JPH0321861U - - Google Patents
Info
- Publication number
- JPH0321861U JPH0321861U JP1989081305U JP8130589U JPH0321861U JP H0321861 U JPH0321861 U JP H0321861U JP 1989081305 U JP1989081305 U JP 1989081305U JP 8130589 U JP8130589 U JP 8130589U JP H0321861 U JPH0321861 U JP H0321861U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- light receiving
- chip
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図及び第２図は本考案受光装置の一つの実
施例を説明するためのもので、第１図は断面図、
第２図Ａ乃至Ｅは受光装置の製造方法を工程順に
示す断面図、第３図Ａ乃至Ｄは従来の受光装置の
製造方法を工程順に示す斜視図である。
符号の説明、１……基板、２……受光素子、３
……信号処理用ＩＣチツプ、５……光学フイルタ
樹脂、６……封止用樹脂。
1 and 2 are for explaining one embodiment of the light receiving device of the present invention, and FIG. 1 is a sectional view;
2A to 2E are cross-sectional views showing a method for manufacturing a light receiving device in the order of steps, and FIGS. 3A to 3D are perspective views showing a conventional method for manufacturing a light receiving device in order of steps. Explanation of symbols, 1... Substrate, 2... Light receiving element, 3
... IC chip for signal processing, 5 ... optical filter resin, 6 ... sealing resin.
Claims (1)
理する信号処理用ＩＣチツプを少なくとも取り付
け、 上記受光素子及び信号処理用ＩＣチツプを樹脂
封止した受光装置において、 上記受光素子の受光面上に光学フイルタ樹脂を
略凸球面状に形成し、 上記光学フイルタ樹脂が形成された上記受光素
子の受光面以外の部分の領域の少なくとも上記信
号処理用ＩＣチツプ上を封止用樹脂により封止し
てなる、 ことを特徴とする受光装置。[Claims for Utility Model Registration] A light receiving device in which at least a light receiving element and a signal processing IC chip for processing an output signal of the light receiving element are mounted on a substrate, and the light receiving element and the signal processing IC chip are sealed with resin, An optical filter resin is formed in a substantially convex spherical shape on the light-receiving surface of the light-receiving element, and at least the signal processing IC chip is sealed in a region other than the light-receiving surface of the light-receiving element on which the optical filter resin is formed. A light receiving device characterized in that it is sealed with a sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989081305U JPH0321861U (en) | 1989-07-11 | 1989-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989081305U JPH0321861U (en) | 1989-07-11 | 1989-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0321861U true JPH0321861U (en) | 1991-03-05 |
Family
ID=31627129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989081305U Pending JPH0321861U (en) | 1989-07-11 | 1989-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0321861U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5089010B2 (en) * | 2000-12-21 | 2012-12-05 | 北越紀州製紙株式会社 | Air filter product for air filter |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211784A (en) * | 1975-07-17 | 1977-01-28 | Matsushita Electric Ind Co Ltd | Photo semiconductor device |
| JPS63255926A (en) * | 1987-04-13 | 1988-10-24 | Nec Corp | Hybrid integrated circuit device containing photodetector |
-
1989
- 1989-07-11 JP JP1989081305U patent/JPH0321861U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211784A (en) * | 1975-07-17 | 1977-01-28 | Matsushita Electric Ind Co Ltd | Photo semiconductor device |
| JPS63255926A (en) * | 1987-04-13 | 1988-10-24 | Nec Corp | Hybrid integrated circuit device containing photodetector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5089010B2 (en) * | 2000-12-21 | 2012-12-05 | 北越紀州製紙株式会社 | Air filter product for air filter |