JPH03248A - Preparation of electric laminated sheet - Google Patents
Preparation of electric laminated sheetInfo
- Publication number
- JPH03248A JPH03248A JP1133990A JP13399089A JPH03248A JP H03248 A JPH03248 A JP H03248A JP 1133990 A JP1133990 A JP 1133990A JP 13399089 A JP13399089 A JP 13399089A JP H03248 A JPH03248 A JP H03248A
- Authority
- JP
- Japan
- Prior art keywords
- filler
- resin powder
- holes
- compounded resin
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 51
- 239000011347 resin Substances 0.000 claims abstract description 51
- 239000000945 filler Substances 0.000 claims abstract description 41
- 239000000843 powder Substances 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000003365 glass fiber Substances 0.000 abstract description 4
- 238000000227 grinding Methods 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 abstract description 2
- 241000531908 Aramides Species 0.000 abstract 1
- 229920003235 aromatic polyamide Polymers 0.000 abstract 1
- 239000000835 fiber Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 239000008187 granular material Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 210000004709 eyebrow Anatomy 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229920001494 Technora Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000004950 technora Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、電気積層板の製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method of manufacturing an electrical laminate.
金属板を基板として用いた多層の電気多層板の製造方法
は、たとえば、特願昭６３−７３６７１号出願に開示さ
れている。同製造方法は、第２図にその工程が示されて
いる。同図（ａ）にみるように、金属板２は銅板やアル
ミニウム板等で形成され、スルーホールの形成される個
所に同スルーホールよりも径の大きな通孔１・・・が明
けられている。A method for manufacturing a multilayer electrical multilayer board using a metal plate as a substrate is disclosed, for example, in Japanese Patent Application No. 73671/1983. The steps of the manufacturing method are shown in FIG. As shown in Figure (a), the metal plate 2 is made of a copper plate, an aluminum plate, etc., and has a through hole 1 with a larger diameter than the through hole at the location where the through hole is to be formed. .
この金属板２には、同図山）にみるように、片面（下面
）にプリプレグ３ａを重ねて仮接着させるようにする。A prepreg 3a is superimposed on one side (lower side) of the metal plate 2 and temporarily adhered thereto, as shown in FIG.
プリプレグ３ａはガラス布や紙等を基材とし、これにエ
ポキシ樹脂やポリイミド等の熱硬化性樹脂を含浸させて
乾燥することによって調製されたものであり、同プリプ
レグ３ａは、金属板２の通孔１の底の開口を閉塞する役
目をなすだけのものであるため、０．１ ＊ｖｂ程度の
薄いものになっている。つぎに、同図（Ｃ１にみるよう
に、金属板２の通孔１・・・内に、球状粉末やガラス繊
維等の充填剤を配合した樹脂４を充填してのち、減圧脱
気して加熱することで同樹脂４を硬化させる。こうして
得られた複合体６を、同図（ｄ）にみるように、数枚重
ねるとともに各最外層の複合体６の外側面にプリプレグ
３ｂを介して銅箔等の金属箔１３を重ねる。このとき、
各複合体６間には、片面プリント配線板や両面プリント
配線板、多層プリント配線板など、内層用回路を形成し
た回路板１２・・・をプリプレグ３ｂを介してセットし
ておくようにする。そして、これら積層状のものを加熱
加圧成形することで、プリプレグ３ｂに含浸させた樹脂
が硬化して、各複合体６と回路板１２とが接着するよう
になり、これにより、金属板２と回路板１２とが交互に
積層し最外層に金属箔１３．１３の接着した電気積層板
の半製品を得ることができる。そののち、同半製品に、
ドリル加工やパンチ加工等により穿孔加工することで、
スルーホールを形成する。同スルーホールは、前記通孔
１よりも小さい直径で樹脂４の部分の中心を通るもので
ある。これにより、樹脂４が一部残されるので、スルー
ホールの内周と金属板２との間の電気絶縁性が確保され
る。そして、スルーホールを加工したのち、同スルーホ
ールの内周面に銅メツキ等の方法で導体膜を形成したり
、金属箔１３をエツチング処理して外層回路を形成した
りすることで、多層の金属板２・・・を基板とし回路板
１２・・・による内層回路と金属箔１３．１３による外
層回路とを備えた多層の電気積層板が出来上がるのであ
る。The prepreg 3a is prepared by impregnating a base material such as glass cloth or paper with a thermosetting resin such as epoxy resin or polyimide and drying it. Since it only serves to close the opening at the bottom of hole 1, it is as thin as 0.1*vb. Next, as shown in the same figure (C1), the through holes 1 of the metal plate 2 are filled with resin 4 containing fillers such as spherical powder and glass fiber, and then degassed under reduced pressure. The resin 4 is cured by heating. Several composites 6 thus obtained are stacked one on top of the other as shown in FIG. Layer metal foil 13 such as copper foil. At this time,
Between each composite body 6, a circuit board 12 having an inner layer circuit formed thereon, such as a single-sided printed wiring board, a double-sided printed wiring board, or a multilayer printed wiring board, is set via a prepreg 3b. By heating and press-molding these laminates, the resin impregnated into the prepreg 3b is cured, and each composite 6 and the circuit board 12 are bonded to each other, thereby causing the metal plate 2 A semi-finished electrical laminate can be obtained in which the and circuit boards 12 are alternately laminated and a metal foil 13.13 is adhered to the outermost layer. After that, the same semi-finished product,
By drilling or punching, etc.
Form a through hole. The through hole has a smaller diameter than the through hole 1 and passes through the center of the resin 4 portion. As a result, a portion of the resin 4 remains, so that electrical insulation between the inner periphery of the through hole and the metal plate 2 is ensured. After processing the through-hole, a conductive film is formed on the inner peripheral surface of the through-hole by a method such as copper plating, or an outer layer circuit is formed by etching the metal foil 13, thereby creating a multilayered structure. A multilayer electrical laminate is completed, using the metal plates 2 as a substrate and having an inner layer circuit formed by the circuit boards 12 . . . and an outer layer circuit formed by the metal foils 13, 13.
前記電気積層板の製造方法によれば、金属板２の通孔１
に充填した樹脂４に充填剤が配合されているので、前記
穿孔加工をするとスルーホールの内周面にこの充填剤が
露出して同内周面が凹凸面となり、この凹凸面がアンカ
ー効果などを発揮することで、スルーホールの内周面に
施される導体膜（メツキ層）の密着性が高まるものであ
る。そのほか、通孔１内の樹脂４は、予め同通孔１内に
流し込んで充填されるもので、成形時にプリプレグ３ｂ
の熔融樹脂を流入させて充填されるものではないので、
通孔１内の樹脂４中の充填剤量が少なくなってスルーホ
ールの凹凸面が不十分になったり、充填剤が偏在して加
熱応力が加わったときに充填剤と樹脂との界面に剥離が
生じたりするおそれはない等の利点を有する。According to the method for manufacturing an electrical laminate, the through hole 1 of the metal plate 2
Since a filler is blended into the resin 4 filled in the through-hole, this filler is exposed on the inner circumferential surface of the through-hole when the above-mentioned drilling process is performed, and the inner circumferential surface becomes an uneven surface, and this uneven surface has an anchor effect, etc. By achieving this, the adhesion of the conductive film (plating layer) applied to the inner peripheral surface of the through hole is improved. In addition, the resin 4 in the through hole 1 is filled by pouring it into the through hole 1 in advance, and the prepreg 3b is filled during molding.
Since it is not filled by flowing molten resin,
When the amount of filler in the resin 4 in the through hole 1 decreases and the uneven surface of the through hole becomes insufficient, or when the filler is unevenly distributed and heat stress is applied, peeling occurs at the interface between the filler and the resin. This has the advantage that there is no risk of this occurring.
しかし、前記通孔１に充填される樹脂４が粉粒体である
ときには必ずしも上記のようにはならない。樹脂４が粉
粒体であるときは、同粉粒体を、充填剤とともに、一方
がプリプレグ３ａで塞がれた通孔１に入れてのち、同充
填剤配合樹脂粉粒体を、金属板２の上面に沿ってスキー
ジ−により掻き落とすようにするのが通例であった。し
たがって、通孔ｌに入れられた充填剤配合樹脂粉粒体間
には隙間が残るため、前記加熱加圧成形時にプリプレグ
３ａからの樹脂が通孔ｌに流れ込むようになって、その
流れ作用で通孔１内の充填剤が同道孔ｌ内において偏る
ようになる。その結果、スルーホールを形成したときの
凹凸面が不十分な凹凸になったり、加熱応力が加わった
ときに充填剤と樹脂との界面に剥離が生じたりする。充
填剤が偏在すると、第３図にみるように、加熱加圧成形
に伴って上・下方向に収縮力が発生するようになり、そ
の状態で同図×印の四隅Ｃ・・・にプリプレグ３ａ、３
ｂからの溶融樹脂が流れ込むようなことがあると、その
部分Ｃ・・・が他と比べて著しく高濃度の部分になり、
その結果、ここに眉間クラックが発生しやすくなってい
た。これらのことから、スルーホール信頼性の向上を図
ることができなかった。However, when the resin 4 filled in the through hole 1 is powder or granule, the above is not necessarily the case. When the resin 4 is powder or granule, the powder and granule are put into the through hole 1 whose one side is closed with prepreg 3a, and then the filler-containing resin powder is inserted into the metal plate. It was customary to scrape off along the top surface of 2 with a squeegee. Therefore, since a gap remains between the filler-containing resin particles placed in the through holes 1, the resin from the prepreg 3a flows into the through holes 1 during the heating and pressure molding, and due to the flow action. The filler in the through hole 1 becomes uneven within the same through hole l. As a result, when a through hole is formed, the uneven surface becomes insufficiently uneven, and when thermal stress is applied, peeling occurs at the interface between the filler and the resin. If the filler is unevenly distributed, as shown in Figure 3, shrinkage force will be generated in the upward and downward directions as a result of heating and pressure molding, and in this state, the prepreg will be applied to the four corners C marked with an x in the figure. 3a, 3
If the molten resin from B flows in, that part C... will have a significantly higher concentration than the others,
As a result, cracks between the eyebrows were more likely to occur here. For these reasons, it has not been possible to improve through-hole reliability.
前記事情に鑑みて、この発明の課題とするところは、ス
ルーホール信頼性に優れるようにすることにある。In view of the above circumstances, an object of the present invention is to improve through-hole reliability.
前記課題を解決するため、この発明にかかる電気積層板
の製造方法は、通孔を有する金属板の間通孔内に充填剤
配合樹脂粉粒体を、下面が一様な押圧面となった押え部
材で押え付けることにより充填した後、この金属板をプ
リプレグを介して複数枚重ね、これを加熱加圧して積層
成形し、その後に前記通孔内の樹脂の部分でスルーホー
ルを穿孔加工するようにする。In order to solve the above-mentioned problems, the method for manufacturing an electric laminate according to the present invention includes a presser member whose lower surface is a uniform pressing surface, and filler-containing resin powder is placed in the through-holes between metal plates having through-holes. After filling by pressing with a metal plate, multiple sheets of this metal plate are stacked with prepreg interposed between them, and this is laminated by heating and pressurizing, and after that, a through hole is punched using the resin part in the above-mentioned through hole. do.
前記通孔内への充填剤配合樹脂粉粒体の充填を、下面が
一様な押圧面となった押え部材で押え付けることにより
行なうようにすると、同郡え付けにより充愼率が上がり
、成形時にプリプレグからの樹脂の流れ込みが少なくな
って、通孔内での充填剤の偏りがなくなる。これにより
、通孔内に充填される樹脂として粉粒体を用いても、ス
ルーホ−ル形成時に充填剤による凹凸面が充分に得られ
るとともに、充填剤と樹脂間の界面に剥離が生じたり、
眉間クランクが発生したりすることがなくなる。If the filler-containing resin powder is filled into the through hole by pressing it with a pressing member whose lower surface is a uniform pressing surface, the filling rate will increase due to the same pressing. The flow of resin from the prepreg during molding is reduced, eliminating unevenness of the filler within the through holes. As a result, even if powder or granular material is used as the resin filled in the through hole, a sufficiently uneven surface due to the filler can be obtained when forming the through hole, and peeling does not occur at the interface between the filler and the resin.
Glabellar cranks will no longer occur.
以下に、この発明を、その実施例をあられす図面を参照
しつつ詳しく説明する。Hereinafter, embodiments of the present invention will be explained in detail with reference to the accompanying drawings.
第１図は、この発明にかかる電気積層板の製造方法の一
実施例をあられしている。同図は、第２図（Ｃ１に相当
する充填工程をあられし、その他の工程は第２図に示し
たと同様であるので、重複した説明は省略する。同図（
ａ）にみるように、金属板２の通孔１内には、充填剤配
合樹脂粉粒体４を充填するとともに、同充填剤配合樹脂
粉粒体４は、同金属板２の上面全体にもわたるようにし
て少し多口に撒散しておくようにする。この充填剤配合
樹脂粉粒体４には、プリプレグ３ａに含浸させるものと
同様のものを粉末状にしたものが使われる。FIG. 1 shows an embodiment of the method for manufacturing an electrical laminate according to the present invention. This figure shows the filling step corresponding to FIG. 2 (C1), and the other steps are the same as those shown in FIG.
As shown in a), the through holes 1 of the metal plate 2 are filled with filler-containing resin powder 4, and the filler-containing resin powder 4 covers the entire upper surface of the metal plate 2. Make sure to sprinkle it in a little bit evenly so that it spreads evenly. As the filler-containing resin powder 4, a powder similar to that which is impregnated into the prepreg 3a is used.
充填剤としては任意のものを用いることができるが、Ａ
ｌｔ Ｏｓ 、Ａｌｘ Ｏｘ ・Ｈ！ ０１Ａｌｘ
０−３Ｈ，Ｏ、タルク、Ｍ ｇ Ｏ％ Ｃａ Ｃ０１、
ＳｂオＯ＝ 、Ａｂｘ○、などの球状粉末、Ｅガラスや
Ｄガラス、Ｔガラス、Ｒガラス、Ｑガラスなどのガラス
繊維や、ケブラー（デュポン社製）、テクノーラ（奇人
社製）などのアラミド繊維等を細かく切断してすりつぶ
した針状粉末を例示することができる。樹脂粉粒体４へ
の充填剤の配合量は、樹脂分１００重量部に対して５０
〜１０００重量部程度、好ましくは、４００重量部とさ
れる。Any filler can be used, but A
lt Os , Alx Ox ・H! 01Alx
0-3H,O, talc, M g O% Ca C01,
Spherical powders such as SbO=, Abx○, glass fibers such as E glass, D glass, T glass, R glass, Q glass, and aramid fibers such as Kevlar (manufactured by DuPont) and Technora (manufactured by Kijinsha). An example of this is needle-like powder obtained by cutting and grinding finely cut and ground acicular powder. The amount of filler added to the resin powder 4 is 50 parts by weight per 100 parts by weight of the resin.
The amount is approximately 1000 parts by weight, preferably 400 parts by weight.
プリプレグ３ａを仮接着した金属板２の通孔１内には、
充填剤配合樹脂粉粒体４が入れられるが、同図示のよう
に、押え部材１０により充填剤配合樹脂粉粒体４全体を
上方から押え付けて通孔２内への充填率の向上を図るよ
うにする。同郡え部材１０は、下面が一様な平坦面たる
押圧面１０ａになっているものであり、これにより、充
填剤配合樹脂粉粒体４は、同図中）にみるように、通孔
１内に詰め込まれるようになり、詰め込み度が一定の限
度に達した時点で、通孔１外に残る余分な充填剤配合樹
脂粉粒体４を除去手段１１で取り除（ようにする。この
取り除きは、通孔ｌ外の少量の樹脂４を残すようにして
、そのものが、積層成形時に通孔１内に充填させるよう
にすることもできる。なお、前記押え部材１０は、下面
が曲面伏になったものであってもよい。Inside the through hole 1 of the metal plate 2 to which the prepreg 3a is temporarily attached,
The filler-containing resin powder 4 is inserted, and as shown in the figure, the entire filler-containing resin powder 4 is pressed down from above by a pressing member 10 to improve the filling rate into the through hole 2. do it like this. The holding member 10 has a pressing surface 10a which is a uniform flat surface on the lower surface, so that the filler-containing resin powder 4 can be pushed through the through holes as shown in the figure. When the degree of packing reaches a certain limit, the excess filler-containing resin powder 4 remaining outside the through hole 1 is removed by the removal means 11. The removal can also be done by leaving a small amount of the resin 4 outside the through hole 1, and filling the inside of the through hole 1 during lamination molding. It may be something that has become.
前記のように、この発明にかかる電気積層板の製造方法
は、前記通孔内への充填剤配合樹脂粉粒体の充填を、下
面が一様な押圧面となった押え部材で押え付けることに
より行なうようにするので、同郡え付けにより充填率が
上がり、成形時にプリプレグからの樹脂の流れ込みが少
なくなって、通孔内での充填剤の偏りがなくなる。これ
により、通孔内に充填される樹脂として粉粒体を用いて
も、スルーホール形成時に充填剤による凹凸面が充分に
得られるとともに、充填剤と樹脂間の界面に剥離が生じ
たり、眉間クラックが発生したりすることがな（なる。As described above, the method for manufacturing an electrical laminate according to the present invention includes pressing down the filling of the filler-containing resin powder into the through holes with a pressing member whose lower surface is a uniform pressing surface. Since this is done in the same manner, the filling rate is increased, and the flow of resin from the prepreg during molding is reduced, eliminating unevenness of the filler within the through hole. As a result, even if powder or granular material is used as the resin filled in the through hole, a sufficiently uneven surface due to the filler can be obtained when forming the through hole, and peeling may occur at the interface between the filler and the resin, or between the eyebrows. No cracks will occur.
なお、前記押え付けの前あるいは押え付けとともに、振
動を加えるようにしてもよい。前記充填は、プリプレグ
を仮接着しない状態で行ない、そのものを直接積層成形
するようにしてもよい。Note that vibration may be applied before or together with the pressing. The filling may be performed without temporarily adhering the prepreg, and the prepreg itself may be directly laminated and molded.
この発明にかかる電気積層板の製造方法は、以上のよう
にするため、スルーホール信頼性に優れるようになる。The method for manufacturing an electrical laminate according to the present invention, as described above, has excellent through-hole reliability.
第１図はこの発明にかかる電気積層板の製造方法の一実
施例をあられし、同図（ａ）は充填剤配合樹脂粉粒体が
充填のため通孔に入れられて押え付けられる直前の様子
をあられす断面図、同図（ｂ）はその充填後の様子をあ
られす断面図、第２図は従来の方法を工程ごとにあられ
す断面図、第３図は眉間クランクの発生状況をあられす
断面図である。
１・・・通孔 ２・・・金属板 ３ａ、３ｂ・・・プリ
プレグ ４・・・充填剤配合樹脂粉粒体 ｌＯ・・・押
え部材１０ａ・・・押え面
代理人 弁理士 松 本 武 彦
第１図
（ａ）
第２
図
（ｄ）FIG. 1 shows an embodiment of the method for producing an electrical laminate according to the present invention, and FIG. Figure (b) is a cross-sectional view showing the condition after filling, Figure 2 is a cross-sectional view showing the conventional method at each step, and Figure 3 is a cross-sectional view showing the occurrence of glabellar cranks. It is a sectional view of a hailstone. 1...Through hole 2...Metal plate 3a, 3b...Prepreg 4...Resin powder containing filler lO...Press member 10a...Press surface agent Patent attorney Takehiko Matsumoto Figure 1 (a) Figure 2 (d)
Claims (1)
粒体を、下面が一様な押圧面となった押え部材で押え付
けることにより充填した後、この金属板をプリプレグを
介して複数枚重ね、これを加熱加圧して積層成形し、そ
の後に前記通孔内の樹脂の部分でスルーホールを穿孔加
工するようにする電気積層板の製造方法。1 After filling the through holes of a metal plate with a through hole with filler-containing resin powder by pressing it with a pressing member whose lower surface is a uniform pressing surface, this metal plate is pressed through a prepreg. A method for manufacturing an electrical laminate, in which a plurality of sheets are stacked together, heated and pressed to form a laminate, and then through holes are punched using resin portions in the through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133990A JPH03248A (en) | 1989-05-26 | 1989-05-26 | Preparation of electric laminated sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1133990A JPH03248A (en) | 1989-05-26 | 1989-05-26 | Preparation of electric laminated sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03248A true JPH03248A (en) | 1991-01-07 |
Family
ID=15117809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1133990A Pending JPH03248A (en) | 1989-05-26 | 1989-05-26 | Preparation of electric laminated sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03248A (en) |
-
1989
- 1989-05-26 JP JP1133990A patent/JPH03248A/en active Pending
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