JPH03246A - Preparation of electric laminated sheet - Google Patents
Preparation of electric laminated sheetInfo
- Publication number
- JPH03246A JPH03246A JP1133988A JP13398889A JPH03246A JP H03246 A JPH03246 A JP H03246A JP 1133988 A JP1133988 A JP 1133988A JP 13398889 A JP13398889 A JP 13398889A JP H03246 A JPH03246 A JP H03246A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- hole
- holes
- resin powder
- prepreg
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 50
- 239000011347 resin Substances 0.000 claims abstract description 50
- 239000000945 filler Substances 0.000 claims abstract description 39
- 239000000843 powder Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 11
- 239000002131 composite material Substances 0.000 abstract description 6
- 239000003365 glass fiber Substances 0.000 abstract description 3
- 238000000227 grinding Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 241000531908 Aramides Species 0.000 abstract 1
- 229920003235 aromatic polyamide Polymers 0.000 abstract 1
- 239000000835 fiber Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000008187 granular material Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 210000004709 eyebrow Anatomy 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000011265 semifinished product Substances 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001494 Technora Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004950 technora Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、電気積層板の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method of manufacturing an electrical laminate.
金属板を基板として用いた多層の電気多層板の製造方法
は、たとえば、特願昭６３−７３６７１号出願に開示さ
れている。同製造方法は、第２図にその工程が示されて
いる。同図（ａｌにみるように、金属板２は銅板やアル
ミニウム板等で形成され、スルーホールの形成される個
所に同スルーホールよりも径の大きな通孔１・・・が明
けられている。A method for manufacturing a multilayer electrical multilayer board using a metal plate as a substrate is disclosed, for example, in Japanese Patent Application No. 73671/1983. The steps of the manufacturing method are shown in FIG. As seen in the same figure (al), the metal plate 2 is formed of a copper plate, an aluminum plate, or the like, and a through hole 1 having a larger diameter than the through hole is formed at the location where the through hole is to be formed.
この金属板２には、同図（ｂｌにみるように、片面（下
面）にプリプレグ３ａを重ねて仮接着させるようにする
。プリプレグ３ａはガラス布や紙等を基材とし、これに
エポキシ樹脂やポリイミド等の熱硬化性樹脂を含浸させ
て乾燥することによって調製されたものであり、同プリ
プレグ３ａは、金属板２の通孔１の底の開口を閉塞する
役目をなすだけのものであるため、０．１ ＊＊程度の
薄いものになっている。つぎに、同図（Ｃ）にみるよう
に、金属板２の通孔ｌ・・・内に、球状粉末やガラス繊
維等の充填剤を配合した樹脂４を充填してのち、減圧脱
気して加熱することで同樹脂４を硬化させる。こうして
得られた複合体６を、同図（ｄ）にみるように、数枚重
ねるとともに各最外層の複合体６の外側面にプリプレグ
３ｂを介して銅箔等の金属箔１３を重ねる。このとき、
各複合体６間には、片面プリント配線板や両面プリント
配線板、多層プリント配線板など、内層用回路を形成し
た回路板１２・・・をプリプレグ３ｂを介してセントし
ておくようにする。そして、これら積層状のものを加熱
加圧成形することで、プリプレグ３ｂに含浸させた樹脂
が硬化して、各複合体６と回路板１２とが接着するよう
になり、これにより、金属板２と回路板１２とが交互に
積層し最外層に金属箔１３．１３の接着した電気積層板
の半製品を得ることができる、そののち、同半製品に、
ドリル加工やパンチ加工等により穿孔加工することで、
スルーホールを形成する。同スルーホールは、前記通孔
１よりも小さい直径で樹脂４の部分の中心を通るもので
ある。これにより、樹脂４が一部残されるので、スルー
ホールの内周と金属板２との間の電気絶縁性が確保され
る。そして、スルーホールを加工したのち、同スルーホ
ールの内周面に銅メツキ等の方法で導体膜を形成したり
、金属箔１３をエツチング処理して外層回路を形成した
りすることで、多層の金属板２・・・を基板とし回路板
１２・・・による内層回路と金属箔１３．１３による外
層回路とを備えた多層の電気積層板が出来上がるのであ
る。As shown in the same figure (bl), a prepreg 3a is superimposed on one side (lower side) and temporarily adhered to the metal plate 2.The prepreg 3a is made of glass cloth, paper, etc. as a base material, and is coated with epoxy resin. The prepreg 3a is prepared by impregnating a thermosetting resin such as or polyimide and drying it, and the prepreg 3a only serves to close the opening at the bottom of the through hole 1 of the metal plate 2. Therefore, it is as thin as 0.1**.Next, as shown in the same figure (C), the through hole l of the metal plate 2 is filled with spherical powder, glass fiber, etc. After filling the resin 4 mixed with the agent, the resin 4 is cured by degassing under reduced pressure and heating.Several composites 6 thus obtained are stacked as shown in Figure (d). At the same time, a metal foil 13 such as copper foil is layered on the outer surface of each outermost layer of the composite body 6 via the prepreg 3b.At this time,
A circuit board 12 having an inner layer circuit formed thereon, such as a single-sided printed wiring board, a double-sided printed wiring board, or a multilayer printed wiring board, is placed between each composite body 6 via a prepreg 3b. By heating and press-molding these laminates, the resin impregnated into the prepreg 3b is cured, and each composite 6 and the circuit board 12 are bonded to each other, thereby causing the metal plate 2 A semi-finished product of an electrical laminate can be obtained in which the and circuit boards 12 are alternately laminated and a metal foil 13.13 is adhered to the outermost layer.Then, on the semi-finished product,
By drilling or punching, etc.
Form a through hole. The through hole has a smaller diameter than the through hole 1 and passes through the center of the resin 4 portion. As a result, a portion of the resin 4 remains, so that electrical insulation between the inner periphery of the through hole and the metal plate 2 is ensured. After processing the through-hole, a conductive film is formed on the inner peripheral surface of the through-hole by a method such as copper plating, or an outer layer circuit is formed by etching the metal foil 13, thereby creating a multilayered structure. A multilayer electrical laminate is completed, using the metal plates 2 as a substrate and having an inner layer circuit formed by the circuit boards 12 . . . and an outer layer circuit formed by the metal foils 13, 13.
前記電気積層板の製造方法によれば、金泥板２の通孔ｌ
に充填した樹脂４に充填剤が配合されているので、前記
穿孔加工をするとスルーホールの内周面にこの充填剤が
露出して胃内周面が凹凸面となり、この凹凸面がアンカ
ー効果などを発揮することで、スルーホールの内周面に
施される導体膜（メツキ層）の密着性が高まるものであ
る。そのほか、通孔１内の樹脂４は、予め間通孔ｌ内に
流し込んで充填されるもので、成形時にプリプレグ３ｂ
の溶融樹脂を流入させて充填されるものではないので、
通孔１内の樹脂４中の充填剤量が少なくなってスルーホ
ールの凹凸面が不十分になったり、充填剤が偏在して加
熱応力が加わったときに充填剤と樹脂との界面に！ｌＪ
離が生じたりするおそれはない等の利点を有する。According to the method for manufacturing an electrical laminate, the through hole l of the gold plate 2
Since a filler is blended into the resin 4 filled in the through-hole, when the above-mentioned drilling process is performed, this filler is exposed on the inner peripheral surface of the through hole, and the inner peripheral surface of the stomach becomes an uneven surface, and this uneven surface has an anchor effect, etc. By achieving this, the adhesion of the conductive film (plating layer) applied to the inner peripheral surface of the through hole is improved. In addition, the resin 4 in the through hole 1 is filled by pouring into the through hole l in advance, and the prepreg 3b is filled during molding.
Since it is not filled by flowing molten resin,
When the amount of filler in the resin 4 in the through hole 1 decreases and the uneven surface of the through hole becomes insufficient, or when the filler is unevenly distributed and heat stress is applied, it may occur at the interface between the filler and the resin! lJ
This has the advantage that there is no risk of separation occurring.
しかし、前記通孔１に充填される樹脂４が粉粒体である
ときには必ずしも上記のようにはならない。樹脂４が粉
粒体であるときは、同粉粒体を、充填剤とともに、一方
がプリプレグ３ａで塞がれた通孔１に入れてのち、同充
填剤配合樹脂粉粒体を、金属板２の上面に沿ってスキー
ジ−により掻き落とすようにするのが通例であった。し
たがって、通孔１に入れられた充填剤配合樹脂粉粒体間
には隙間が残るため、前記加熱加圧成形時にプリプレグ
３ａからの樹脂が通孔１に流れ込むようになって、その
流れ作用で通孔１内の充填剤が同道孔１内において偏る
ようになる。その結果、スルーホールを形成したときの
凹凸面が不十分な凹凸になったり、加熱応力が加わった
ときに充填剤と樹脂との界面に剥離が生じたりする。充
填剤が偏在すると、第３図にみるように、加熱加圧成形
に伴って上・下方向に収縮力が発生するようになり、そ
の状態で同図×印の四隅Ｃ・・・にプリプレグ３ａ、３
ｂからの溶融樹脂が流れ込むようなことがあると、その
部分Ｃ・・・が他と比べて著しく高濃度の部分になり、
その結果、ここに眉間クラックが発生しやすくなってい
た。これらのことから、スルーホール信頼性の向上を図
ることができなかった。However, when the resin 4 filled in the through hole 1 is powder or granule, the above is not necessarily the case. When the resin 4 is powder or granule, the powder and granule are put into the through hole 1 whose one side is closed with prepreg 3a, and then the filler-containing resin powder is inserted into the metal plate. It was customary to scrape off along the top surface of 2 with a squeegee. Therefore, since a gap remains between the filler-containing resin particles placed in the through holes 1, the resin from the prepreg 3a flows into the through holes 1 during the heating and pressure molding, and the flow action causes the resin to flow into the through holes 1. The filler in the through hole 1 becomes uneven within the same passage hole 1. As a result, when a through hole is formed, the uneven surface becomes insufficiently uneven, and when thermal stress is applied, peeling occurs at the interface between the filler and the resin. If the filler is unevenly distributed, as shown in Figure 3, shrinkage force will be generated in the upward and downward directions as a result of heating and pressure molding, and in this state, the prepreg will be applied to the four corners C marked with an x in the figure. 3a, 3
If the molten resin from B flows in, that part C... will have a significantly higher concentration than the others,
As a result, cracks between the eyebrows were more likely to occur here. For these reasons, it has not been possible to improve through-hole reliability.
前記事情に鑑みて、この発明の課題とするところは、ス
ルーホール信頼性に優れるようにすることにある。In view of the above circumstances, an object of the present invention is to improve through-hole reliability.
前記課題を解決するため、この発明にかかる電気積層板
の製造方法は、通孔を有する金属板の同通孔内に充填剤
配合樹脂粉粒体をビンにより上方から押え付けることで
充填した後、この金属板をプリプレグを介して複数枚重
ね、これ゛を加熱加圧して積層成形し、その後に前記通
孔内の樹脂の部分でスルーホールを穿孔加工するように
する。In order to solve the above problems, the method for manufacturing an electric laminate according to the present invention includes filling the through holes of a metal plate with filler-containing resin powder by pressing the filler-containing resin powder from above with a bottle. A plurality of these metal plates are stacked with prepreg interposed therebetween, and the metal plates are laminated by heating and pressurizing, and then through-holes are punched using the resin portions in the through-holes.
前記通孔内への充填剤配合樹脂粉粒体の充填を、ビンに
よる上方からの押え付けにより行なうようにすると、同
押え付けにより充填率が上がり、成形時にプリプレグか
らの樹脂の流れ込みが少な（なって、通孔内での充填剤
の偏りがなくなる。If the filler-containing resin powder is filled into the through hole by pressing from above with a bottle, the filling rate will increase due to the pressing, and the flow of resin from the prepreg during molding will be reduced ( This eliminates unevenness of the filler within the through hole.
これにより、通孔内に充填される樹脂として粉粒体を用
いても、スルーホール形成時に充填剤による凹凸面が充
分に得られるとともに、充填剤と樹指間の界面に剥離が
生じたり、眉間クラックが発生したりすることがなくな
る。As a result, even if powder or granular material is used as the resin filled in the through hole, a sufficiently uneven surface due to the filler can be obtained when forming the through hole, and peeling does not occur at the interface between the filler and the resin. Glabellar cracks will no longer occur.
以下に、この発明を、その実施例をあられす図面を参照
しつつ詳しく説明する。Hereinafter, embodiments of the present invention will be explained in detail with reference to the accompanying drawings.
第１図は、この発明にかかる電気積層板の製造方法の一
実施例をあられしている。同図は、第２図（Ｃ）に相当
する充填工程をあられし、その他の工程は第２図に示し
たと同様であるので、重複した説明は省略する。同図（
ａｌにみるように、金属板２の通孔１内には、充填剤配
合樹脂粉粒体４が多口で盛り上がるようにして入れられ
る。この充填剤配合樹脂粉粒体４には、プリプレグ３ａ
に含浸させるものと同様のものを粉末状にしたものが使
われる。充填剤としては任意のものを用いることができ
るが、Ａｌｘ Ｏｓ 、Ａｌｉ ０ｘ ・ＨｓＯｌＡ
ｌｘ Ｏｓ ’ ３ Ｈｔ Ｏ、タルク、ＭｇＯ１Ｃ
ａＣＯｓ 、Ｓ ｂｚ Ｏｘ 、Ａ ｂｔ Ｏｓなどの
球状粉末、ＥガラスやＤガラス、Ｔガラス、Ｒガラス、
Ｑガラスなどのガラス繊維や、ケブラー（デュポン社製
）、テクノーラ（奇人社製）などのアラミド繊維等を細
かく切断してすりつぶした針状粉末を例示することがで
きる。樹脂粉粒体４への充填剤の配合量は、樹脂分１０
０ｉｉｆｉｔ部に対して５０〜１０００重量部程度、好
ましくは、４００Ｍ量部とされる。プリプレグ３ａを仮
接着した金属板２の通孔１内に充填剤入りの樹脂４が入
れられた複合体を、同図示のように、押え部材１０によ
り押え込んで充填率の向上を図るようにする。同郡え部
材１０は、基板１０ａの下側に通孔１・・・とばば同じ
径をしたビン１０ｂ・・・を同通孔ｌ・・・と同じピッ
チになるように突出させてなっている。これにより、充
填剤配合樹脂粉粒体４は、同図（ｂ）にみるように、通
孔１内に詰め込まれるようになり、詰め込み度が一定の
限度に達した時点で、通孔１外に残る余分な充填剤配合
樹脂粉粒体４を除去手段１１で取り除くようにする。こ
の取り除きは、通孔１外の少量の充填剤配合樹脂粉粒体
４を残すようにして、積層成形時の加熱加圧で通孔１内
に充填させるようにすることもできる。なお、プリプレ
グ３ａ、３ｂには充填剤は配合されていない。FIG. 1 shows an embodiment of the method for manufacturing an electrical laminate according to the present invention. This figure shows the filling step corresponding to FIG. 2(C), and the other steps are the same as shown in FIG. 2, so redundant explanation will be omitted. Same figure (
As shown in FIG. 1, the filler-containing resin powder 4 is put into the through hole 1 of the metal plate 2 so as to swell in multiple mouths. This filler-containing resin powder 4 includes prepreg 3a.
A powdered version of the same material used for impregnation is used. Any filler can be used, but Alx Os, Ali 0x ・HsOlA
lx Os' 3 Ht O, talc, MgO1C
Spherical powders such as aCOs, SbzOx, AbtOs, E glass, D glass, T glass, R glass,
Examples include acicular powder obtained by finely cutting and grinding glass fibers such as Q-glass, aramid fibers such as Kevlar (manufactured by DuPont), and Technora (manufactured by Kijinsha). The amount of filler added to the resin powder 4 is resin content 10
The amount is about 50 to 1000 parts by weight, preferably 400 M parts, based on 0iifit parts. As shown in the figure, a composite body in which a resin 4 containing a filler is placed in a through hole 1 of a metal plate 2 to which a prepreg 3a is temporarily bonded is pressed down by a holding member 10 to improve the filling rate. do. The grouping member 10 has the through holes 1 and the bottles 10b having the same diameter projected from the lower side of the substrate 10a at the same pitch as the through holes l. There is. As a result, the filler-containing resin powder 4 is packed into the through hole 1, as shown in FIG. The remaining filler-containing resin powder 4 is removed by a removing means 11. This removal can also be done by leaving a small amount of the filler-containing resin powder 4 outside the through hole 1 and filling it into the through hole 1 by heating and pressurizing during lamination molding. Note that no filler is mixed in the prepregs 3a and 3b.
前記のように、この発明にかかる電気積層板の製造方法
は、前記通孔内への充填剤配合樹脂粉粒体の充填を、ピ
ンによる上方からの押え付けにより行なうようにするの
で、同郡え付けにより充填率が上がり、成形時にプリプ
レグからの樹脂の流れ込みが少なくなって、通孔内での
充填剤の偏りがなくなる。これにより、通孔内に充填さ
れる樹脂として粉粒体を用いても、スルーホール形成時
に充填剤による凹凸面が充分に得られるとともに、充填
剤と樹脂間の界面に剥離が生じたり、眉間クランクが発
生したりすることがなくなる。As described above, the method for manufacturing an electrical laminate according to the present invention is such that filling of the filler-containing resin powder into the through holes is carried out by pressing from above with pins. By attaching, the filling rate increases, the flow of resin from the prepreg during molding is reduced, and the unevenness of the filler in the through hole is eliminated. As a result, even if powder or granular material is used as the resin filled in the through hole, a sufficiently uneven surface due to the filler can be obtained when forming the through hole, and peeling may occur at the interface between the filler and the resin, or between the eyebrows. No more cranking.
なお、前記押えは、その押え前あるいは押え中において
振動を加えるようにしてもよい。前記充填は、プリプレ
グを仮接着しない状態で行ない、その金属板を直接積層
成形するようにしてもよいるようになる。The presser foot may be vibrated before or during the presser foot. The filling may be performed without temporarily adhering the prepreg, and the metal plate may be directly laminated and molded.
第１図はこの発明にかかる電気積層板の製造方法の一実
施例をあられし、同図（ａｌは充填剤配合樹脂粉粒体が
充填のため通孔に入れられて押えられる直前の様子をあ
られす断面図、同図（ｂｌはその充堰後の様子をあられ
す断面図、第２図は従来の方法を工程ごとにあられす断
面図、第３図は眉間タラワクの発生状況をあられす断面
図である。
１・・・通孔 ２・・・金属板 ３ａ、３ｂ・・・プリ
プレグ ４・・・充填剤配合樹脂粉粒体 １０ｂ・・・
ピン代理人 弁理士 松 本 武 彦
〔発明の効果〕
この発明にかかる電気積層板の製造方法は、以上のよう
にするため、スルーホール信頼性に優れ第１図
（ａ）
第２
図
（ｄ）FIG. 1 shows an embodiment of the method for manufacturing an electrical laminate according to the present invention, and FIG. A cross-sectional view of Aarasu, the same figure (BL is a cross-sectional view of Aarasu after filling the weir, Fig. 2 is a cross-sectional view of Aarasu for each process of the conventional method, and Fig. 3 shows the occurrence of Tarawak between the eyebrows. It is a sectional view. 1... Through hole 2... Metal plate 3a, 3b... Prepreg 4... Filler-containing resin powder 10b...
Pin Agent Patent Attorney Takehiko Matsumoto [Effects of the Invention] The method for manufacturing an electrical laminate according to the present invention has excellent through-hole reliability as described above, as shown in Fig. 1(a) and Fig. 2(d). )
Claims (1)
粒体をピンにより上方から押え付けることで充填した後
、この金属板をプリプレグを介して複数枚重ね、これを
加熱加圧して積層成形し、その後に前記通孔内の樹脂の
部分でスルーホールを穿孔加工するようにする電気積層
板の製造方法1. Fill the holes of a metal plate with a through hole with filler-containing resin powder by pressing it from above with a pin, then stack multiple metal plates with prepreg interposed between them, and heat and press them. A method for producing an electrical laminate, in which the through-holes are formed by laminating the resin in the through-holes
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133988A JPH03246A (en) | 1989-05-26 | 1989-05-26 | Preparation of electric laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133988A JPH03246A (en) | 1989-05-26 | 1989-05-26 | Preparation of electric laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03246A true JPH03246A (en) | 1991-01-07 |
Family
ID=15117759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1133988A Pending JPH03246A (en) | 1989-05-26 | 1989-05-26 | Preparation of electric laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03246A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7261853B2 (en) * | 2004-07-16 | 2007-08-28 | Eagle Mold Company | Decelerated ejector pin system and method for operating the same |
-
1989
- 1989-05-26 JP JP1133988A patent/JPH03246A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7261853B2 (en) * | 2004-07-16 | 2007-08-28 | Eagle Mold Company | Decelerated ejector pin system and method for operating the same |
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