JPH03225935A - Tape for tab - Google Patents

Abstract

PURPOSE:To prevent a decrease in bonding strength by composing an adhesive layer of at least two layers, incorporating polyamide resin as a main ingredient in the adhesive layer of the side in contact with an organic insulating film and incorporating polyamide resin and resol type phenol resin as main ingredients in the adhesive layer of the side in contact with a protective layer. CONSTITUTION:A layer formed by sequentially laminating a semicured adhesive layer 2 made of a first adhesive layer 21 and a second adhesive layer 22 and a protective film 3 made of a protective layer is provided on one side surface of an organic insulating film 1. Adhesive having high adherence even at the time of high temperature and exhibiting high bonding strength to the film is used as the adhesive layer of the side in contact with the film of the adhesive layers. As the adhesive, an adhesive containing polyamide resin as a main ingredient is used. On the other hand, as the adhesive of the side in contact with the film, an adhesive having high adherence to a copper foil and excellent chemical resistance to chemical to be exposed with a film carrier at the time of processing is used. As such an adhesive, an adhesive containing polyamide resin and source type phenol resin as main ingredients is used.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applied to T A B (Tape Auto II lat
The present invention relates to a tape (hereinafter referred to as TAB tape) that is used in the edBonding method and has a multilayer structure including a protective layer, a multilayer adhesive layer, and an organic insulating film.

[Conventional technology]

Conventionally, TAB tapes are processed to form film carrier tapes as follows.

■) Drill sprocket/device holes by stamping.

2) After thermocompression bonding the copper foil to the perforated tape, the adhesive is cured by heating.

3) Apply photoresist, irradiate it with ultraviolet rays etc. through a mask, and then develop it.

4) Lining the device hole, etching the copper, removing the resist, removing the lining, fabricating a circuit, and applying a solder resist.

5) Perform tin and gold plating.

After the chip is inner lead bonded to the tape created through the above steps, the leads are cut, outer lead bonded to a printed circuit board, etc., and sealed with resin. Or, after inner lead bonding,
Seal with resin, cut including peripheral circuits, and perform outer lead bonding.

Adhesives and organic insulating films often remain in peripheral circuits and sealing resins. In such cases, as density increases, ionic impurities that affect insulation reliability between patterns of copper foil and corrosion of Al wiring on a chip become a problem. Insulation reliability and ionic impurities are mainly caused by the characteristics of the adhesive.

That is, ionic impurities are caused by the adhesive being alkali (for example, containing potassium ions during gold plating or resist peeling) or acid (for example, containing chloride ions or sulfuric acid during tin plating) in the above steps 3) to 5). It may occur due to exposure to etching solutions (containing ions), etching solutions (containing chlorine ions), or it may be contained in the adhesive itself. Furthermore, the insulation reliability is controlled by the adhesive's moisture and heat resistance, electrical resistance, the above-mentioned ionic impurities, and the like.

The adhesive layer of conventionally used TAB tapes is epoxy-based, but this a) tends to contain ionic impurities (particularly Cl ions) during processing, and b) is easily hydrolyzed by moist heat. (c) low electrical resistance; therefore, insulation deterioration, including metal transfer between patterns, has become a problem.

In addition, since the adhesive used in TAB tape forms the interlayer between the metal Cu foil and the organic insulating film, it is required to have high adhesive strength to both the metal and the organic insulating film. .

All of the adhesive layers of conventionally used TAB tapes have a single-layer structure. (when removing resist), acids (for example, when tin plating)
, a decrease in adhesive strength to Cu foil due to exposure to etching solutions, etc., and b) decrease in adhesive strength to organic insulating films at high temperatures during inner lead and outer lead bonding. As density increases and the number of pins increases, problems such as bonding errors, lead deformation, and peeling of multi-bin chips are becoming a problem. The present invention aims to solve the above-mentioned problems with conventional TAB tapes.

[Means to solve the problem]

The TAB tape of the present invention is formed by providing an adhesive layer and a protective layer on an organic insulating film, and the adhesive layer is composed of at least two layers, and the adhesive layer on the side in contact with the organic insulating film is , the adhesive layer on the side that is in contact with the protective layer is mainly composed of polyamide resin and resol type phenolic resin.

FIG. 1 is a schematic cross-sectional view of the TAB tape of the present invention, in which a first adhesive layer 21 is provided on one side of an organic insulating film 1.
Adhesive layer 2 of semi-curing method consisting of and second adhesive layer 22
It has a layered structure in which a protective film 3 serving as a protective layer is sequentially laminated. In the figure, the adhesive layer 2 has a two-layer structure, but in the present invention, it may have a layer structure of two or more layers.

Examples of organic insulating films include heat-resistant films with a thickness of 25 to 188 mm, preferably 50 to 125 mm, such as rhinoceros polyimide, polyetherimide, polyphenylene sulfide, polyether ether ketone, epoxy resin-glass cloth, epoxy resin-polyimide, etc. - An organic insulating film made of a composite heat-resistant film such as glass cloth can be used.

The adhesive layer needs to be thermosetting and semi-cured, and is composed of at least two layers. The total thickness of the adhesive layer is 10 to 50 ln, preferably 5 to 30 ln.
within the range of In addition, the adhesive layer on the side in contact with the organic insulating film and the adhesive layer on the side in contact with the protective layer are each
It is desirable to have a film thickness of at least lρ.

Of each adhesive layer, the adhesive layer on the side that is in contact with the organic insulating film is in direct contact with the organic insulating film, so it has high tack even at high temperatures and exhibits high adhesive strength with the organic insulating film. Glue is used. In the present invention, as such an adhesive, one whose main component is a polyamide resin is used. For this adhesive layer, in order to provide chemical resistance (=1), it is possible to use epoxy resin or novolak type phenol resin in combination. Furthermore, thermoplastic resin such as polyester resin, NBR, SBR, etc. In either case, the polyamide resin is preferably contained in an amount of 50% by weight or more in the adhesive layer that is in direct contact with the organic insulating film.

On the other hand, the adhesive layer on the side that is in contact with the protective film comes into contact with the copper foil during processing into the film carrier tape, so it has high adhesion to the copper foil and is highly resistant to chemicals that are exposed during processing into the film carrier. Adhesives are used that have excellent chemical resistance. In the present invention, as such an adhesive, one whose main components are a polyamide resin and a resol type phenolic resin is used.

In this adhesive layer, the ratio of the polyamide resin to the resol type phenol resin is preferably in the range of 4 to 100 parts by weight of the resol type phenol resin to 100 parts by weight of the polyamide resin, and the polyamide resin is Preferably it is less than 50% by weight of the total adhesive.

Further, this adhesive layer may further contain a thermosetting resin such as an epoxy resin or a novolac type phenol resin, and a curing accelerator such as imidazole.

As the polyamide resin used in each of the above-mentioned adhesive layers in the present invention, various known polyamide resins can be used.

The molecular weight of the polyamide resin used is related to flexibility, the thermocompression bonding of the tape and the copper foil, and the melting characteristics (protrusion of the adhesive from the device hole) when the adhesive hardens. If it is too low, the melting temperature will be low and the problem of extrusion will occur. Furthermore, if the molecular weight is too high, a problem arises in that the thermocompression bonding temperature with copper foil becomes too high. Therefore, in the present invention, the molecular weight is 30
．． 000~150.000, softening temperature 100~
Preferably, a polyamide resin at 180°C is used.

Furthermore, molecular weight distribution is a factor that affects the melting characteristics related to adhesive extrusion from device holes, etc. If the molecular weight distribution is narrow, the viscosity decreases rapidly due to heat, and the tape and copper foil At the time of hot-pressing, the hot-pressing conditions without protrusion from the device hole become narrow, which is not preferable. Therefore, it is desirable that the polyamide resin used in the present invention has a wide molecular weight distribution.

In addition, as a polyamide resin, for example, amide group equivalent (
When a polyamide resin with a molecular weight/one amide group of 200 to 400 is used, the hygroscopicity of the adhesive layer is low, and the decrease in electrical resistance due to moisture absorption can be suppressed to about one digit, and it is possible to suppress hydrolysis. It is particularly preferable because it improves moisture resistance such as, and as a result, insulation deterioration can be prevented.

In addition, polyamide resins include those in which the molecular weight of the hydrocarbon between the amide groups in one molecular chain ranges over a wide range from 100 to 800, and those in which hydrocarbon molecules with different molecular weights between the amide groups are arranged irregularly. You may also use These polyamide resins are preferably used because they have adhesive properties and high flexibility despite having a large amide group equivalent.

As the resol type phenolic resin used in combination with the polyamide resin, a bisphenol A type, an alkylphenol type, or a cocondensation type thereof, which is composed of one or two selected from phenol components bisphenol A and alkylphenols, can be used. Examples of the alkylphenol type resol type phenol resin include those having a methyl group, ethyl group, propyl group, t-butyl group, nonyl group, etc. at the ○ or p-position of the phenolic hydroxyl group. Resol type phenolic resin reacts with heating,
It becomes an insoluble and infusible solid with adhesive strength, and works to improve the adhesive strength, insulation reliability, chemical resistance, and heat resistance of adhesives.

0 As the protective film serving as the protective layer of the adhesive layer, films of polyethylene, polyethylene terephthalate, polypropylene, etc. can be used.Next, the method for manufacturing the TAB tape of the present invention will be explained. Figure 2 shows the manufacturing process, in which two types of adhesives with predetermined formulations are applied onto the protective film 3 so that the film thickness after drying falls within the range shown in ``2''. The first adhesive layer 21 and the second adhesive layer 22 are formed, or a film made of two types of adhesives formed into a single layer in advance is applied to the protective film 3.
It is laminated on top by thermocompression bonding. At this time, in order to obtain a semi-cured state, the heating conditions need to be drying at 150 to 180°C.

Next, the organic insulating film 1 is superimposed on the surface of the formed adhesive layer 2, and thermocompression bonded at 100 to 130°C under conditions of 1 kg/d or more.

The obtained TAB tape is wound to have a width of, for example, 30 to 30 mm.
200 mm and lengths of 30 to 300 m are obtained.

〔Example〕

1 Hereinafter, the present invention will be explained by examples.

Example 1 An adhesive layer paint having the following composition was applied to a protective film made of polyethylene terephthalate film having a thickness of 38 μm, and was dried by heating at 160° C. for 2 minutes to form an adhesive layer having a thickness of 15 μm.

25% isopropyl alcohol/water mixed solution of polyamide resin (Thomide TXC-232-B, manufactured by Fuji Kasei Kogyo Co., Ltd.) 60 parts 50% methyl ethyl ketone solution of resol phenol resin (CKM-1282, manufactured by Showa Kobunshi Co., Ltd.) 6 parts Epoxy resin ( 14 parts of a 50% methyl ethyl ketone solution of novolac phenol resin (Tamanol 752, manufactured by Arayo Kagaku Co., Ltd.) 14 parts of a 1% methyl ethyl ketone solution of 2-ethylimidazole 10 parts of the adhesive layer Apply Adhesive 2 Required Paint with the following composition on top and dry at 160℃ for 2 minutes to obtain a film thickness of 5.
A layer of adhesive was formed.

25% isopropyl alcohol/water mixed solution of polyamide resin (Tomide TXC-232-B manufactured by Fuji Kasei Kogyo Co., Ltd.) 100 parts Epoxy resin (Epicote 828, manufactured by Yuka Shell Co., Ltd.) 8 parts Novolac phenol resin (Tamanol 752, manufactured by Arayo Kagaku) 8 parts of 50% methyl ethyl ketone solution (manufactured by Co., Ltd.) 10 parts of 1% 2-ethylimidazole solution in methyl ethyl ketone Next, thickness: 5 parts
A TAB tape was produced by stacking organic insulating films made of 0 ml of polyimide films and heating and pressing them at 130° C. and 1 kg/c+#.

Next, peel off the protective film of this TAB tape and
ounce of electrolytic copper foil (thickness: 35 to 40 IIn) was bonded together, and heat and pressure treatment was performed at 130° C. and 1 kg/cJ. Thereafter, each adhesive layer was cured by successively heating at 60°C for 6 hours, 80'C for 63 hours, 120°C for 3 hours, and 150°C for 5 hours. Furthermore, a photoresist film was formed and treated on the copper foil by a conventional method, and the copper foil was etched to form a comb-shaped circuit to produce a film carrier tape.

Example 2 A TAB tape and a film carrier tape were produced in the same manner as in Example 1, except that a paint having the following composition was used as the adhesive layer coating.

(Adhesive on the protective film side) 25% isopropyl alcohol/water mixed solution of polyamide resin (Macromelt 6212, manufactured by Henkel Hakusuisha) 60 parts 50% methyl ethyl ketone solution of resol phenol resin (CKM-1282, manufactured by Showa Kobunshi Co., Ltd.) 6 1 part epoxy resin (Epicote 828, manufactured by Yuka Shell Co., Ltd.) 14 parts Novolac phenol resin (Tamanol 752, manufactured by Arayo Kagaku Co., Ltd.) 14 parts 50% methyl ethyl ketone solution of 4 parts 1% methyl ethyl ketone solution of 2-ethylimidazole 10 parts (organic insulation) Adhesive on the film side) 25% isopropyl alcohol/water mixed solution of polyamide resin (Macromelt 6212 manufactured by Henkel Hakusuisha) 100 parts epoxy resin (Epicote 828 manufactured by Yuka Shell) 8 parts novolac phenol resin (Tamanol 752 manufactured by Yuka Shell) 50% methyl ethyl ketone solution (manufactured by Yokogaku Co., Ltd.) 8 parts 1% methyl ethyl ketone solution of 2-ethylimidazole IO part Example 3 The same procedure as in Example 1 was carried out except that a paint with the following composition was used as the adhesive layer coating. A TAB tape and a film carrier tape were produced.

(Adhesive on the protective film side) 25% isopropyl alcohol/water mixed solution of polyamide resin (Platabondato 12765, manufactured by Nippon Rilsan Co., Ltd.) 50% methyl ethyl ketone solution of resol phenol resin (PR-11078, manufactured by Sumitomo Durez Co., Ltd.) Epoxy resin (Epicoat 828) , manufactured by Yuka Shell Co., Ltd.) 50% methyl ethyl ketone solution of novolac phenol resin (Tamanol 752, manufactured by Arayo Kagaku Co., Ltd.) - 1% methyl ethyl ketone solution of 2-ethylimidazole (adhesive on the organic insulating film side) Polyamide resin (Gratabo 2F) Epoxy resin (Epicote 828, manufactured by Yuka Shell Co., Ltd.) Novolac phenol resin (Tamanol 752, manufactured by Arayo Kagaku Co., Ltd.) 6 60 parts 14 parts 14 parts 10 Part 100 parts of 50% methyl ethyl ketone solution 8 parts 1% 2-ethylimidazole solution in methyl ethyl ketone 10 parts Comparative example] The following composition was used as the paint for the adhesive layer, and the TAB tape was made with the adhesive layer having a single layer structure. Except for the created
A film carrier tape was produced in the same manner as in Example 1.

25% isopropyl alcohol/water mixed solution of polyamide resin (Thomide TXC-232-B, manufactured by Fuji Kasei Kogyo Co., Ltd.) 60 parts 50% methyl ethyl ketone solution of resol phenol resin (CKM-1,282, manufactured by Showa Kobunshi Co., Ltd.) 6 parts Epoxy Resin (Epicote 828, manufactured by Yuka Shell Co., Ltd.) 14 parts Novolac phenol resin (Tamanol 752, manufactured by Arayo Kagaku Co., Ltd.) 50% methyl ethyl ketone solution 14 parts 2-ethylimidazole 1% methyl 7 ethyl ketone solution 10 parts Comparative Example 2 Adhesion The following composition was used as the paint for the adhesive layer, and the TAB tape was made with the adhesive layer having a single layer structure.
A film carrier tape was produced in the same manner as in Example 1.

Isopropyl alcohol/water mixed solution of polyamide resin (Platabondato 1276, manufactured by Nippon Rilsan Co., Ltd.) 100 parts Epoxy resin (Epicote 828, manufactured by Jigyo Shell Co., Ltd.) 8 parts Novolac phenol resin (Tamanol 752, manufactured by Arayo Kagaku Co., Ltd.) 8 parts 2- 10 parts of 1% methyl ethyl ketone solution of ethylimidazole (characteristic evaluation test) The following characteristic evaluation test was conducted on the film carrier tapes of Examples 1 to 3 and Comparative Examples 1 and 2.

1. Chemical resistance test 8 To investigate the adhesion between the copper foil and the adhesive layer when immersed in etching solution and electroless plating solution, 200 sail, 100 sail and 50/II! II
The adhesive strength of the copper foil pattern formed in the pattern width I was measured, and the adhesive strength after electroless plating was further measured. The results are shown in Table 1. The numbers in Table 1 are 180
The peel force was measured using a Tensilon tensile strength measuring device.

9 2. Heat-resistant adhesive A film carrier tape on which a Cu foil with a width of lc+n is formed is fixed on a 350°C hot plate so that the back side of the organic insulating film is in contact with it, and the Cu foil is 5
Peeling was performed at a peeling speed of c+n/n+jl, and the peeling force at that time was measured. The results are shown in Table 2.

As is clear from the results in Tables 1 and 2, the TAB tape of the present invention was confirmed to exhibit excellent chemical resistance and heat-resistant adhesive properties through the above test.

〔Effect of the invention〕

The TAB tape of the present invention has a laminated structure including two or more adhesive layers, and the adhesive layer on the side in contact with the organic insulating film and the adhesive layer on the side in contact with the protective layer are Because the adhesive composition has a
Even if exposed to alkali, acid, etching solution, etc. during processing steps such as plating and resist peeling, the adhesive strength to Cu foil will not deteriorate. In addition, under high temperatures during inner lead and outer lead bonding,
There is no decrease in adhesive strength to the organic insulating film.

Therefore, the TAB tape of the present invention can be applied to high-density circuits. Moreover, the TA of the present invention
B tape has high insulation reliability and does not cause problems with the insulation between the leads, so when it is used to connect the chip to an external circuit, even if the number of leads increases, it is easy to use tape on the lead part. It can be left behind. Therefore, when mounting multi-bin chips, bonding errors are less likely to occur, and leads are less likely to be deformed during the transportation process, bonding process, etc., and the yield is greatly increased.

1

[Brief explanation of drawings]

FIG. 1 is a schematic cross-sectional view of the TAB tape of the present invention, and FIG. 2 is a manufacturing process diagram of the TAB tape of the present invention. ■...Organic insulating film, 2...Adhesive layer, 2■・
...first adhesive layer, 22...second adhesive layer, 3.
··Protective film.

Claims (3)

[Claims] (1) An adhesive layer and a protective layer are provided on an organic insulating film, and the adhesive layer is composed of at least two layers,
The adhesive layer on the side in contact with the organic insulating film mainly contains polyamide resin, and the adhesive layer on the side in contact with the protective layer mainly contains polyamide resin and resol type phenolic resin. tape. (2) The TAB tape according to claim (1), wherein the content of polyamide resin in the adhesive layer on the side in contact with the organic insulating film is 50% by weight or more. (3) The TAB tape according to claim (1) or (2), wherein the content of polyamide resin in the adhesive layer on the side in contact with the protective layer is less than 50% by weight.