JPH0325252U - - Google Patents
Info
- Publication number
- JPH0325252U JPH0325252U JP1989085961U JP8596189U JPH0325252U JP H0325252 U JPH0325252 U JP H0325252U JP 1989085961 U JP1989085961 U JP 1989085961U JP 8596189 U JP8596189 U JP 8596189U JP H0325252 U JPH0325252 U JP H0325252U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- view
- lead frame
- showing
- pads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/932—Plan-view shape, i.e. in top view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085961U JPH0325252U (sr) | 1989-07-21 | 1989-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989085961U JPH0325252U (sr) | 1989-07-21 | 1989-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0325252U true JPH0325252U (sr) | 1991-03-15 |
Family
ID=31635352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989085961U Pending JPH0325252U (sr) | 1989-07-21 | 1989-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325252U (sr) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5957439A (ja) * | 1982-09-27 | 1984-04-03 | Fujitsu Ltd | 半導体装置 |
| JPS628545A (ja) * | 1985-07-05 | 1987-01-16 | Hitachi Ltd | 高密度リ−ドフレ−ム |
| JPS6248053A (ja) * | 1985-08-28 | 1987-03-02 | Nec Corp | 半導体装置用リ−ドフレ−ムの製造方法 |
| JPS62177953A (ja) * | 1986-01-30 | 1987-08-04 | Nec Corp | リ−ドフレ−ム |
-
1989
- 1989-07-21 JP JP1989085961U patent/JPH0325252U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5957439A (ja) * | 1982-09-27 | 1984-04-03 | Fujitsu Ltd | 半導体装置 |
| JPS628545A (ja) * | 1985-07-05 | 1987-01-16 | Hitachi Ltd | 高密度リ−ドフレ−ム |
| JPS6248053A (ja) * | 1985-08-28 | 1987-03-02 | Nec Corp | 半導体装置用リ−ドフレ−ムの製造方法 |
| JPS62177953A (ja) * | 1986-01-30 | 1987-08-04 | Nec Corp | リ−ドフレ−ム |