JPH03225820A - Improvement of film quality - Google Patents
Improvement of film qualityInfo
- Publication number
- JPH03225820A JPH03225820A JP2020287A JP2028790A JPH03225820A JP H03225820 A JPH03225820 A JP H03225820A JP 2020287 A JP2020287 A JP 2020287A JP 2028790 A JP2028790 A JP 2028790A JP H03225820 A JPH03225820 A JP H03225820A
- Authority
- JP
- Japan
- Prior art keywords
- film
- thin film
- anode
- cathode
- groups
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はSiウェハーなどに所定薄膜の形成などに好適
な薄膜の膜質改善方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for improving the film quality of a thin film suitable for forming a predetermined thin film on a Si wafer or the like.
−層詳細には、形成された薄膜に加速イオンが衝突し、
この衝撃効果による薄膜形成分子が叩き込まれる作用を
生起せしめることにより、薄膜表面がより平滑化され、
さらに薄膜の密着(付着)強1ならびに有機汚染膜が除
去されて薄膜表面の清浄がそれぞれ向上するようにした
ものである。- Layer details include accelerated ions colliding with the formed thin film,
By causing the thin film-forming molecules to be hammered in by this impact effect, the thin film surface becomes smoother.
Furthermore, the adhesion (adhesion) strength of the thin film and the cleanliness of the thin film surface are improved by removing organic contaminants.
従来、グロー放電によるイオン照射として知悉されるイ
オンボンバード(ion Boombard)法はS
iウェハーなどに薄膜が形成される直前の清浄のみにに
多用されている。Conventionally, the ion bombard method, which is known as ion irradiation using glow discharge, is S
It is often used only for cleaning just before a thin film is formed on an i-wafer or the like.
第2図にイオン照射による清浄装置を示す。Figure 2 shows a cleaning device using ion irradiation.
符号2は真空槽であり、4は陰極、6は陽極、8はSi
ウェハーなどの基板である。Reference numeral 2 is a vacuum chamber, 4 is a cathode, 6 is an anode, and 8 is a Si
A substrate such as a wafer.
この真空槽2にArガス(稀ガス)を流入せしめ、さら
に陰極4、陽極6間に電圧を印加する。Ar gas (rare gas) is introduced into the vacuum chamber 2, and a voltage is applied between the cathode 4 and the anode 6.
これによりグロー放電の放電空間が形成され、基板8に
加速されたイオン(Ar+)群9が衝突する。This forms a discharge space for glow discharge, and the accelerated ion (Ar+) group 9 collides with the substrate 8.
このようにして基板8の清浄が行われる。In this way, the substrate 8 is cleaned.
しかしながら、前記の従来の技術のイオン照射はSiウ
ェハーなどの清浄に用いられるものであり、薄膜表面の
平滑化、薄膜の密着強化に供された例は現況において見
当たらない。However, the conventional ion irradiation described above is used for cleaning Si wafers, etc., and there are currently no examples of it being used for smoothing the surface of a thin film or strengthening the adhesion of a thin film.
本発明は上記の課題に鑑みてなされ、加速イオンを1膜
へ衝突せしめ、この際の薄膜形成分子が叩き込まれる作
用により、薄膜表面の平滑化、薄膜の密着の強化、薄膜
表面の清浄化に優れる薄膜のM’l改善方法を捉供する
ことを目的とする。The present invention was made in view of the above-mentioned problems, and by colliding accelerated ions into a single film, the thin film-forming molecules are driven into the film, thereby smoothing the thin film surface, strengthening the adhesion of the thin film, and cleaning the thin film surface. The purpose of this invention is to provide an excellent method for improving M'l of thin films.
[課題を解決するための手段]
前記の課題を解決するために、本発明の薄膜の膜質改善
方法において、ガスを有した真空槽内に配設される陰極
と陽極に電圧が印加され、生起したグロー放電の放電空
間に生起するイオンが陽極に対向した基板の薄膜に衝突
することを特徴とする。[Means for Solving the Problems] In order to solve the above problems, in the method for improving the film quality of a thin film of the present invention, a voltage is applied to a cathode and an anode arranged in a vacuum chamber containing a gas, The ions generated in the discharge space of the glow discharge collide with the thin film of the substrate facing the anode.
上記において、形成された薄膜に加速イオンが衝突して
、薄膜形成分子が叩き込まれる作用を生起する。In the above process, accelerated ions collide with the formed thin film, causing an action in which the thin film-forming molecules are driven into the film.
これにより、薄膜表面が平滑化され、さらに薄膜の密着
が強化されるとともに有機汚染膜が除去される。As a result, the surface of the thin film is smoothed, the adhesion of the thin film is further strengthened, and the organic contamination film is removed.
〔実施例〕
次に、本発明に係る薄膜の膜質改善方法の一実施例を添
付図面を参照して詳細に説明する。[Example] Next, an example of the method for improving the film quality of a thin film according to the present invention will be described in detail with reference to the accompanying drawings.
第1図は実施例の説明に供されるイオン照射装置の概略
構成図である。FIG. 1 is a schematic configuration diagram of an ion irradiation device used for explaining an embodiment.
第1図において、符号12は真空槽であり、14は陰極
、16は陽極、18はSiウェハーなどの基板であり、
この基板18は、必要に応じてこの真空槽内で上記従来
例で述べたのとどうように、その表面を清浄し、その後
数千人程度の薄膜18a(例えば、電極用の薄l1l)
が、この真空槽内で基体18bに設けられている。In FIG. 1, numeral 12 is a vacuum chamber, 14 is a cathode, 16 is an anode, 18 is a substrate such as a Si wafer,
The surface of this substrate 18 is cleaned as necessary in the vacuum chamber as described in the conventional example above, and then a thin film 18a (for example, a thin layer for electrodes) of several thousand layers is applied.
is provided on the base body 18b within this vacuum chamber.
なお符号19は陰極14と陽極16に所定の電圧を印加
するための電圧印加部である。Note that the reference numeral 19 is a voltage applying section for applying a predetermined voltage to the cathode 14 and the anode 16.
この真空槽12にA「ガス(稀ガス)が予め流入(充填
)している、さらに陰極14、陽8i16に電圧を印加
される。これによるグロー放電の放電空間が形成され、
陽極16から陰極14に向かう加速イオン(Ar+)群
20が生起する。Gas A (rare gas) is pre-flowed (filled) into this vacuum chamber 12, and a voltage is applied to the cathode 14 and the positive 8i16.This forms a discharge space for glow discharge.
Accelerated ion (Ar+) groups 20 are generated from the anode 16 toward the cathode 14.
この場合、加速イオン(Ar+)群20が基118の薄
膜18aに衝突する。ここで衝突した加速イオン(Ar
−t−)群20により薄膜18aの形成分子が叩き込ま
れる作用を生じる。In this case, accelerated ion (Ar+) groups 20 collide with the thin film 18a of the base 118. Accelerated ions (Ar
-t-) group 20 produces an effect in which molecules forming the thin film 18a are hammered into the group 20.
これにより、薄膜18aの表面が平滑化される。さらに
薄膜の密着が強化される0例えば、本発明が実施された
事例において、従来例に比較し密着強度が30〜40%
向上するものとなり、その改善が顕著であった。This smoothes the surface of the thin film 18a. Furthermore, the adhesion of the thin film is strengthened. For example, in cases where the present invention was implemented, the adhesion strength was 30 to 40% compared to the conventional example.
The improvement was significant.
また比較的厚膜である有機汚染膜が除去され、11表面
の清浄化が向上する。In addition, a relatively thick organic contamination film is removed, and the cleaning of the surface of 11 is improved.
なお、上記実施例の説明で用いたイオン照射装!にかか
わらず本発明の作用効果を逸脱しない範囲でどのような
装置を用いても良いことは勿論である。In addition, the ion irradiation device used in the explanation of the above example! Of course, any device may be used without departing from the effects of the present invention.
以上のように、本発明の薄膜の膜質改善方法によれば、
稀ガスを有した真空槽内に配設される陰極と陽極に電圧
が印加され、生起したグロー放電の放電空間に生起する
イオンが陽極に対向したS板の1膜に衝突することを特
徴としている。As described above, according to the method for improving thin film quality of the present invention,
A voltage is applied to a cathode and an anode placed in a vacuum chamber containing a rare gas, and the ions generated in the discharge space of the glow discharge that occur collide with one membrane of the S plate facing the anode. There is.
これにより、形成されたallに加速イオンが衝突して
、その衝撃効果による薄膜の形成分子が叩き込まれる作
用が生起するものとなり、薄膜表面が平滑化され、さら
に薄膜の密着強度ならびに有機汚染膜が除去されて薄膜
表面の清浄化がそれぞれ向上する効果を奏する。As a result, the accelerated ions collide with the formed all, and the impact effect causes the molecules forming the thin film to be hammered in, smoothing the thin film surface and further improving the adhesion strength of the thin film and the organic contamination film. When removed, the cleaning of the thin film surface is improved.
第1図は本発明の薄膜の膜質改善方法に係る実施例の説
明に供されるイオン照射装置の概略構成図、第2図は従
来の技術の説明に供されるイオン照射による清浄装置の
概略構成図である。
12・・・真空槽、 14・・・陰極、16・・・
陽極、 18・・・基板、18a−1膜、
18 b −・・基体、20・・・加速イオン群。FIG. 1 is a schematic configuration diagram of an ion irradiation device used to explain an embodiment of the thin film quality improvement method of the present invention, and FIG. 2 is a schematic diagram of a cleaning device using ion irradiation used to explain a conventional technique. FIG. 12... Vacuum chamber, 14... Cathode, 16...
anode, 18...substrate, 18a-1 film,
18 b - Base, 20 Accelerated ion group.
Claims (1)
印加され、生起したグロー放電の放電空間に生起するイ
オンが陽極に対向した基板の薄膜に衝突することを特徴
とする薄膜の膜質改善方法。A thin film characterized in that a voltage is applied to a cathode and an anode arranged in a vacuum chamber containing gas, and ions generated in the discharge space of a glow discharge that occur collide with a thin film of a substrate facing the anode. Method for improving film quality.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020287A JPH03225820A (en) | 1990-01-30 | 1990-01-30 | Improvement of film quality |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020287A JPH03225820A (en) | 1990-01-30 | 1990-01-30 | Improvement of film quality |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03225820A true JPH03225820A (en) | 1991-10-04 |
Family
ID=12022955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020287A Pending JPH03225820A (en) | 1990-01-30 | 1990-01-30 | Improvement of film quality |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03225820A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5976328A (en) * | 1996-01-26 | 1999-11-02 | Hitachi, Ltd. | Pattern forming method using charged particle beam process and charged particle beam processing system |
-
1990
- 1990-01-30 JP JP2020287A patent/JPH03225820A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5976328A (en) * | 1996-01-26 | 1999-11-02 | Hitachi, Ltd. | Pattern forming method using charged particle beam process and charged particle beam processing system |
| US6344115B1 (en) | 1996-01-26 | 2002-02-05 | Hitachi, Ltd. | Pattern forming method using charged particle beam process and charged particle beam processing system |
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