JPH0322450A - Manufacturing apparatus for semiconductor - Google Patents

Manufacturing apparatus for semiconductor

Info

Publication number
JPH0322450A
JPH0322450A JP1157722A JP15772289A JPH0322450A JP H0322450 A JPH0322450 A JP H0322450A JP 1157722 A JP1157722 A JP 1157722A JP 15772289 A JP15772289 A JP 15772289A JP H0322450 A JPH0322450 A JP H0322450A
Authority
JP
Japan
Prior art keywords
wire
tool
hole
ultrasonic horn
horn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1157722A
Other languages
Japanese (ja)
Other versions
JP2703999B2 (en
Inventor
Naoto Kimura
直人 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP1157722A priority Critical patent/JP2703999B2/en
Publication of JPH0322450A publication Critical patent/JPH0322450A/en
Application granted granted Critical
Publication of JP2703999B2 publication Critical patent/JP2703999B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent a contact with an adjacent wire of a tool, and to enable bonding by inclining the tool in the forward direction from the surface of a pellet and forming a wire through-hole in an ultrasonic horn to a pad. CONSTITUTION:A tool 1 is installed to an ultrasonic horn 7, and the wire 4 of an small-gage Al wire is passed through the wire through-hole 8 of the horn bored to the ultrasonic horn 7 and passed through the wire through-hole 3 of the tool bored to the tool and aligned by a pad 5 through a tool joing section 2. The tool 1 is mounted to the ultrasonic horn 7 at an inclination inclined in the opposite direction from the nose section of the ultrasonic horn 7, and the wire 4 is also set up vertically to the surface of a pellet 6, and the wire through-hole 3 of the tool and the wire through-hole 8 of the horn are also bored to the surface of the pellet 6 approximately vertically. The wire through- hole 8 of the horn is formed to the ultrasonic horn 7 so as to be brought to a section approximately just above the pad 5.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体製造装置に関し、特に超音波振動を利用
して内部接続を行う半導体製造装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to semiconductor manufacturing equipment, and particularly to a semiconductor manufacturing equipment that performs internal connections using ultrasonic vibrations.

〔従来の技術〕[Conventional technology]

従来、この種の半導体製造装置は、第３図（ａ）の正面
図に示す様に、従来ツール９はケース１０に固着された
ベレット６に対してほぼ垂直に位置し、ワイヤ４はペレ
ット６の面に対し９０度未満に設定してあり、かつ超音
波ホーン７に明けられたホーンのワイヤ通し穴８も９０
度未満に設けられていた。１１は配線されたワイヤを示
す。Conventionally, in this type of semiconductor manufacturing equipment, as shown in the front view of FIG. The wire through hole 8 of the ultrasonic horn 7 is set at less than 90 degrees with respect to the plane of the ultrasonic horn 7.
It was set below the limit. Reference numeral 11 indicates a wire.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の半導体製造装置は、第２図（ａ）に示し
た様に従来のツール９がペレット６に対してほぼ垂直に
取付けてあるために、第２図（ｂ）の側面図に示す様に
、隣接するＡＡ細線で配線されたワイヤ１１に接触し、
ボンディングできないという欠点があった。In the conventional semiconductor manufacturing apparatus described above, the conventional tool 9 is attached almost perpendicularly to the pellet 6 as shown in FIG. , contact the wire 11 wired with the adjacent AA thin wire,
The drawback was that bonding was not possible.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、超音波振動を利用してペレットにワイヤを接
続する半導体接続装置において、ツールが超音波ホーン
の先端部から逆方向に傾いて取り付けられると共に前記
超音波ホーンに開けられるワイヤ通し穴が前記ツールの
先端部のほぼ真上に開けられている半導体製造装置であ
る。The present invention provides a semiconductor connecting device that connects a wire to a pellet using ultrasonic vibration, in which a tool is attached to the tip of an ultrasonic horn tilting in the opposite direction, and a wire through hole formed in the ultrasonic horn is attached. This is a semiconductor manufacturing apparatus in which an opening is opened almost directly above the tip of the tool.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。第１図
は本発明の一実施例の正面図である。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a front view of one embodiment of the present invention.

ツール１は超音波ホーン７に取付けられており、Ａρ細
線のワイヤ４は超音波ホーン７に明けられたホーンのワ
イヤ通し穴８を通ってツールに明けられたツールのワイ
ヤ通し穴３を通りかつツール接合部２を経て、パッド５
にて接合される．本実施例におけるツール１は、超音波
ホーン７の先端部から逆方向に傾いた角度で超音波ホー
ン７に取り付けられ、更にワイヤ４もペレット６の面に
垂直になるように、ツールのワイヤ通し穴３及びホーン
のワイヤ通し穴８もペレット６の面に対しほぼ垂直に明
けられている。又、ホーンのワイヤ通し穴８はパッド５
のほぼ真上にくるように超音波ホーン７に設けられてい
る。又、ツール接合部２もペレット６の面に平行になる
ように形戒されている。The tool 1 is attached to an ultrasonic horn 7, and the Aρ thin wire 4 passes through a wire passing hole 8 in the horn made in the ultrasonic horn 7, passes through a wire passing hole 3 in the tool made in the tool, and then passes through a wire passing hole 3 made in the tool. After passing through the tool joint 2, the pad 5
It is joined at. The tool 1 in this embodiment is attached to the ultrasonic horn 7 at an angle tilted in the opposite direction from the tip of the ultrasonic horn 7, and the wire of the tool is passed through so that the wire 4 is also perpendicular to the surface of the pellet 6. The hole 3 and the wire passage hole 8 of the horn are also opened approximately perpendicularly to the surface of the pellet 6. Also, the wire through hole 8 of the horn is connected to the pad 5.
The ultrasonic horn 7 is provided so as to be located almost directly above the ultrasonic horn 7. Further, the tool joint portion 2 is also shaped so as to be parallel to the surface of the pellet 6.

〔発明の効果〕〔Effect of the invention〕

以上説明した様に本発明は、ツールをペレット表面から
前方に傾け、かつ超音波ホーンにおけるワイヤ通し穴を
パッドのほぼ真上に設けることにより、近接したワイヤ
間隔の状態でも、ツールが隣接するワイヤに接触しなく
なるためボンディングが可能になるという効果がある。As explained above, the present invention tilts the tool forward from the pellet surface and provides the wire through hole in the ultrasonic horn almost directly above the pad. This has the effect of making bonding possible because there is no contact between the two.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明の一実施例の正面図、第２図（ａ）は従
来の半導体製造装置の正面図、第２図（ｂ）は従来の配
線状態を示す側面図である。 １・・・ツール、２・・・ツール接合部、３・・・ツー
ルのワイヤ通し穴、４・・・ワイヤ、５・・・パッド、
６・・・ペレット、７・・・超音波ホーン、８・・・ホ
ーンのワイヤ通し穴、９・・・従来ツール、１０・・・
ケース、１１・・・配線されたワイヤ。FIG. 1 is a front view of an embodiment of the present invention, FIG. 2(a) is a front view of a conventional semiconductor manufacturing apparatus, and FIG. 2(b) is a side view showing a conventional wiring state. DESCRIPTION OF SYMBOLS 1... Tool, 2... Tool joint, 3... Wire through hole of tool, 4... Wire, 5... Pad,
6... Pellet, 7... Ultrasonic horn, 8... Horn wire through hole, 9... Conventional tool, 10...
Case, 11...wires wired.

Claims (1)

【特許請求の範囲】[Claims] 超音波振動を利用してペレットにワイヤを接続する半導
体接続装置において、ツールが超音波ホーンの先端部か
ら逆方向に傾いて取り付けられると共に前記超音波ホー
ンに開けられるワイヤ通し穴が前記ツールの先端部のほ
ぼ真上に開けられていることを特徴とする半導体製造装
置。In a semiconductor connection device that connects a wire to a pellet using ultrasonic vibration, a tool is installed tilting in the opposite direction from the tip of an ultrasonic horn, and a wire passage hole made in the ultrasonic horn is attached to the tip of the tool. A semiconductor manufacturing device characterized by having an opening almost directly above the section.
JP1157722A 1989-06-19 1989-06-19 Semiconductor manufacturing equipment Expired - Fee Related JP2703999B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1157722A JP2703999B2 (en) 1989-06-19 1989-06-19 Semiconductor manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1157722A JP2703999B2 (en) 1989-06-19 1989-06-19 Semiconductor manufacturing equipment

Publications (2)

Publication Number Publication Date
JPH0322450A true JPH0322450A (en) 1991-01-30
JP2703999B2 JP2703999B2 (en) 1998-01-26

Family

ID=15655941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1157722A Expired - Fee Related JP2703999B2 (en) 1989-06-19 1989-06-19 Semiconductor manufacturing equipment

Country Status (1)

Country Link
JP (1) JP2703999B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495976A (en) * 1994-05-27 1996-03-05 Kulicke And Soffa Investments, Inc. Tilted wedge bonding tool
JP2014027234A (en) * 2012-07-30 2014-02-06 Nagano Keiki Co Ltd Wire bonding device and wire bonding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5495976A (en) * 1994-05-27 1996-03-05 Kulicke And Soffa Investments, Inc. Tilted wedge bonding tool
JP2014027234A (en) * 2012-07-30 2014-02-06 Nagano Keiki Co Ltd Wire bonding device and wire bonding method

Also Published As

Publication number Publication date
JP2703999B2 (en) 1998-01-26

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