JPH02237200A - Cooling structure of integrated circuit - Google Patents

Abstract

PURPOSE:To keep the sufficient cooling ability in spite of the increase of electric power dissipation caused by the enhancement of integration of an integrated circuit by jetting an inert fluid from nozzles directly against the plural integrated circuits mounted on a wiring board. CONSTITUTION:In a counter bore 5 of a cooling container 4, a nozzle for jetting an inert fluid 6 supplied from a suction header 8 onto an upper surface of an integrated circuit 1 is arranged. When the inert fluid 6 is introduced from an inlet 7 of the cooling container 4, it fills up the suction header 8 and is jetted from the nozzle against the upper surfaces of integrated circuits 1. The inert fluid 6 deprives the heat from the integrated circuits 1 directly and then it flows to an exhaust header 10 and is exhausted outside through an outlet 11. As a result, the heat resistance from a heat generating part to a cooling medium in the integrated circuits 1 is reduced substantially. Then, the cooling ability becomes sufficient even if the integration of an integrated circuit chip is further promoted and the electric power consumption is enhanced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for an integrated circuit constituting an electronic device such as an information processing device.

[Conventional technology]

Conventionally, an example of a cooling structure for an integrated circuit is shown in Fig. 2 (S
．． Oktay, H. C Kammerer'A Can
duftion-Cooled Module for
High-Performance LSI De
vtcesIBM J RES DEVELOP Vo
20 No I Jan, 1932], a piston 204 is pressed against an integrated circuit 201 (mounted on a wiring board 202 provided with an I/O bin 203) by a spring 205, and heat is taken away, and helium gas 210 is filled with the heat. The cooling plate 2 passes through the hat 206 and the intervening layer 207.
Several structures have been put into practical use, including a structure in which heat is transmitted to the refrigerant 209 and radiated to the refrigerant 209.

Further, Japanese Patent Application Laid-open No. 160150/1983 discloses an example of a cooling device that utilizes colliding jets of liquid refrigerant. That is,
As shown in FIG. 3, a heat transfer board 303 on which an integrated circuit chip 301 is mounted is attached to a printed circuit board 302, a bellows 307 having a heat transfer plate 305 at its tip is attached to a cooling header 308, and the heat transfer plate 305 is attached to the cooling header 308. Deformable heat transfer body 3
04 to the heat transfer substrate 303, and the bellows 30
7, liquid refrigerant is ejected from a nozzle 306.

The heat generated in the chip 301 is transmitted through the heat transfer substrate 303, the deformable heat transfer body 304, and the heat transfer plate 305, and is removed by the liquid coolant jetted out from the nozzle 306.

[Problem to be solved by the invention]

Among the conventional integrated circuit cooling structures described above, the structure shown in FIG. Although a gap is provided between the spherical hat 206 and the piston 204,
This reduces the effective heat transfer area and also reduces the cooling capacity. Further, the coolant flow path in the cooling plate 208 is formed for the purpose of heat transfer by forced convection, and the obtained heat transfer coefficient is 0.1 to 0. 5 w/cni"c, and as integrated circuits become more highly integrated and power consumption increases, the cooling capacity becomes insufficient.

In the structure shown in FIG. 3, since the bellows 307 with floating flesh is used, corrosion occurs and holes are formed in the bellows 307.
There is a risk of liquid refrigerant leaking.

[Means to solve the problem]

A cooling structure for an integrated circuit according to the present invention includes a wiring board, a plurality of integrated circuits mounted on the wiring board, a board frame for holding the wiring board, and a plurality of counterbore holes in close contact with the wiring board for the integrated circuits. The inert liquid that has been supplied to the suction header is ejected from nozzles provided in each of the counterbore holes to collide with each of the integrated circuits, and the inert liquid that has been ejected into the counterbore holes is collected in the discharge header. and a cooling container for discharge.

〔Example〕

Next, the present invention will be explained with reference to the drawings. FIG. 1 is a sectional view showing one embodiment of the present invention. 1 is an integrated circuit; 2 is a wiring board on which a plurality of integrated circuits are arranged in a matrix;
A board frame 3 that holds the board is fixed. A cooling container 4 has counterbore holes 5 that cover each integrated circuit 1 and separate the integrated circuits 1, and an inert liquid 6 is placed in the cooling container 4.
A suction header 8 that distributes and supplies the inert liquid 6 sucked in from the suction port to each counterbore hole 5, a discharge header 10 that collects the inert liquid 6 discharged from each counterbore hole 5, and a discharge header 10 that collects the inert liquid 6 discharged from each counterbore hole 5. A discharge port 11 is provided for discharging the inert liquid 6 from the cooling container 4 to the outside. A nozzle 9 is provided in the counterbore 5 of the cooling container 4 for spouting the inert liquid 6 supplied from the suction header 8 onto the upper surface of the integrated circuit 2. When the inert liquid 6 flows in through the suction port 7 of the cooling container 4, it fills the suction header 8, is ejected from the nozzle 9, and collides with the top surface of the integrated circuit 2. The collided inert liquid 6 directly removes heat from the integrated circuit 2, flows to the discharge header 10, and is discharged from the discharge port 11 to the outside.

The inert liquid 6 that directly takes heat from the integrated circuit 2 and discharges it to the outside has electrical insulation properties and is made of metal, plastic,
Use a liquid that does not attack rubber, etc. [Effects of the Invention] As explained above, the present invention reduces the thermal resistance from the heat generating part of the integrated circuit to the coolant by directly colliding a jet of inert liquid with a nozzle onto a plurality of integrated circuits mounted on a wiring board. Since the number of steps is reduced by several stages, the cooling capacity can be sufficiently satisfied even if the integrated circuit chips become more highly integrated and the power consumption increases. Furthermore, by configuring a cooling container that is less susceptible to corrosion, it is possible to provide a highly reliable cooling structure that is not affected by refrigerant leakage or the like.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention, and FIGS. 2 and 3 are sectional views showing a conventional cooling structure for an integrated circuit. DESCRIPTION OF SYMBOLS 1... Integrated circuit, 2... Wiring board, 3... Board frame, 4... Cooling container, 5... Countersunk hole, 6... Inert liquid, 7... Inlet, 8... Suction header, 9...
・Nozzle, 1o...discharge header, 11...discharge port,
201... Integrated circuit, 202... Wiring board, 203
...I/O bin, 204...Piston, 205...
・Spring, 206... Hat, 207... Intervening layer, 2
08... Cooling plate, 209... Refrigerant, 301... Chip, 302... Printed circuit board, 303... Heat transfer board, 304... Deformable heat transfer body, 305... Hot plate, 306... Nozzle, 307... Bellows, 308
...Cooling header.

Claims (1)

[Claims] A wiring board, a plurality of integrated circuits mounted on the wiring board, a board frame holding the wiring board, and a circuit board that is in close contact with the wiring board and covers each of the integrated circuits with a plurality of counterbore holes and is supplied to the suction header section. and a cooling container for ejecting an inert liquid from nozzles provided in each of the counterbore holes to collide with each of the integrated circuits, and collecting and discharging the inert liquid ejected into the counterbore holes in a discharge header section. Features a cooling structure for integrated circuits.