JPH0322596A - Structure for and method of cooling integrated circuit device - Google Patents

Abstract

PURPOSE:To eliminate the dispersion of a cooling structure in cooling effect at cooling work and to efficiently cool a board on which components different in heat release value are mounted by a method wherein a fence is provided above an integrated circuit so as to shut off the parallel jet of coolant which moves in parallel after the coolant jetted from an nozzle is made to hit an integrated circuit. CONSTITUTION:Passing through a coolant path, coolant F1 is jetted out from a nozzle 7 against the surface of an integrated circuit element 2, air jet F3 spouted out from the nozzle 7 absorbs heat released from the integrated circuit element 2 to cool the integrated circuit 2. The coolant 7 which hits the integrated circuit element 2 moves rightwards as a parallel flow F2 by the exhaust action of an exhaust fan. Two or more integrated circuit elements 2 are mounted on a board 1, and as the nozzles 7 are provided corresponding to these elements 2, the parallel flow F2 interferes with the air jet F3 to arouse trouble to cooling action. Therefore, a box-type fence 8 whose four sides are surrounded by a frame is provided onto the integrated circuit element 2 to restrict the movement of the parallel flow F2.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a cooling structure for an integrated circuit element and a method for cooling the same, and in particular to a cooling structure for an integrated circuit element in which the integrated circuit element is cooled by jetting cold air from a nozzle onto the surface of the integrated circuit element. The first invention relates to a cooling structure and a cooling method thereof, and is aimed at eliminating variations during cooling and efficiently cooling a board on which components having different calorific values are mounted. In a cooling structure for an integrated circuit element, which cools the integrated circuit element by jetting a refrigerant from a nozzle to the circuit element, the refrigerant jetted from the nozzle collides with the integrated circuit element, and then moves in parallel. A fence is formed on the integrated circuit element to block the parallel jet flow generated by the integrated circuit element, and the second invention is implemented by co-mounting the integrated circuit element and a component having a heat generation amount smaller than that of the integrated circuit element. In the cooling structure for an integrated circuit device, the cooling structure includes a substrate made of A method for cooling an integrated circuit device comprising colliding the refrigerant from a nozzle to cool the integrated circuit device, the method comprising a first step in which the refrigerant injected from the nozzle moves in parallel after colliding with the integrated circuit device. The parallel flow of the invention is used to cool the component.

[Industrial application field]

The present invention relates to a cooling structure for an integrated circuit element and a method for cooling the same, and more particularly to a cooling structure for an integrated circuit element that cools the integrated circuit element by jetting cold air from a nozzle onto the surface of the integrated circuit element, and for cooling the integrated circuit element. It is about the method.

[Conventional technology]

FIG. 5 shows a conventional cooling structure, in which 41 is a substrate, 42 is an integrated circuit element, 43 is a bump, 44 is an intake fan, 45 is a chamber, 46 is a coolant passage, 47 is a nozzle,
48 is a terminal resistor, 49 is a rear wall, F4 is a refrigerant, F5 is a parallel flow, and F6 is a colliding jet.

Conventionally, as a method for cooling a board 41 on which an integrated circuit element 42 and a component whose heat value is smaller than that of the integrated circuit element, such as a terminating resistor 48, are mounted together, coolant F4 is sucked into the end. A chamber 45 is attached to the substrate 4, and has an intake fan 44, and a refrigerant passage 46 through which the refrigerant F4 passes, and a nozzle 47 protruding from one side of the refrigerant passage 46.
Refrigerant F4 is applied from the nozzle 47 to each integrated circuit element 42 and the terminating resistor 48 mounted on the substrate 41.
was injected to forcibly cool down the heat generated from the integrated circuit element 42 and the terminating resistor 48.

[Problem to be solved by the invention]

However, in the past, there was a problem in that the parallel flow that moves in parallel after the refrigerant injected from the nozzle collides with the integrated circuit element or the terminating resistor interferes with the colliding jet flow on the leeward side, causing variations in cooling.

In other words, originally, the center of the integrated circuit element (terminal resistor) and the center of the nozzle were arranged in a straight line so that the collision jet after colliding with the integrated circuit element (terminal resistor) would move uniformly from side to side over the surface of the integrated circuit element. This prevents variations in cooling between the left and right sides. However, as the parallel flow interferes with the impinging jet on the lee side, the linear relationship described above is broken, causing variations in cooling.

Furthermore, in the past, refrigerant was injected from a nozzle onto all components mounted on the board (integrated circuit elements and terminating resistors), making it difficult to provide optimal cooling for each component mounted on the board. . In other words, since the amount of heat generated by the integrated circuit element and the terminating resistor are different, it has been difficult to adjust the air volume in accordance with the amount of heat generated by each component. One possible way to adjust the air volume is to vary the nozzle diameter, but this has the disadvantage of complicating the structure itself.

Therefore, the objective is to eliminate variations in cooling and to efficiently cool a board on which components having different amounts of heat are mounted.

[Means to solve the problem]

This purpose is firstly to provide an integrated circuit device cooling structure in which a refrigerant is ejected from a nozzle to cool the integrated circuit device mounted on a substrate. A cooling structure for an integrated circuit device, characterized in that a fence is formed on the integrated circuit device to block parallel jets that move in parallel after the refrigerant collides with the integrated circuit device; An integrated circuit element comprising: a substrate on which a component and a component having a calorific value smaller than the calorific value of the integrated circuit element are mounted; and a chamber having a refrigerant passage in which a nozzle for injecting refrigerant is formed. A method of cooling an integrated circuit element by colliding the refrigerant from the nozzle against the integrated circuit element mounted on the substrate to cool the integrated circuit element. A method for cooling an integrated circuit device, characterized in that the component is cooled using a parallel flow according to claim 1, wherein the refrigerant injected from the cooling medium moves in parallel after colliding with the integrated circuit device. be done.

[Effect]

By employing the above structure and method, in the present invention, the parallel flow that moves in parallel toward the leeward side after colliding with the integrated circuit element can be moved by a fence provided on the surface of the integrated circuit element on the leeward side. is restricted, and interference with the jet stream injected to the integrated circuit element on the leeward side is reduced.

Furthermore, in the present invention, coolant is jetted from a nozzle to cool only the integrated circuit element, which is a heat generating element with a relatively large amount of heat among the components mounted on the board, and the coolant is injected from the nozzle to the leeward side that collides with the integrated circuit element. By cooling components such as a terminating resistor that generate a relatively small amount of heat using a parallel flow that moves parallel to the substrate, it becomes possible to perform cooling corresponding to the amount of heat generated by each component mounted on the board.

〔Example〕

Hereinafter, first and second embodiments of the present invention will be described in detail.

FIG. 1 is a diagram showing a first embodiment of the invention, and FIG. 2 is a diagram showing a second embodiment of the invention.

1 and 2, 1 is a substrate, 2 is an integrated circuit element, 3 is a bump, 4 is a first intake fan, 5 is a chamber, 6 is a refrigerant passage, 7 is a nozzle, 8 is a 7 8 fence, 9 is the adhesive, 10 is the second intake fan, l1
is a terminal resistance, F1 is a refrigerant, F2 is a parallel flow, and F3 is a colliding jet.

Note that the same reference numerals in FIG. 1 and FIG. 2 indicate the same objects.

First, a first example will be described.

A plurality of integrated circuit elements 2 are mounted on a substrate 1,
Electrical continuity is established between the bonded portions via the bumps 3. On the other hand, in order to cool the integrated circuit element 2 by air cooling, a coolant F1 is taken in from the left side in FIG.
A nozzle 7 is formed on two side surfaces of the refrigerant passage 6 on the integrated circuit element side, corresponding to the mounting position of the integrated circuit element 2 and arranged perpendicularly to the surface of the integrated circuit element 2. A chamber 5 is provided. The refrigerant F1 that has passed through the refrigerant passage 6 is injected from the nozzle 7 onto the surface of the integrated circuit element 2, and the jet stream F3 causes the integrated circuit element 2 to
The heat emitted from the integrated circuit element 2 is removed, and the integrated circuit element 2 is cooled. Although not shown, the coolant F3 that has collided with the integrated circuit element 2 moves to the right as a parallel flow F2 due to the exhaust action of the exhaust fan provided on the right side of FIG.

A plurality of integrated circuit elements 2 are mounted on the substrate l,
Since the nozzles 7 are provided corresponding to these integrated circuit elements 2, this parallel flow F2 is caused by the colliding jet flow F3 on the lee side.
This causes interference and causes problems with cooling. For this reason, a box-like fence 8 is provided on the surface of the integrated circuit element 2, which is surrounded by a frame on all sides and restricts the migration of the parallel flow F2. As shown in Figure 2, this joint has a structure in which it is fixed using an adhesive 9 with excellent thermal conductivity, as well as a structure in which one end of the fence is extended and a notch is provided in the extension. It may also be a pressure contact structure that presses the side surface of the integrated circuit element. Furthermore, the positional relationship in the height direction between the fence 8 and the nozzle 7 is determined by considering improvements in cooling efficiency, etc.
As shown in FIG. 1, one end of the fence 8 and one end of the nozzle 7 overlap each other by a length l.

Regarding the second embodiment of the present invention, FIG. 10 I will explain using

The board 1 in FIG. 3 has a plurality of terminating resistors l1 mounted thereon in consideration of the integrated circuit element 2 and its mounting density (
e.g. between integrated circuit elements). The amount of heat generated by this terminating resistor l1 is generally smaller than that of the integrated circuit element 2. The present invention focuses on this point and uses the refrigerant F3 injected from the nozzle 7 (after all, injection cooling is known to have good cooling efficiency), and also determines the mounting position of the terminating resistor l1. After colliding with the integrated circuit element 2 without forming a nozzle 7,
The terminating resistor 11 is cooled using the parallel flow F2 that moves in parallel. This parallel flow F2 is connected to the integrated circuit element 2.
Although it is slightly warmed by taking away the heat emitted by 1, it is sufficiently possible to take away the heat emitted from 1 and cool down the terminating resistor l1.

However, in Fig. 3 (the same is true in Fig. 1 explained earlier), an exhaust fan is provided on the right side of Fig. 3, and the refrigerant is heated by the exhaust operation of this exhaust fan. is exhausted to the outside of the cooling device.
As shown in the figure, stagnation of the refrigerant flow occurs near the exhaust fan 13 due to the influence of the parallel flow (in Figure 4,
(area surrounded by a broken line), there is a problem that adversely affects cooling efficiency. For this reason, in this example, a fence 8 is provided in order to improve the exhaust capacity, thereby reducing the influence of the parallel flow F2 and eliminating the above-mentioned flow stagnation.

Furthermore, by providing a second intake fan IO, the cooling capacity can be further improved.

[Effects of the Invention] As described above in detail, the present invention has the following advantages.

■ Cooling capacity is stabilized because a fence is installed to eliminate interference between parallel flow and colliding jets.

■Only the integrated circuit element is injected from the nozzle, and the terminating resistor, which generates less heat than the integrated circuit element, is cooled using parallel jets that also serve as parallel flow exhaust, so compared to conventional methods, Therefore, the structure of the device itself can be simplified.

11 12

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a first embodiment of the present invention, FIG. 2 is a diagram showing a fence joining structure of the present invention, and FIG. 3 is a diagram showing a second embodiment of the present invention.
FIG. 4 is a diagram showing the flow of refrigerant in the present invention, and FIG. 5 is a diagram showing a conventional cooling structure. In the figure, l is the substrate, 2 is the integrated circuit element, 5 is the chamber, 6 is the coolant passage, 7 is the nozzle, 8 is the fence, 11 is the component (terminal resistor), F1 is the coolant, F2 is the parallel flow, and F3 is the injection The jets are shown respectively. 13 $ 1 11 1 = Chaos of Cloth, Minato Neo
Figure 4

Claims (2)

[Claims] (1). Integrated circuit element (2) mounted on substrate (1)
In contrast, in a cooling structure for an integrated circuit element in which the integrated circuit element (2) is cooled by injecting a refrigerant (F1) from a nozzle (7), the refrigerant (F1) injected from the nozzle (7) ) collides with the integrated circuit element (2), and a fence (8) is formed on the integrated circuit element (2) to block the parallel flow (F2) moving in parallel. structure. (2). integrated circuit element (2) and the integrated circuit element (2)
A chamber (1) having a substrate (1) formed by co-mounting components (11) having a calorific value smaller than the calorific value of 5) Colliding the coolant (F1) from the nozzle (7) against the integrated circuit element (2) mounted on the substrate (1) in the integrated circuit element cooling structure comprising: A method for cooling an integrated circuit element, comprising: cooling the integrated circuit element (2) by cooling the integrated circuit element (2), the method comprising: after the refrigerant (F1) injected from the nozzle (7) collides with the integrated circuit element (2); A method for cooling an integrated circuit device, characterized in that the component (11) is cooled using the parallel flow (F2) according to claim 1, which moves in parallel.