JPH0321861U - - Google Patents
Info
- Publication number
- JPH0321861U JPH0321861U JP1989081305U JP8130589U JPH0321861U JP H0321861 U JPH0321861 U JP H0321861U JP 1989081305 U JP1989081305 U JP 1989081305U JP 8130589 U JP8130589 U JP 8130589U JP H0321861 U JPH0321861 U JP H0321861U
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving element
- light receiving
- chip
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図及び第２図は本考案受光装置の一つの実
施例を説明するためのもので、第１図は断面図、
第２図Ａ乃至Ｅは受光装置の製造方法を工程順に
示す断面図、第３図Ａ乃至Ｄは従来の受光装置の
製造方法を工程順に示す斜視図である。 符号の説明、１……基板、２……受光素子、３
……信号処理用ＩＣチツプ、５……光学フイルタ
樹脂、６……封止用樹脂。
施例を説明するためのもので、第１図は断面図、
第２図Ａ乃至Ｅは受光装置の製造方法を工程順に
示す断面図、第３図Ａ乃至Ｄは従来の受光装置の
製造方法を工程順に示す斜視図である。 符号の説明、１……基板、２……受光素子、３
……信号処理用ＩＣチツプ、５……光学フイルタ
樹脂、６……封止用樹脂。
Claims (1)
- 【実用新案登録請求の範囲】 基板上に受光素子と該受光素子の出力信号を処
理する信号処理用ＩＣチツプを少なくとも取り付
け、 上記受光素子及び信号処理用ＩＣチツプを樹脂
封止した受光装置において、 上記受光素子の受光面上に光学フイルタ樹脂を
略凸球面状に形成し、 上記光学フイルタ樹脂が形成された上記受光素
子の受光面以外の部分の領域の少なくとも上記信
号処理用ＩＣチツプ上を封止用樹脂により封止し
てなる、 ことを特徴とする受光装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989081305U JPH0321861U (ja) | 1989-07-11 | 1989-07-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989081305U JPH0321861U (ja) | 1989-07-11 | 1989-07-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0321861U true JPH0321861U (ja) | 1991-03-05 |
Family
ID=31627129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989081305U Pending JPH0321861U (ja) | 1989-07-11 | 1989-07-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0321861U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5089010B2 (ja) * | 2000-12-21 | 2012-12-05 | 北越紀州製紙株式会社 | エアフィルタ用濾材巻取り製品 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211784A (en) * | 1975-07-17 | 1977-01-28 | Matsushita Electric Ind Co Ltd | Photo semiconductor device |
| JPS63255926A (ja) * | 1987-04-13 | 1988-10-24 | Nec Corp | 受光動作型混成集積回路装置 |
-
1989
- 1989-07-11 JP JP1989081305U patent/JPH0321861U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211784A (en) * | 1975-07-17 | 1977-01-28 | Matsushita Electric Ind Co Ltd | Photo semiconductor device |
| JPS63255926A (ja) * | 1987-04-13 | 1988-10-24 | Nec Corp | 受光動作型混成集積回路装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5089010B2 (ja) * | 2000-12-21 | 2012-12-05 | 北越紀州製紙株式会社 | エアフィルタ用濾材巻取り製品 |