JPH03250722A - Electrolytic capacitor - Google Patents

Abstract

PURPOSE:To mount plural electrolytic capacitors within a low height on a surface at low cost by installing front and rear pedestals for the plural electrolytic capacitors laid in parallel. CONSTITUTION:Electrolytic capacitors 11 and 12 are provided with a rear pedestal 16 which connects the bottom sides of their cylindrical metal cases bottoms and a front pedestal 15 which connects the sealing sides of the metal cases. The pedestals 15 and 16 possess at least a bottom wall 15e which is arranged along the sides of the metal cases, the electrolytic capacitors 11 and 12 are connected in parallel by the pedestals 15 and 16 and the prescribed lead terminals 11a, 11b, 12a and 12b are bent along the bottom walls 15e of the front pedestal 15. Therefore, the electrolytic capacitors 11 and 12 are integrated in parallel by the front pedestal 15 and the rear pedestal 16. Thus, handling is facilitated, the capacitor is shortened in height and necessary capacitance is ensured. The sealing sides and the bottom sides of the metal cases are protected from heat from a circuit base board side and characteristic deterioration is suppressed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrolytic capacitor device, and more specifically, to an electrolytic capacitor device in which a plurality of electrolytic capacitors are unitized.

[Conventional technology]

As shown in FIG. 6, an aluminum electrolytic capacitor 1 with leads in the same direction is normally mounted vertically on a circuit board 2. However, according to this, the axial length of the case is too long. This creates a problem in reducing the height.

Therefore, in order to reduce the height while ensuring the same capacitance as the electrolytic capacitor 1, and also to allow surface mounting like other electronic components, we designed a capacitor as shown in FIG. Prepare two aluminum electrolytic capacitors 3, 3 with half pins, bend their respective lead terminals 3a, 3b into an approximately L shape along the metal case 3C, and place them side by side on the circuit board 2. I try to do that.

Another method is as shown in Figure 8.
The aluminum electrolytic capacitor 4 has a capacitor element having the same capacitance as the electrolytic capacitor 1 and is housed in a flat exterior case 4c having an elliptical cross section to achieve a low profile. Even when this is a surface mount type, each lead terminal 4a, 4b is bent into a substantially L-shape along the flat metal case 4C.

[Problem to be solved by the invention]

In either case, when mounted vertically, the height can be reduced by sinking, but this has the following drawbacks. That is, in the conventional example shown in FIG. 7, first, the number of electrolytic capacitors used is doubled, which increases the number of assembly steps and also makes parts management difficult. In addition, in the case of surface mounting, most of the soldering is done by beam flow soldering, but when soldering the electrolytic capacitor 3, it sometimes receives heat directly from the circuit board 2 side. , there is a risk of deterioration of characteristics.

On the other hand, in the case of the conventional example shown in FIG. 8, the number of parts does not increase, but since the cross section of the metal case 4 is elliptical, sealing is difficult and reliability in this respect is poor. In addition, since the shape is special, it requires specialized manufacturing equipment, making the cost relatively high. Furthermore, similar to the conventional example described above, soldering has the problem of adverse effects due to the heat generated during soldering.

[Means to solve the problem]

This invention was made to solve the above problems,
Its structural features include a plurality of LEIT co-directional electrolytic capacitors arranged side by side, a rear pedestal that connects the bottom sides of each of the bottomed cylindrical metal cases of the electrolytic capacitor, and a rear pedestal that connects each of the metal cases. each pedestal has a bottom wall disposed along at least the side surface of the metal case, each pedestal connects each electrolytic capacitor in a side-by-side state, The predetermined lead terminal is bent along the bottom wall of the front pedestal.

In this case, it is preferable that the respective pedestals be connected, for example, by a connecting plate molded therewith. Further, it is preferable to connect each electrolytic capacitor in parallel and bend only two predetermined lead terminals thereof along the bottom wall of the front pedestal. Furthermore, an electrically neutral dummy terminal may be provided on the bottom wall of the rear pedestal.

[For production]

Since each electrolytic capacitor is integrated with the front pedestal and the rear pedestal in a side-by-side state, handling is convenient, the height can be reduced, and the required capacitance can be secured. Also, during soldering, the sealing side and bottom side of the metal case are protected from heat from the circuit board side by the bottom wall of each pedestal. Furthermore, if each electrolytic capacitor is connected in parallel and only two predetermined lead terminals thereof are drawn out, the wiring pattern of the circuit board can be simplified accordingly.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 5.

Referring first to FIGS. 1 and 2, the electrolytic capacitor arrangement 10 comprises a plurality of co-lead aluminum electrolytic capacitors 1.1.12, in this example two. The electrolytic capacitors 11°I2 are arranged side by side, and electrically insulating pedestals 15 and 16 are attached to the front and rear sides thereof.

The front pedestal 15 has a sealing portion 1.1.1 of a single electrolytic capacitor 1.1.12. ) A bottom wall 15a disposed along the sides of the metal case on the a and 12a sides, and its sealing part 11a.
, 12a and the front wall arranged to face it! , 5b. The rear stand $16 has both electrolytic capacitors 11,
A bottom wall 16a disposed along the sides of the metal case on the bottom 11b and 12b sides of 12, and the bottom 1
1b and 12b, and a rear wall 16b arranged to face each other. In this case, each bottom wall 15a.

16a has storage recesses 17a and 17b for storing the electrolytic capacitors 11 and 12 side by side, that is, with their metal cases adjacent to each other and their axes substantially parallel to the circuit board 2. Each is provided. In this case, the storage recesses 17a, 17b are formed in the shape of a gutter to match the outer shape of each electrolytic capacitor 11, 12, and the shape is also represented on the bottom surface of the pedestal. Accordingly, since the contact area with respect to the circuit board 2 is small, it is difficult to be affected by thermal effects when soldering is performed, for example, by reflow soldering.

The electrolytic capacitors 11.12 are housed in the housing recesses 17a, 17b of each pedestal 15.16, and are fixed, for example, with a suitable adhesive.
．． The depth of the electrolytic capacitors 11 and 16 is approximately half that of the electrolytic capacitors 11 and 12 when they are placed horizontally.

To enable surface mounting, each electrolytic capacitor 11°12
Lead terminals 1.3a, 13b; 14a, 1
4b is bent into a substantially L-shape from the front wall 15b of the front pedestal 15 to its bottom wall 15a. In this connection,
A lead storage groove 18 for the lead terminal is provided from the front wall 15b to the bottom wall 15a. The depth of the lead storage groove 18 is determined in relation to the wire diameter of the lead terminal,
In this example, the depth is approximately half the wire diameter, but different from this, the depth may be equal to the wire diameter.

Also, referring to FIGS. 3 and 4, in order to prevent the Manhattan effect (rearward lifting phenomenon of the capacitor), which is a problem peculiar to surface mount soldering, the bottom of the rear pedestal 16 is electrically connected. A neutral dummy terminal 20 is provided. According to this example, the dummy terminal 20
has a locking portion 20a that straddles the rear wall 16b, and a terminal portion 20b that is bent at a substantially right angle from the lower end of the locking portion 20a along the bottom surface of the rear pedestal 16. It can be attached with adhesive. In this embodiment, the dummy terminal 20 is provided on the side of one of the storage recesses 17b, but it may be placed on the side of the other four storage sections 17a. In particular, in the case of audio use, the sound quality can be improved by connecting the metal cases of each electrolytic capacitor 11, 12 to the dummy terminal 20 with appropriate lead wires.

Although not shown in detail, in this embodiment, the circuit board 2 includes, for example, a wiring pattern connecting the positive lead terminals 13a and 14a, and a negative lead terminal 13.
A wiring pattern is formed to connect the electrolytic capacitors 11 and 14b, respectively, so that the electrolytic capacitors 11 and 12 are connected in parallel.As illustrated in FIG. Positive side lead terminal 13
A and the negative lead terminal 13b are connected to the positive lead terminal 14a and the negative lead terminal 14b of the electrolytic capacitor 11, respectively, so that only the positive lead terminal 13a and the negative lead terminal 13b are pulled out to the outside of the pedestal 15. You can. According to this, the wiring pattern of the circuit board 2 can be made simpler.

Also, as shown by the imaginary line in Figure 1, the front pedestal 1
A connecting plate 21 may be integrally formed at the center and/or both sides of the rear pedestal 15 and the rear pedestal 16 so that the pedestals 15 and 16 can be handled as a single piece.

〔Effect of the invention〕

As explained above, according to the present invention, by attaching a front pedestal and a rear pedestal to a plurality of electrolytic capacitors arranged side by side, it is possible to surface-mount the plurality of electrolytic capacitors at low cost and with a low profile. It can be made into a unit. Further, since the sealing side and the bottom side of the electrolytic capacitor are protected from heat from the circuit board side during soldering on the pedestal, there is no risk of characteristic deterioration due to the heat. On the other hand, this pedestal is provided only on the sealing side and the bottom side of the electrolytic capacitor, and the middle part is removed, so its heat loss is small, and on the other hand, the heat loss when using a hunter is reduced. It is possible to reduce the

[Brief explanation of drawings]

1 to 5 relate to an embodiment of the present invention, in which FIG. 1 is an exploded perspective view of an electrolytic capacitor device according to the embodiment, FIG. 2 is a front view of the device, and FIG. 3 is a front view of the device. The right side view, Figure 4 is a bottom view of the device, Figure 5 is a perspective view showing the lead terminals connected in parallel, Figures 6 to 8 are
Each figure is a perspective view showing a conventional example. In the figure, 11.12 are electrolytic capacitor numbers, Ila and llb. 12a, 12b are lead terminals, 15 is a case member, 15
a-15d are side walls, 15e is a bottom wall, 16a and 16b are storage recesses, 17 is a lead storage groove, and 20 is a dummy terminal. Patent application Artificial Lunar Co., Ltd.

Claims (4)

[Claims] (1) A rear pedestal that connects a plurality of lead-unidirectional electrolytic capacitors arranged side by side and the bottom side of each bottomed cylindrical metal case of the same electrolytic capacitor, and the sealing part side of each metal case. and front pedestals that connect each other, each pedestal has a bottom wall disposed at least along the side surface of the metal case, and each pedestal connects each of the electrolytic capacitors side by side, and An electrolytic capacitor device characterized in that predetermined lead terminals are bent along the bottom wall of the front pedestal. (2) The electrolytic capacitor device according to claim 1, wherein a connecting member is provided between each of the pedestals to connect them. (3) The electrolytic capacitor device according to claim 1, wherein each of the electrolytic capacitors is connected in parallel, and only two predetermined lead terminals thereof are bent along the bottom wall of the front pedestal. (4) The electrolytic capacitor device according to claim 1 or 2, wherein an electrically neutral dummy terminal is provided on the bottom wall of the rear pedestal.