JPH03217035A - Tab tape - Google Patents

Tab tape

Info

Publication number
JPH03217035A
JPH03217035A JP2011744A JP1174490A JPH03217035A JP H03217035 A JPH03217035 A JP H03217035A JP 2011744 A JP2011744 A JP 2011744A JP 1174490 A JP1174490 A JP 1174490A JP H03217035 A JPH03217035 A JP H03217035A
Authority
JP
Japan
Prior art keywords
adhesive layer
resin
adhesive
tab tape
pts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011744A
Other languages
Japanese (ja)
Other versions
JPH06105730B2 (en
Inventor
Hitoshi Narushima
成嶋　均
Yoshikazu Tsukamoto
塚本　美和
Tadahiro Oishi
忠弘 大石
Atsushi Koshimura
淳 越村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tomoegawa Co Ltd
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Priority to JP2011744A priority Critical patent/JPH06105730B2/en
Priority to PCT/JP1991/000066 priority patent/WO1991011821A1/en
Priority to DE69108919T priority patent/DE69108919T2/en
Priority to US07/761,939 priority patent/US5290614A/en
Priority to EP91902770A priority patent/EP0551512B1/en
Priority claimed from JP3206116A external-priority patent/JPH07114222B2/en
Priority claimed from JP3206115A external-priority patent/JPH07114221B2/en
Publication of JPH03217035A publication Critical patent/JPH03217035A/en
Priority claimed from JP4086552A external-priority patent/JPH05259228A/en
Priority claimed from JP4116670A external-priority patent/JP2835797B2/en
Priority to DE4224567A priority patent/DE4224567A1/en
Priority to US07/980,230 priority patent/US5298304A/en
Publication of JPH06105730B2 publication Critical patent/JPH06105730B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C09J179/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To obtain a TAB tape having insulation reliability, chemical resistance, heat resistance and high adhesive strength by providing an adhesive layer containing at least polyamide resin and a specific quantity of resol type phenol resin and a protective layer on an organic insulating film. CONSTITUTION:An adhesive layer 2 containing at least polyamide resin and resol type phenol resin and a protective layer 3 are provided on an organic insulating film 1 and the resol type phenol resin of 2-35% is included in the adhesive layer 2. For example, an adhesive layer paint composed of 100 pts.wt. 25% isopropyl alcohol/water mixed solution of polyamide resin 8 pts.wt. epoxy resin, 8 pts.wt. 50% MEK solution of novolak type phenol resin, 6 pts.wt. 50% MEK solution of resol type phenol resin and 10 pts.wt. 1% MEK solution of 2-ethyl imidazole is applied to a protective film 3 and dried so that an adhesive layer 2 is formed. Then, organic insulating films 1 are overlapped and heated and contact-bonded so that a TAB tape is prepared.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、半導体デバイスの組み立て工程において、デ
バイスの多ピン化、小型化、高密度実装に際し、注目さ
れているＴ　Ａ　Ｂ　（　Ｔａｐｅ　Ａｕｔｏｍａｔｅ
ｄＢｏｎｄｉｎｇ）方式に用いられる保護層、接着剤層
及び有機絶縁フィルムの３層構造からなるテープ（以下
、ＴＡＢ用テープという）に関する。[Detailed Description of the Invention] <Industrial Field of Application> The present invention is applicable to TAB (Tape Automate), which is attracting attention in the assembly process of semiconductor devices when increasing the number of pins, downsizing, and high-density packaging of devices.
The present invention relates to a tape (hereinafter referred to as TAB tape) that is used in the dBonding method and has a three-layer structure of a protective layer, an adhesive layer, and an organic insulating film.

〈従来の技術〉 従来、ＴＡＢ用テープは、次のように加工されてフイル
ムキャリアテープを形成する。<Prior Art> Conventionally, a TAB tape is processed as follows to form a film carrier tape.

１）スプロケソト・デバイスホールをスタンビングによ
り穿孔する。1) Drill the sprocket device hole by stamping.

２）穿孔されたテープに銅箔を熱圧着した後、加熱によ
り接着剤を硬化させる。2) After thermocompression bonding the copper foil to the perforated tape, the adhesive is cured by heating.

３）フォトレジストを塗布し、マスクを通して紫外線等
を照射した後、現像する。3) Apply photoresist, irradiate it with ultraviolet rays etc. through a mask, and then develop it.

４）デバイスホールの裏打ち、銅のエソチング、レジス
ト除去、裏打ちの除去を行い、回路を作製し、ソルダー
レジストをかける。4) Perform lining of device holes, ethoching of copper, removal of resist, removal of lining, fabrication of circuits, and application of solder resist.

５）錫、金メッキを行う。5) Perform tin and gold plating.

以上の工程を経て作成されたテープに、チップがインナ
ーリードボンディングされた後、リードを切断し、プリ
ント基板等にアウターリードポンディングし、樹脂で封
止する。或いは、インナーリードボンディングした後、
樹脂で封止し、周辺回路も含め切断し、アウターリード
ボンディングする。After the chip is bonded with inner leads to the tape created through the above steps, the leads are cut, outer leads are bonded to a printed circuit board, etc., and the chips are sealed with resin. Or, after inner lead bonding,
Seal with resin, cut including peripheral circuits, and perform outer lead bonding.

接着剤及び有機絶縁フィルムは、周辺回路、封止樹脂中
に残ることが多い。この様な場合、益々高密度化が進む
中、銅箔のパターン間の絶縁信顧性やチップのＡｌ配線
の腐食に影響するイオン性不純物が問題になる。絶縁信
転性やイオン性不純物は主に接着剤の特性に起因すると
ころが多い。Adhesives and organic insulating films often remain in peripheral circuits and sealing resins. In such cases, as density increases, ionic impurities that affect insulation reliability between copper foil patterns and corrosion of Al wiring on a chip become a problem. Insulation conductivity and ionic impurities are mainly caused by the characteristics of the adhesive.

即ち、イオン性不純物は、上記工程３ないし５において
、接着剤がアルカリ　（例えば、金メッキ時や、レジス
ト剥離時はカリウムイオンの含有）、酸（例えば、錫メ
ッキ時は塩素イオン、硫酸イオンの含有）、エソチング
液（塩素イオンの含有）などにさらされる為に生じたり
、また接着剤そのものに含まれていたりする場合がある
。また、絶縁信顛性は、接着剤の耐湿熱性、電気抵抗、
上記イオン性不純物などにより支配される。In other words, ionic impurities are caused by the adhesive being alkali (for example, containing potassium ions during gold plating or resist peeling) or acid (for example, containing chloride ions or sulfate ions during tin plating) in steps 3 to 5 above. ), may occur due to exposure to ethosing solution (containing chlorine ions), or may be contained in the adhesive itself. Insulation reliability also includes the adhesive's moisture and heat resistance, electrical resistance,
It is dominated by the ionic impurities mentioned above.

従来用いられてきたＴＡＢ用テープの接着剤はエポキシ
系の樹脂を主成分としたものであるが、これは、ａ）接
着剤中の熱硬化成分比を増加させることにより絶縁信頼
性、耐薬品性、耐熱性が向上するが、接着力が低下する
。また逆に、ｂ）熱硬化成分比を減少させることにより
、接着力は上昇するが絶縁信頼性、耐薬品性、耐熱性が
低下する。したがって、本発明の目的は、従来のＴＡＢ
用テープに於ける上記のような問題を解決し、絶縁信転
性、耐薬品性、耐熱性、及び高い接着力を有するＴＡＢ
用テープを提供することにある。The adhesive used in conventional TAB tapes is mainly composed of epoxy resin, but this improves insulation reliability and chemical resistance by a) increasing the ratio of thermosetting components in the adhesive; The adhesive strength and heat resistance are improved, but the adhesive strength is decreased. Conversely, b) by decreasing the thermosetting component ratio, the adhesive strength increases, but the insulation reliability, chemical resistance, and heat resistance decrease. Therefore, it is an object of the present invention to overcome the conventional TAB
TAB solves the above-mentioned problems with commercial tapes and has excellent insulation transferability, chemical resistance, heat resistance, and high adhesive strength.
The aim is to provide tapes for

く発明が解決しようとする課題〉 本発明のＴＡＢ用テープは、有機絶縁フィルム上に、少
なくともポリアミド樹脂及びレゾール型フェノール樹脂
を含有する接着剤層及び保護層を設けてなり、該レゾー
ル型フェノール樹脂が接着剤中に２〜３５％含有されて
いることを特徴とする。Problems to be Solved by the Invention The TAB tape of the present invention comprises an adhesive layer and a protective layer containing at least a polyamide resin and a resol type phenolic resin on an organic insulating film, is characterized in that it is contained in the adhesive in an amount of 2 to 35%.

第１図は本発明のＴＡＢ用テープの模式的断面図であっ
て、有機絶縁フィルム１の片面に、半硬化状の接着剤層
２と保護層となる保護フィルム３が順次積層された層構
成を有する。FIG. 1 is a schematic cross-sectional view of the TAB tape of the present invention, which has a layered structure in which a semi-cured adhesive layer 2 and a protective film 3 serving as a protective layer are laminated in sequence on one side of an organic insulating film 1. has.

有機絶縁フィルムとしては、厚さ２５〜１８８μｍ１好
ましくは５０〜１２５μｍのポリイミド、ポリエーテル
イミド、ポリフェニレンサルファイド、ポリエーテルエ
ーテルケトン等の耐熱性フィルムや、エポキシ樹脂−ガ
ラスクロス、エボキシ樹脂−ポリイミドーガラスクロス
等の複合耐熱フィルムからなる有機絶縁フィルムが使用
できる。Examples of organic insulating films include heat-resistant films of polyimide, polyetherimide, polyphenylene sulfide, polyether ether ketone, etc. having a thickness of 25 to 188 μm, preferably 50 to 125 μm, epoxy resin-glass cloth, epoxy resin-polyimide glass cloth. An organic insulating film consisting of a composite heat-resistant film such as can be used.

接着剤層は、熱硬化型のもので半硬化状であることが必
要であり、少なくともボリアミド樹脂及びレゾール型フ
ェノール樹脂を含有する、膜厚１０〜４０μｍ、好まし
くは１５〜３０μｍの層よりなる。The adhesive layer needs to be thermosetting and semi-cured, and consists of a layer containing at least a polyamide resin and a resol type phenolic resin and having a thickness of 10 to 40 μm, preferably 15 to 30 μm.

この接着剤層において、ボリアミド樹脂は、主に有機絶
縁フィルムとの接着性、フレキシビリティーを得るため
に加えられるものである。In this adhesive layer, the polyamide resin is added mainly to obtain adhesion and flexibility with the organic insulating film.

ポリアミド樹脂の分子量は、フレキシビリティ、テープ
と銅箔との熱圧着時や、接着剤の硬化時の溶融特性（デ
バイスホールからの接着剤のはみ出し）に関連するもの
であって、分子量が低すぎると溶融温度が低くなり、は
み出しの問題が生じる。また、分子量が高すぎると銅箔
との熱圧着温度が高くなり過ぎるという問題が生じる。The molecular weight of polyamide resin is related to its flexibility, the heat-compression bonding between the tape and copper foil, and the melting properties when the adhesive hardens (adhesive protruding from device holes), and the molecular weight is too low. This lowers the melting temperature and causes problems with extrusion. Moreover, if the molecular weight is too high, there will be a problem that the thermocompression bonding temperature with the copper foil will be too high.

したかって、本発明においては、分子量３０，　０００
〜１５０，０００の範囲で、軟化温度１００〜１８０℃
のポリアミド樹脂を用いるのが好ましい。Therefore, in the present invention, the molecular weight is 30,000
~150,000, softening temperature 100-180℃
It is preferable to use a polyamide resin of.

更にまた、デバイスホールからの接着剤のはみ出し等に
関連する溶融特性に影響を与える因子として、分子量分
布があり、分子量分布が狭い場合には、熱による急激な
粘度低下を起こし、テープと銅箔との熱圧時デバイスホ
ールからのはみ出しのない熱圧条件が狭くなり好ましく
ない。したがって、本発明において使用するボリアミド
樹脂は、分子量分布の広いものが望ましい。Furthermore, molecular weight distribution is a factor that affects the melting characteristics related to adhesive extrusion from device holes, etc. If the molecular weight distribution is narrow, the viscosity decreases rapidly due to heat, and the tape and copper foil At the time of hot-pressing, the hot-pressing conditions without protrusion from the device hole become narrow, which is not preferable. Therefore, the polyamide resin used in the present invention preferably has a wide molecular weight distribution.

本発明の接着層に配合するレゾール型フェノール樹脂は
、フェノール成分がビスフェノールＡ型及びアルキルフ
ェノールから選択された１種または２種よりなるビスフ
ェノールＡ型、アルキルフェノール型、またはそれらの
共縮合型のフェノール樹脂が使用できる。アルキルフェ
ノール型のレゾールフェノール樹脂はフェノール性水酸
基のＯまたｐ一位にメチル基、エチル基、プロビル基、
ｔ−プチル基、ノニル基等を有するものがあげられる。The resol type phenolic resin to be blended into the adhesive layer of the present invention is a bisphenol A type, alkylphenol type, or a cocondensation type phenol resin having a phenol component of one or two selected from bisphenol A type and alkylphenol. Can be used. Alkylphenol type resol phenol resin has a methyl group, ethyl group, probyl group at the O or p-position of the phenolic hydroxyl group,
Examples include those having a t-butyl group, a nonyl group, etc.

レゾール型フェノールは加熱により反応し接着力を有す
る不溶不融の固体となり接着剤の接着力、絶縁信頼性、
耐薬品性、耐熱性を向上させる。Resol type phenol reacts when heated and becomes an insoluble and infusible solid with adhesive strength, improving the adhesive strength of adhesives, insulation reliability,
Improves chemical resistance and heat resistance.

又、本発明の接着層には上記レゾール型フェノール樹脂
以外のフェノール樹脂、すなわちノポラック型フェノー
ル樹脂に代表される全ての非熱反応型フェノール樹脂を
使用することが出来、特にビスフェノールＡ型及びアル
キルフェノールから選択された１種または２種よりなる
ビスフェノールＡ型、アルキルフェノール型、またはそ
れらの共縮合型のノポラソクフェノール樹脂を用いるこ
とが好ましい。In addition, for the adhesive layer of the present invention, phenolic resins other than the above-mentioned resol type phenolic resins, that is, all non-thermally reactive phenolic resins represented by nopolac type phenolic resins, can be used, and in particular, bisphenol A type and alkyl phenol resins can be used. It is preferable to use bisphenol A type, alkylphenol type, or a co-condensed type of noporasocphenol resin consisting of one or two selected types.

接着剤は、熱硬化型である必要があり、非熱反応型フェ
ノール樹脂を用いる場合には、エボキシ樹脂及びイミダ
ゾール化合物を配合する。エポキシ樹脂はポリアミド樹
脂の分子鎖末端で反応し、またイミダゾール化合物の作
用によりフェノール樹脂と容易に硬化反応を起こす。こ
の硬化物は接着剤の耐薬品性、耐熱性を向上させる。使
用できるエボキシ樹脂としては、ビスフェノールＡジグ
リシジルエータル、エボキシ化フェノールノボラソク、
エポキシ化タレゾールノボラック等があげられる。The adhesive needs to be thermosetting, and when a non-thermally reactive phenol resin is used, an epoxy resin and an imidazole compound are blended. The epoxy resin reacts at the molecular chain end of the polyamide resin, and also easily causes a curing reaction with the phenol resin due to the action of the imidazole compound. This cured product improves the chemical resistance and heat resistance of the adhesive. Eboxy resins that can be used include bisphenol A diglycidyl ether, epoxidized phenol novorasoc,
Examples include epoxidized Talesol Novolac.

イミダゾール化合物としては、２−メチルイミダゾール
、２−エチル−４−メチルイミダゾール等のメチルエチ
ルケトン等、汎用溶剤に溶解するものや、２−フェニル
ー４−ベンジルー５−ヒドロキシメチルイミダゾール等
、汎用溶剤に難溶のもの等があげられる。Examples of imidazole compounds include those that are soluble in general-purpose solvents such as methyl ethyl ketone such as 2-methylimidazole and 2-ethyl-4-methylimidazole, and those that are poorly soluble in general-purpose solvents such as 2-phenyl-4-benzyl-5-hydroxymethylimidazole. I can give you things.

本発明においては前記レゾール型フェノール樹脂は、接
着剤層中において、２〜３５％の配合量であることが必
要である。すなわち本発明の接着剤層を構成するレゾー
ル型フェノール樹脂が２％以下であると銅箔に対する接
着力の効果がなく、又、３５％以上であるとエッチング
処理等ＴＡＢ用テープの加工工程で要求される耐薬品性
を満足することができない。In the present invention, the resol type phenolic resin needs to be blended in an amount of 2 to 35% in the adhesive layer. In other words, if the resol type phenolic resin constituting the adhesive layer of the present invention is less than 2%, it will not have an adhesive effect on copper foil, and if it is more than 35%, it will not be effective in the processing steps of TAB tape such as etching treatment. Chemical resistance cannot be satisfied.

接着剤層の保護層となる保護フィルムとしては、ポリエ
チレンテレフタレート等のポリエステルフィルムが使用
できる。As a protective film serving as a protective layer for the adhesive layer, a polyester film such as polyethylene terephthalate can be used.

次に、本発明のＴＡＢ用テープの製造法について説明す
る。第２図は、製造工程を示すもので、保護フィルム３
の上に所定の配合の接着剤を、乾燥後の膜厚が上記の範
囲になるように塗布する。Next, a method for manufacturing the TAB tape of the present invention will be explained. Figure 2 shows the manufacturing process.
An adhesive of a predetermined composition is applied onto the adhesive so that the film thickness after drying falls within the above range.

この際、半硬化状の状態にするために、その加熱条件は
１５０〜１８０℃で２分間乾燥させることが必要である
。At this time, in order to obtain a semi-cured state, the heating conditions require drying at 150 to 180° C. for 2 minutes.

次に、形成された接着剤層２の表面に、有機絶縁フィル
ム１を重ね合わせ、１００〜１３０℃でｌｋｇ／ｃｍ”
以上の条件で熱圧着する。Next, the organic insulating film 1 is superimposed on the surface of the formed adhesive layer 2, and
Heat compression bonding is performed under the above conditions.

得られたＴＡＢ用テープは巻回されて、例えば幅３０〜
２００１ｍで３０〜３００ｍの長さのものが得られる。The obtained TAB tape is wound to have a width of, for example, 30 to 30 mm.
2001m and lengths of 30 to 300m can be obtained.

〈実施例〉 以下、本発明を実施例によって説明する。<Example> Hereinafter, the present invention will be explained by examples.

尚、配合部数は全て重量部を示すものとする。In addition, all blended parts shall indicate parts by weight.

実施例１ 厚さ３８μｍのポリエチレンテレフタレートフィルムか
らなる保護フィルムに下記組成の接着剤ｑ 層用塗料を塗布し、１６０℃２分間乾燥して膜厚２０μ
ｍの接着剤層を形成した。Example 1 An adhesive q layer paint having the following composition was applied to a protective film made of polyethylene terephthalate film with a thickness of 38 μm, and dried at 160°C for 2 minutes to give a film thickness of 20 μm.
m adhesive layer was formed.

次に厚さ５０μｍのポリイミドフィルムからな有機絶縁
フィルムを重ね合わせ、１３０℃１ｋｇ　／　ｃｍ　２
の条件で加熱圧着して本発明のＴＡＢ用テープを作製し
た。Next, an organic insulating film made of polyimide film with a thickness of 50 μm was layered and heated at 130°C at 1 kg/cm 2
A TAB tape of the present invention was produced by heat-pressing under the following conditions.

次に、このＴＡＢ用テープの保護フィルムを剥して１オ
ンスの電解銅箔（厚さ３５〜４０μｍ）を貼り合わせ、
１３０℃、ｌｋｇ／ｃｍ”の条件で加熱加圧処理を行っ
た。Next, the protective film of this TAB tape was peeled off and 1 ounce electrolytic copper foil (thickness 35-40 μm) was attached.
Heat and pressure treatment was performed under the conditions of 130° C. and 1 kg/cm”.

１０ その後更に６０℃６時間、８０℃６時間、１２０℃３時
間及び１５０℃で５時間、順次加熱を行い接着剤層の硬
化を行った。更に、常法により銅箔上にフォトレジスト
膜を形成して処理し銅箔をエッチングし、櫛形回路を形
成しフィルムキャリアテープを作成した。10 Thereafter, the adhesive layer was cured by heating in sequence for 6 hours at 60°C, 6 hours at 80°C, 3 hours at 120°C, and 5 hours at 150°C. Furthermore, a photoresist film was formed on the copper foil by a conventional method, and the copper foil was etched to form a comb-shaped circuit to produce a film carrier tape.

実施例２ 接着剤層用塗料として、下記組成のものを用いた以外は
実施例１と同様にしてＴＡＢ用テープ及びフィルムキャ
リアテープを作製した。Example 2 A TAB tape and a film carrier tape were produced in the same manner as in Example 1, except that a paint having the following composition was used as the adhesive layer coating.

■ ■ 実施例３ 接着剤層用塗料として、下記組成のものを用いた以外は
実施例１と同様にしてＴＡＢ用テープ及びフィルムキャ
リアテープを作製した。■■ Example 3 A TAB tape and a film carrier tape were produced in the same manner as in Example 1, except that a paint having the following composition was used as the adhesive layer coating.

比較例１ 接着剤層用塗料として、下記組成のものを用いた以外は
実施例１と同様にして比較用のＴＡＢ用テープ及びフィ
ルムキャリアテープを作製した。Comparative Example 1 Comparative TAB tapes and film carrier tapes were produced in the same manner as in Example 1, except that a paint having the following composition was used as the adhesive layer coating.

１２ 比較例２ 接着剤層用塗料として、下記組成のものを用いた以外は
実施例１と同様にして比較用のＴＡＢ用テープ及びフイ
ルムキャリアテープを作製した。12 Comparative Example 2 Comparative TAB tapes and film carrier tapes were produced in the same manner as in Example 1, except that a paint having the following composition was used as the adhesive layer coating.

１３ 比較例３ 接着剤層用塗料として、下記組成のものを用いた以外は
実施例１と同様にして比較用のＴＡＢ用テープ及びフィ
ルムキャリアテープを作製した。13 Comparative Example 3 Comparative TAB tapes and film carrier tapes were produced in the same manner as in Example 1, except that a paint having the following composition was used as the adhesive layer coating.

１ ４ 実施例１〜３、及び比較例１〜３のフィルムキャリアテ
ープに対し、下記の特性試験を行いその結果を第１表に
示す。1 4 The following characteristic tests were conducted on the film carrier tapes of Examples 1 to 3 and Comparative Examples 1 to 3, and the results are shown in Table 1.

１．線間１００μｍパターンを用い、１２１゜Ｃ１２ａ
ｔｍ、１００νｏｆｔ印加下での線間短絡が生じるまで
の時間。1. Using a 100μm pattern between lines, 121°C12a
tm, time until line-to-line short circuit occurs under application of 100 νoft.

２．耐薬品性・・・アセトン及びメタノール浸漬による
溶解量・・・接着剤層の配合物を加熱硬化させた後、ア
セトンもしくはメタノールにて３０℃で１時間（超音波
下）浸漬した後の重量減少率（％）。2. Chemical resistance: Dissolution amount due to immersion in acetone and methanol: Weight loss after heating and curing the adhesive layer formulation and then immersing it in acetone or methanol at 30°C for 1 hour (under ultrasonic waves) rate(%).

３．銅箔との接着力（　１　ｃｍ中　１８０°剥離）。3. Adhesion strength with copper foil (180° peeling within 1 cm).

１５ １６ 第１表から明らかなとおり、本発明によるＴＡＢ用テー
プは高い絶縁信顧性と耐薬品性および強い接着力を全て
備えたものであることが確認された。15 16 As is clear from Table 1, the TAB tape according to the present invention was confirmed to have high insulation reliability, chemical resistance, and strong adhesive strength.

〈発明の効果〉 本発明のＴＡＢ用テープは、絶縁信頼性に加え高い接着
力を有するので、多ピン化が進み益々線巾が狭くなって
いるパターンと有機絶縁フィルムとを確実に接着し且つ
高い絶縁信頼性によりリード間の絶縁性に問題が生じな
い。したがって、チップと外部回路との接続に使用され
る際に、リードの数が増えてもリード部分にテープを残
留させることができる。よって、多ピンチソプを実装す
る場合、ボンディングミスが生じ難く、搬送工程、ポ、
ンディング工程等に於いて、リードの変形が少なく歩留
が大巾に上昇する。<Effects of the Invention> The TAB tape of the present invention has not only insulation reliability but also high adhesion strength, so it can reliably bond an organic insulating film to a pattern whose line width is becoming increasingly narrow as the number of pins increases. High insulation reliability eliminates problems with insulation between leads. Therefore, when used to connect a chip to an external circuit, even if the number of leads increases, the tape can remain on the lead portions. Therefore, when mounting multi-pinch plates, bonding errors are less likely to occur, and the transportation process, ports, and
In the bonding process, lead deformation is minimal, and the yield is greatly increased.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明のＴＡＢ用テープの模式的断面図であり
、第２図は本発明のＴＡＢ用テープの製造工程図である
。 １・・・有機絶縁フィルム、２・・・接着剤層、３・・
・保１７ 護フィルム。 １８FIG. 1 is a schematic cross-sectional view of the TAB tape of the present invention, and FIG. 2 is a manufacturing process diagram of the TAB tape of the present invention. 1... Organic insulating film, 2... Adhesive layer, 3...
・Protection 17 Protective film. 18

Claims (3)

【特許請求の範囲】[Claims] （１）有機絶縁フィルム上に、少なくともポリアミド樹
脂及びレゾール型フェノール樹脂を含有する接着剤層及
び保護層を設けてなり、該レゾール型フェノール樹脂が
接着剤層中に２〜３５％含有されていることを特徴とす
るＴＡＢ用テープ。(1) An adhesive layer and a protective layer containing at least a polyamide resin and a resol type phenolic resin are provided on an organic insulating film, and the resol type phenolic resin is contained in the adhesive layer in an amount of 2 to 35%. A TAB tape characterized by: （２）接着剤層がエポキシ樹脂を含有することを特徴と
する請求項１記載のＴＡＢ用テープ。(2) The TAB tape according to claim 1, wherein the adhesive layer contains an epoxy resin. （３）接着剤層がイミダゾール化合物を含有することを
特徴とする請求項１記載のＴＡＢ用テープ。(3) The TAB tape according to claim 1, wherein the adhesive layer contains an imidazole compound.
JP2011744A 1990-01-23 1990-01-23 TAB tape Expired - Fee Related JPH06105730B2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2011744A JPH06105730B2 (en) 1990-01-23 1990-01-23 TAB tape
PCT/JP1991/000066 WO1991011821A1 (en) 1990-01-23 1991-01-23 Tape for tab
DE69108919T DE69108919T2 (en) 1990-01-23 1991-01-23 FILM CARRIER FOR TAB.
US07/761,939 US5290614A (en) 1990-01-23 1991-01-23 Adhesive tapes for tape automated bonding
EP91902770A EP0551512B1 (en) 1990-01-23 1991-01-23 Tape for tab
DE4224567A DE4224567A1 (en) 1990-01-23 1992-07-24 Adhesive tape for tape automated bonding - has adhesive layer comprising polyamide resin, layer contg. inorganic filler, layer contg. siloxane] epoxide] resin and layer contg. maleimide resin
US07/980,230 US5298304A (en) 1990-01-23 1992-11-23 Adhesive tapes for tape automated bonding

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2011744A JPH06105730B2 (en) 1990-01-23 1990-01-23 TAB tape
JP3206115A JPH07114221B2 (en) 1991-07-24 1991-07-24 TAB tape
JP3206116A JPH07114222B2 (en) 1991-07-24 1991-07-24 TAB tape
JP4086552A JPH05259228A (en) 1992-03-11 1992-03-11 Tape for tab
JP4116670A JP2835797B2 (en) 1992-04-10 1992-04-10 TAB tape

Publications (2)

Publication Number Publication Date
JPH03217035A true JPH03217035A (en) 1991-09-24
JPH06105730B2 JPH06105730B2 (en) 1994-12-21

Family

ID=39535572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011744A Expired - Fee Related JPH06105730B2 (en) 1990-01-23 1990-01-23 TAB tape

Country Status (2)

Country Link
JP (1) JPH06105730B2 (en)
DE (1) DE4224567A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291356A (en) * 1992-04-10 1993-11-05 Tomoegawa Paper Co Ltd Tape for tab

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006047739A1 (en) * 2006-10-06 2008-04-17 Tesa Ag Heat-activated adhesive tape, in particular for the bonding of electronic components and printed conductors

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291356A (en) * 1992-04-10 1993-11-05 Tomoegawa Paper Co Ltd Tape for tab

Also Published As

Publication number Publication date
JPH06105730B2 (en) 1994-12-21
DE4224567A1 (en) 1993-01-28

Similar Documents

Publication Publication Date Title
US5945188A (en) Adhesive tape for tape automated bonding
US6451441B1 (en) Film with metal foil
WO1991011821A1 (en) Tape for tab
JPH05857B2 (en)
JPH07114222B2 (en) TAB tape
JPH03217035A (en) Tab tape
JP4556260B2 (en) Additive insulation film for printed wiring boards
JP3326372B2 (en) Adhesive for electronic parts and adhesive tape for electronic parts
JP2645969B2 (en) Adhesive tape for semiconductor
JPH05858B2 (en)
JPH0529398A (en) TAB tape
JP2835797B2 (en) TAB tape
JP3396989B2 (en) Tape with adhesive for TAB and semiconductor device
JPH10178060A (en) Semiconductor integrated circuit connecting substrate, components constituting the same, and semiconductor device
JP4092797B2 (en) Adhesive sheet for semiconductor device, component using the same, and semiconductor device
JP3449821B2 (en) Adhesive tape for TAB
JPH03225935A (en) Tape for tab
JP3503392B2 (en) Tape with adhesive for TAB, semiconductor connection substrate, and semiconductor device
JPS62199627A (en) Production of flexible printed circuit board
JP2002373921A (en) Adhesive sheet for semiconductor device, component using the same, and semiconductor device
JPH10178063A (en) Semiconductor integrated circuit connecting substrate, components constituting the same, and semiconductor device
JPS62199673A (en) Thermosetting epoxy resin adhesive
JPH08181174A (en) Tape with adhesive for TAB and semiconductor device
JPH08231940A (en) Adhesive for printed-wiring board prepared by additive method, adhesive sheet and multilayer printed-wiring board and production of laminated sheet
JPH10178061A (en) Semiconductor integrated circuit connecting substrate, components constituting the same, and semiconductor device

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071221

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081221

Year of fee payment: 14

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091221

Year of fee payment: 15

LAPS Cancellation because of no payment of annual fees