional view and an MM sectional view.

The cooling plate 2 includes a conduit 16 through which liquid flows and a lower frame 14 that supports and protects this conduit 16.
and an upper frame 15. The conduit 16 has a throttle D that allows expansion in the K direction in the figure and a throttle E that allows expansion in the L direction in the figure. Further, the pipe line 16 includes a pipe 19 having an arc J passing through the heat sink 6.
A stop plate 18 for closing both ends of the pipe line 16, an inflow pipe 17 for supplying liquid, and a discharge pipe 25 for discharging the liquid are provided. Stop plate 18 and inflow pipe 1
7 and the discharge pipe 25 are fixed to the pipe 19 with solder.

Further, the conduit 16 is made of a very thin elastic material such as BeCu in order to facilitate its expansion and to make more complete contact with the heat sink 6.

FIG. 7 is an exploded perspective view showing another embodiment of the conduit. Vertical plate 21 formed from a single plate
, a lower plate 24, an upper plate 20,
The inflow pipe 22 and the discharge pipe 26 are connected by soldering or the like.

As shown in FIG. 5, the conduit 16 includes a projection R for positioning the conduit 16, a hole T for passing the heat sink 6, a hole F for passing the guide pin 13, and a screw 12. The lower frame 14 consists of a counterbore N for escape, a hole U for passing the screw 3 for attaching the cooling plate 2 to the LSI module, a projection S for positioning the conduit 16, and an injection pipe 17 to pass through. It is mounted between an upper frame 15 having a hole V, a hole through which a guide pin 13 is passed, and a hole through which a screw 3 for attachment to an LSI module is passed. The conduit 16 is then fixed by a screw 27.

Further, the inflow pipe 17 and the discharge pipe 25 are fixed to the Q portion of the upper frame 15 with adhesive or the like, and the pipe line 1
No external force is applied to 6.

FIG. 8 shows a cross-sectional view of the LSI module 1 and cooling plate 2 assembled together. Using the guide pin 13 on the LSI module 1 side as a guide,
A cooling plate 2 is mounted on the LSI module, and the LSI module 1 and the cooling plate 2 are fixed with screws 3.

Figure 9 is a partially enlarged view of Figure 8;
The figure is a sectional view taken along the line W-W in FIG. 9. Conduit 10
is made up of apertures D and E and a thin plate, so the pressure of the cooling liquid supplied from the inflow pipe 17 causes the pipe line 16 to expand as indicated by Y.
It adapts to the outer shape of the heat sink 6 and makes complete contact with it. In the conventional example, when using liquid cooling,
If there is a problem with the contact state of these contact parts and air with high thermal resistance is present, it is necessary to fill with a filler with high thermal conductivity. However, in the above embodiment, due to the expansion of the conduit 16, no air is present between the conduit 16 and the heat sink 6, so that the two can completely come into contact with each other. Therefore, the heat generated in the LSI package 5 is transferred to the cooling liquid via the heat sink 6 and the conduit 16 using the shortest heat transfer path. For this reason, the cooling structure of the LSI package has the advantage of having low thermal resistance.

Next, consider the case where the LSI module 1 is removed from the cooling plate 2. In this case, by stopping the flow of cooling liquid into the conduit 16 and removing the pressure that caused the conduit 16 to expand, the conduit 16 returns to its original shape due to its elasticity and connects to the heat sink 6. A gap occurs between them. In the case of the above embodiment, since the contact portion between the heat sink and the pipe line is not filled with filler, in this state,
The LSI module 1 can be easily removed from the cooling plate 2. Therefore, it has the advantage of being easy to maintain.

[Effects of the Invention] As described above, the present invention has the advantage that the cooling structure has a small temperature drop and is easy to maintain.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention;
Figure 2 is a cross-sectional view taken along line A-A in Figure 1, Figure 3 is a cross-sectional view taken along line I-I in Figure 1, Figure 4 is a cross-sectional view taken along line G-G in Figure 1, and Figure 5 is a cross-sectional view taken along line I-I in Figure 1. HH sectional view, FIG. 6 is an MM sectional view in FIG. 4, FIG. 7 is an exploded perspective view showing another example of the conduit, and FIG. 8 is an assembled LSI module and cooling plate. 9 is a partially enlarged view of FIG. 8, and FIG. 10 is a sectional view taken along the line W-W in FIG. 9. 1...LSI module, 2...Cooling plate, 4...
Ceramic substrate, 5... LSI package, 6...
Heat sink, 7...Protective cover, 8...Base frame, 14...Lower frame, 15...Upper frame, 16...Pipe line, 17, 22...Inflow pipe, 24...Lower plate, 25, 26...Exhaust pipe.

Claims (1)

[Claims] 1. A plurality of integrated circuit packages equipped with columnar heat sinks, an integrated circuit module in which the integrated circuit packages are mounted on a substrate, and a hole that faces the package mounting surface of the substrate and that passes through the columnar heat sinks on the opposite surface. a lower frame comprising a lower frame; and a conduit made of an elastic highly thermally conductive material having a shape that can be expanded or contracted by the pressure of the refrigerant, and which expands by the pressure of the refrigerant and contacts the columnar heat sink. A cooling structure for an integrated circuit package, comprising: an upper frame that cooperates with the lower frame to cover the conduit.