JPH03228352A - Semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a semiconductor device which has such a circuit pattern as easily designed for a printed board by users and which has such pin locations as appointed for output terminals by users by changing freely the connection of output signals and output terminals by changing one optional piece of exposure masks in the wafer process. CONSTITUTION:In a semiconductor integrated circuit unit which has output circuits 3, 4 including the plural number of output terminals 7, 8, the connecting situation of output signals and the output terminals 7, 8 can be changed freely by changing one optional piece of exposure masks in the wafer process. For example, in the case that a user knows that a pattern interconnection of a printed board can be done easily and the size of the printed board can be reduced if a signal or data of a signal generation circuit 1 is output from a pad 8 and a signal or data of a signal generation circuit 2 is output from a pad 7, the user requests a semiconductor manufacturer to change the locations of connecting points from 11 and 12 to 13 and 14 for a contact pattern in a semiconductor pattern layout and the semiconductor manufacturer changes a mask in a contact process at the request of the user.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device (driver IC) having multiple output terminals such as an LCD, an LED, and a PDP.

[Conventional technology]

FIG. 2 is a diagram showing the configuration of a general conventional semiconductor integrated circuit. In the figure, (1) and (2) are signal generation circuits that generate or store signals or data, and (3) and (4) are signal generation circuits that generate or store signals or data. Output circuits that output signals or data from signal generation circuits (1) and (2) to the outside of the integrated circuit, respectively; (5) and (6) are signal generation circuits (1), output circuits (3), and signal generation circuits; Wiring connecting (2) and output circuit (4), (7),
(8) is an output terminal (pad) included in each of the output circuits (3) and (4).

Next, the operation will be explained. The signal generated by the signal generation circuit (1) is sent to the output circuit (3) via the wiring (5).
Since the signal is connected to the pad (7), the signal is output to the outside of the semiconductor integrated circuit through the pad (7). Further, the signal generated by the signal generation circuit (2) is transmitted to the output circuit (
4), the output is always output to the outside of the semiconductor integrated circuit through the pad (3).

[Problem to be solved by the invention]

Since conventional semiconductor integrated circuits are configured as described above, the pads (package pin terminals) to which signals are output are predetermined, and the user of the semiconductor device must follow these determined pin assignments. We design and manufacture printed circuit boards for wiring between semiconductor devices or between semiconductor devices and other electronic components. Basically, output signals from semiconductor devices differ from input signals that can be shared, and require a dedicated wiring pattern for each signal. Therefore, output signal lines occupy the most wiring area on a printed circuit board. .

In particular, for semiconductor devices with multiple output terminals such as LCD drivers, it is extremely difficult to design the wiring and how to minimize the area of the printed circuit board that incorporates the stiffness, and sometimes wiring is impossible with a wiring pattern on only one side. There were some problems, such as in some cases.

This invention was made to solve the above-mentioned problems, and to make it easier for users who design wiring patterns for printed circuit boards, it is possible to create a semiconductor device in which the pin arrangement of output terminals can be specified by the user. The purpose is to obtain.

[Means for solving problems]

In the semiconductor device according to the present invention, signal connections within the semiconductor device can be changed by changing one exposure mask in a wafer process step.

[Effect]

The exposure mask in the present invention is changed according to user specifications, and by changing the connections to the signal output circuit in the semiconductor device using the mask data, the output pin arrangement of the semiconductor device is changed.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. 1st
In the figure, (1) and (2) are signal generation circuits that generate or store signals or data, (3) and (4) are signal generation circuits (IJ), and semiconductor devices that generate signals or data from (2). Output circuits that output to the outside, (5), (6),
(9), αQ is the wiring for connecting the signal generation circuits (1), (2) and the output circuit (3L (4)), and Qυ is the wiring that connects the wiring (5) and the wiring (9). The connection point shown in the figure shows that the wiring contact pattern data is placed at αυ in the pattern layout. @ is the connection point that similarly shows that the wiring (6) and a are connected. α4 is the connection point indicating the place where the wiring contact pattern is placed when connecting the wiring (5) and CI 2, 0 is the connection point when connecting the wiring (9), ), (8) are output pads.

In Figure 1, the contact pattern data is the connection point Q
The signal or data located at The signal or data generated in the signal generating circuit (2) is inputted to the output circuit (4) through the wiring αQ and (6), and is output to the outside of the semiconductor device through the output pad (7). 3) is output to the outside of the semiconductor device.

Here, when the user arranges and wires this semiconductor device on a printed circuit board, the above output signals are in the reverse order, that is, the signal generation source! (1) The signal or data on the pad (8
), and if the signal or data of the signal generating circuit (2) is output from the pad (7), pattern wiring on the printed circuit board becomes easy, and the size of the printed circuit board (
When it is determined that the contact pattern (area) is to be reduced, the user requests the semiconductor manufacturer to change the location of the contact pattern from the connection point of αυ, C121 to uw in the semiconductor pattern layout. Semiconductor manufacturers can change the mask for the contact process according to their requirements, allowing them to change the output order.

In the above embodiment, two outputs were explained as an extremely simple case, but the number of outputs may be larger.

Further, although the case has been shown in which the method of changing the connection is made possible by changing the contact mask data, this may be done in other processes such as a metal wiring process, and the same effect as in the above embodiment can be achieved.

〔Effect of the invention〕

As mentioned above, the relationship between output signals or data and output terminals in conventional semiconductor integrated circuits (the output pin layout was determined in advance, and the user designed the pattern wiring of the printed circuit board with the determined pin layout). According to this invention, the output pin arrangement can be changed according to the user's specifications by simply changing one mask during the wafer process, so the user does not have to worry about the output pin arrangement of the semiconductor device. This has the effect of making it possible to design printed circuit board wiring patterns.

[Brief explanation of drawings]

FIG. 1 is a circuit configuration diagram showing a semiconductor device according to an embodiment of the present invention, and the second section is a circuit configuration diagram showing a conventional semiconductor device. In the diagram, (3), (4J are the output circuits, (7Ji August output circuit, (5), (6), (9), GO are the wiring. In the diagram, the same symbols are the same or equivalent. Dice the parts.

Claims (1)

[Claims] A semiconductor integrated circuit device having an output circuit including a plurality of output terminals, the device is equipped with an arbitrary exposure mask 1 during wafer processing.
A semiconductor device characterized in that by changing the semiconductor device, the connection between output signals and output terminals can be freely changed.