JPH03260652A - Alkali-developable photosensitive resin composition - Google Patents

Abstract

PURPOSE:To facilitate development of a film made of the resin composition in an aqueous solution of weak alkali and to enhance heat resistance to soldering and resistance to nonelectrolytic plating by using a combination of a specified unsaturated compound and an epoxy compound. CONSTITUTION:This composition comprises a photopolymerizable unsaturated compound (A), a compound (B) having at least one epoxy group, and a photopol ymerization initiator or a sensitizer (C) in an A : B : C weight proportion of 100 : 5 - 100 : 0.1 - 30. The component A is prepared by allowing glycidyl (meth) acrylate to react with the phenolic hydroxyl groups of a novolak type resin, such as o-cresol novoak resin, and then allowing the resulted product to react with polybasic acid anhydride, such as succinic anhydride, and the component B can be embodied by triglycidyl isocyanurate and the like.

Description

Detailed Description of the Invention (Industrial Application Field) The present invention relates to an alkali-developable photosensitive resin composition, and more specifically, to forming a film made of the alkali-developable photosensitive resin composition on a printed wiring board. This invention relates to an alkali-developable photosensitive resin composition that can be developed with alkali after exposure, and the N-photocured part can be suitably used as a solder resist and an electroless plating resist, as well as as a permanent protective mask. .

(Conventional technology) In recent years, as ICs and LSIs have become more highly integrated.

The printed wiring boards on which these devices are mounted are becoming increasingly dense, with narrower wiring spacing and surface mounting methods in which LSI components such as flat plastic packages (PPP) are mounted on the surface of the board.

By the way, when forming a solder resist on a printed wiring board, a thermosetting resist ink is printed by a screen printing method, and the transferred portion is thermoset. However, the reality is that this method cannot meet the demands for higher density, so a method of obtaining solder resist using the principles of photography has been developed, and along with this, the development of photoresist ink is being considered. has been done. Regarding photoresist inks, from the viewpoint of working environment and processing cost, in place of the type that is developed with an organic solvent, one that can be developed with a weak alkaline aqueous solution such as a sodium carbonate aqueous solution has been proposed.

For example, JP-A No. 61-243.869 and JP-A No. 63-278.052 contain a resin component having a novolac type or bisphenol A type epoxy resin skeleton and can be developed with a slightly weak alkali aqueous solution. A photosensitive coating composition has been disclosed that provides a protective mask with excellent heat resistance, chemical resistance, etc.

Also, JP-A-62-158.710, JP-A-62-158.710,
No. 285゜903 and JP-A No. 63-IL 930 disclose an alkaline development type resin whose base polymer is a ring-opening addition of hydroxyalkylene (meth)acrylate to a copolymer of maleic anhydride and styrene. Compositions are disclosed.

(Problem to be solved by the invention) However, using these photosensitive resin compositions.

When forming a solder resist using a photographic method,
Soldering heat resistance, electroless gold plating resistance, acid resistance, and even alkali resistance are insufficient, and there has been a problem that a product with satisfactory performance cannot be obtained for use as a permanent protective mask for printed wiring boards.

Therefore, an object of the present invention is to provide an alkali-developable photosensitive resin composition free from such problems. That is, (1) it has good sensitivity to light and is easily photocured with a short exposure time; ■Can be easily developed with a weak alkaline aqueous solution such as sodium carbonate. ■It hardens not only by light but also by heat. ■ To provide an alkali-developable photosensitive resin composition that can form a film that is cured by light and heat and has excellent solder heat resistance, electroless gold plating resistance, acid resistance, and water resistance. be.

(Means for Solving the Problems) In order to solve these problems, the present inventors have conducted extensive studies and found that a specific photopolymerizable compound having a carboxyl group and an ethylenically unsaturated group in its side chain has been developed. The present inventors have discovered that the above-mentioned problems can be achieved by using epoxy compounds together with epoxy compounds.

That is, the gist of the present invention is as follows.

Consisting of the following components (A), (B) and (C), (A)
The ratio of component (B) to 100 parts by weight of component is 5 to 10
0 parts by weight, and the proportion of component (C) is 0.1 to 30 parts by weight.

(A) A photopolymerizable unsaturated compound obtained by reacting the phenolic hydroxyl group of component dinovolak type resin with glycidyl (meth)acrylate and reacting this product with a polybasic acid anhydride.

Component (B): A compound having at least one epoxy group.

Component (C): photopolymerization initiator or sensitizer.

Hereinafter, nine aspects of the present invention will be described in detail.

First, each component constituting the alkali-developable photosensitive resin composition of the present invention will be described.

In component (A), glycidyl (meth)acrylate is reacted with the phenolic hydroxyl group of the novolac type resin,
The novolac type resin in the photopolymerizable unsaturated compound obtained by reacting this product with a polybasic acid anhydride refers to the following general formula [I] (however, in the general formula [■], R, , R
2 and R3 are a group selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, and a halogen atom, and n is 2.
Represents an integer between ~30. ) is a compound represented by

The photopolymerizable unsaturated compound that is component (A) can be produced, for example, in the following manner. That is, a novolac type resin is dissolved in an ethylene oxide solvent such as cellosolve acetate, and glycidyl (meth)acrylate and a small amount of a reaction catalyst and a polymerization inhibitor are added thereto.
React at 0-120°C for 2-8 hours. A polybasic acid anhydride is added to this reaction product and the reaction is carried out at 70 to 120°C for 2 to 4 hours to obtain the desired compound.

Producing component (A) in such a process not only shortens the overall process for producing component (A), but also
The fraction of chlorine in component (A) remaining due to the glycidyl group is reduced, and the properties (deterioration resistance, insulation resistance, etc.) of the final coating film are improved.

At this time, these raw materials contain 0.1 to 1.1 equivalents of glycidyl (meth)acrylate and polybasic acid anhydride, preferably 0.5 to 1.0 equivalents of glycidyl (meth)acrylate and polybasic acid anhydride per 1 equivalent of phenolic hydroxyl group of the novolac type resin. It is preferable to react within an equivalent range. If this value exceeds 1.1, the epoxy group becomes excessive and the 9 reaction product becomes unstable, which is not preferable. If this value is less than 0.1, not only the adhesion of the coating film and the photosensitivity become insufficient, but also the solubility in a weakly alkaline aqueous solution decreases, which is not preferable.

Specific examples of novolak type resins constituting component (A) include phenol novolak resin, O-cresol novolak resin, 9m-talesol novolak resin, p-talesol novolak resin, p-ethylphenol novolak resin, and 0-isopropylphenol. Novolac resin 9m
-isopropylphenol novolac resin, p-isopropylphenol novolac resin, o -tert
-butylphenol novolak resin, m-tert-butylphenol novolak resin, p-tert-butylphenol novolak resin, 3,5-xylenol novolak resin, bromophenol novolak resin, etc. Among these, phenol novolak resin,
0-talesol novolak resin, 9m-talesol novolak resin, and p-talesol novolak resin are preferred.

In addition, these novolak resins can also be used in combination of two or more types.

In addition, the polybasic acid anhydrides constituting component (A) include maleic anhydride, succinic anhydride, glutaric anhydride, adipic anhydride, tetrapropenylsuccinic anhydride, phthalic anhydride, and hexahydrophthalic anhydride. , 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride.

3-ethyl hexahydrophthalic anhydride, 4-ethyl hexahydrophthalic anhydride, 3-propyl hexahydrophthalic anhydride, 3-isopropyl hexahydrophthalic anhydride, 4-propyl hexahydrophthalic anhydride phthalic anhydride,
4-isopropylhexahydrophthalic anhydride, 3-methyltetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, 3-ethyltetrahydrophthalic anhydride, 4-ethyltetrahydrophthalic anhydride.

Examples include 3-propyltetrahydrophthalic anhydride, 3isopropyltetrahydrophthalic anhydride, 4propyltetrahydrophthalic anhydride, and 4-isopropyltetrahydrophthalic anhydride.

The compound having at least one epoxy group, which is component (B) constituting the resin composition of the present invention, is blended for the purpose of heat curing. Like this (B)
Ingredients include 1, for example, epoxy resins such as phenol novolak epoxy resin, 0-talesol novolak epoxy resin, bisphenol A epoxy resin, bisphenol S epoxy resin, alicyclic epoxy resin, phenyl glycidyl ether, P-butyl phenol. Examples include compounds having an epoxy group such as glycidyl ether, talesyl glycidyl ether, diglycidyl isocyanurate, triglycidyl isocyanurate, triglycidyl ether, and glycidyl methacrylate.

The photopolymerization initiator or sensitizer, which is the component (C) constituting the resin composition of the present invention, acts on the component (A) and the photopolymerizable monomers and oligomers that are blended as necessary. It initiates polymerization. As such component (C), there is one example.

Ryocetophenone, 2,2-jethoxyacetophenone,
Acetophenones such as p-dimethylacetophenone, p-dimethylaminopropiophenone, dichloroacetophenone, trichloroacetophenone, p-tert-butyltrichloroacetophenone, benzophenone,
2-chloropenzophenone, p,p-dichlorobenzophenone, p,pbisdimethylaminobenzophenone (also referred to as Michler's ketone), p,p'-bisdiethylaminobenzophenone, 3.3', 4.4'-
Benzophenones such as tetra(tertbutylperoxycarbonyl)benzophenone, benzoin ethers such as benzyl, benzoin, benzoin methyl ether, benzoin ethyl ether, pentwinisopropyl ether, pentwinisobutyl ether, benzoin-n-butyl ether, benzyl dimethyl ketal ,
Tetramethylthiuram monosulfide, tetramethylthiuram disulfide, thioxanthone, 2-chlorothioxanthone.

2. Sulfur compounds such as 4-diethylthioxanthone and 2-methylthioxanthone, 2-ethylanthraquinone,
2-tert-butylanthraquinone.

Anthraquinones such as octamethylanthraquinone, 1,2-benzanthraquinone, and 2,3-diphenylanthraquinone; organic peroxides such as azobisisobutyronitrile, benzoyl peroxide, di-tert-butyl peroxide, and cumene peroxide; 2.4.5-)'
J arylimidazole dimer, riboflavin tetrabutyrate, 2-mercaptobenzimidazole, 2-
Thiol compounds such as mercaptobenzoxazole and 2-mercaptobenzothiazole, 2,4.6-)lis(
Examples include organic halogen compounds such as trichloromethyl)-S-triazine, 2,2°2-tribromoethanol, and tribromomethylphenylsulfone. These compounds can also be used in combination of two or more. It is also possible to add compounds that do not act as photopolymerization initiators by themselves, but can increase the ability of the photopolymerization initiators when used in combination with the above compounds. Examples of such compounds include tertiary amines such as triethanolamine, which are effective when used in combination with benzophenone in the alkali developable photosensitive resin composition of the present invention.

It consists of component (A), component (B) and component (C), and the blending ratio of each component in this resin composition is as follows:
5 to 10 parts of component (B) per 100 parts by weight of component (A)
0 parts by weight, preferably 10 to 80 parts by weight.

0.1 to 100 parts by weight of component (A) and component (C)
The amount is 30 parts by weight, preferably 1 to 30 parts by weight.

When the blending ratio of component (B) to 100 parts by weight of component (A) is less than 5 parts by weight, the curability of the resin composition of the present invention by heating decreases. On the other hand, if it exceeds 100 parts by weight, the photopolymerization rate slows down, resulting in a decrease in sensitivity and making it difficult to develop with slightly alkaline water.

Furthermore, if the blending ratio of component (C) to 100 parts by weight of component (A) is less than 0.1 part by weight, the photopolymerization rate becomes slow and the sensitivity decreases. If it exceeds 30 parts by weight, it is difficult for light to reach the substrate.

Adhesion between the substrate and the resin deteriorates.

The alkali-developable photosensitive resin composition of the present invention is.

As described below, it can be suitably used as a solder resist for printed wiring boards. for example.

The photosensitive resin composition of the present invention is dissolved in a solvent and applied to the surface of the printed wiring board, or a dry film made of the alkali-developable photosensitive resin composition of the present invention is pasted on the surface of the printed wiring board. A film was formed by the method described above, and then a negative film was placed on top of the film thus obtained.

After curing the exposed areas by irradiating actinic rays, the unexposed areas are eluted and developed using a weakly alkaline aqueous solution to form a solder resist.

Examples of solvents suitable for dissolving the alkali-developable photosensitive resin composition of the present invention include methyl ethyl ketone,
Examples include ketones such as methyl isobutyl ketone, and cellosolves such as methyl cellosolve, ethyl cellosolve, butyl cellosolve, and cellosolve acetate.

Methods for applying a solution containing the alkali-developable photosensitive resin composition of the present invention to a printed wiring board include a solution dipping method, a spray method, and a method using a roller coater or spinner coater. Yes, either method can be used. After coating to a thickness of, for example, 20 to 30 μm by these methods, a film is formed on the printed wiring board by removing the solvent.

Furthermore, a dry film can be prepared by applying a solution of the alkali-developable photosensitive resin composition of the present invention onto a flexible support such as a polyethylene terephthalate film and drying it. Note that the dry film may be covered with a polyethylene film or the like for protection.

Examples of light suitable for curing the alkali-developable photosensitive resin composition of the present invention include light emitted from lamps such as ultra-high pressure mercury lamps, high-pressure mercury lamps, and metal halide lamps.

Note that the alkali-developable photosensitive resin composition of the present invention can be cured not only by light but also by heat.

Examples of developing solutions suitable for alkali development after exposure include aqueous solutions of alkali metal or alkaline earth metal carbonates, aqueous solutions of alkali metal hydroxides, and the like. Among them, a weakly alkaline aqueous solution consisting of 1 to 3% by weight of carbonates such as IJ carbonate, potassium carbonate, and lithium carbonate can be used to precisely develop fine images.

Alkaline development is carried out at 10 to 50°C, preferably 20 to 40°C.
It can be carried out using a commercially available developer or ultrasonic cleaner at a temperature of .degree.

After alkaline development, in order to improve the corrosion resistance of the exposed area, it is desirable to further harden it by heat treatment. Heat treatment improves the durability against strong alkaline water, adhesion to metals such as copper, and heat resistance durability 1. Surface hardness etc. are significantly improved, and various properties required for a protective mask for printed wiring boards are further improved.

The heat treatment conditions are preferably 80 to 200°C for 10 minutes to 2 hours.

In the alkali-developable photosensitive resin composition of the present invention.

In addition to components (A), (B), and (C), a photopolymerizable curing accelerator or oligomer epoxy group curing accelerator.

Thermal polymerization inhibitors, fillers, dyes, pigments, plasticizers.

Compounding agents and additives such as leveling agents, adhesion improvers, antifoaming agents, flame retardants, and organic solvents can be blended.

What are the types and amounts of such compounding agents and additives?

It can be appropriately selected within a range that does not impair the properties of the photosensitive resin composition of the present invention.

Photopolymerizable polymers and oligomers include 1, for example, 2
- Monomers having hydroxyl groups such as hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-ethylhexyl (meth)acrylate,
Ethylene glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate.

Tetraethylene glycol diacrylate, tetramethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol hexaacrylate , acrylic acid esters such as chrycerol acrylate, and ethylene glycol dimethacrylate.

Diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, trimethylolethane trimethacrylate, pentaerythritol dimethacrylate, pentaerythritol trimethacrylate, pentaerythritol tetramethacrylate, dipentaerythritol tetramethacrylate, di Esters of unsaturated carboxylic acids such as methacrylic esters such as pentaerythritol hexamethacrylate and glycerol methacrylate and aliphatic polyol compounds, diisocyanates and at least one
Examples include urethane acrylate compounds obtained by reaction with a monohydric alcohol having 1 acrylate group or methacrylate group. Moreover, these compounds can also be used in combination of 2 or more types.

These compounds act as viscosity modifiers or photocrosslinking agents.

Epoxy group curing accelerators include amine compounds, imidazole compounds, carboxylic acids, phenols, quaternary
Examples include class ammonium salts and methylol group-containing compounds. When a film obtained by using a small amount of these together is heated after heating, properties such as heat resistance, solvent resistance, acid resistance, plating resistance, adhesion, electrical properties, and hardness are improved. Therefore, it is particularly suitable for use as a solder resist, an electroless metal resist, and a permanent protective mask.

Thermal polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, and pyrogallol.

Examples include tert-butylcatechol and phenothiazine.

Fillers include white alumina, clay, talc, finely powdered silica, barium sulfate, and barium carbonate.

Examples include magnesium oxide and titanium oxide.

Phthalocyanine green is used as a dye and pigment.

Examples include phthalocyanine blue, phthalocyanine yellow benzidine yellow permanent red R, and brilliant carmine 6B.

Examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, tricresyl, and the like.

Antifoaming agents and leveling agents include 9, for example, silicone-based,
Examples include fluorine-based and acrylic-based compounds.

Examples of flame retardants include aluminum hydroxide.

Examples include inorganic flame retardants such as zinc borate, and organic flame retardants such as halogen-containing phosphates such as tris-(β-chloroethyl)-phosphate and pentachlorophenol methacrylate.

(Example) The present invention will be specifically explained below by referring to an example. In addition, in the following, "parts" indicate "parts by weight."

Reference Example 1 In a three-bottle flask equipped with a stirrer, a reflux condenser, and a thermometer, 0-talesol novolac resin [Bryophen ZA-1165, 1120 manufactured by Dainippon Ink & Chemicals, Ltd.
g (1 equivalent of phenolic hydroxyl group) and 120 g of cellosolve acetate were added and heated to 80°C to dissolve. Next, 85 g (0.60 mol) of glycidyl methacrylate, 1 g of triethylamine, and 0.1 g of hydroquinone monomethyl ether were added, and the mixture was reacted at 90°C for 3 hours, then cooled to 30°C, and 60 g of succinic anhydride was added.
(0.60 mol) was added and reacted at 100°C for 2 hours to obtain compound a.

Reference Example 2 In Reference Example 1, phenol novolac resin (Barcam TO-20
93. Compound S was obtained in the same manner as in Reference Example 1, except that 107 g (1 equivalent of phenolic hydroxyl group) was used (manufactured by Dainippon Ink Chemical Co., Ltd.).

Reference Example 3 Compound C was obtained in the same manner as in Reference Example 1 except that 90 g (0.60 mol) of tetrahydrophthalic anhydride was used in place of succinic anhydride.

Reference Example 4 In Reference Example 1, instead of glycidyl methacrylate,
Compound d was obtained by operating in the same manner as in Reference Example 1 except for using 77 g (0.60 mol) of glycidyl acrylate.

Reference Example 5 In a three-necked flask equipped with a stirrer, a reflux condenser, and a thermometer, p-cresol novolak resin [Schonol MC
M-709. 120 g of Showa Kobunshi ■ (1 equivalent of phenolic hydroxyl group) and 120 g of a mixed solvent of butyl cellosolve/carpitol acetate (volume ratio 1:1) were added and dissolved by heating to 80°C.

Next, 114 g (glycidyl methacrylate) (0,
80 moles),)! 1.0 g of J phenylphosphine and 0.2 g of hydroquinone monomethyl ether were added.

After reacting at 80°C for 5 hours, the mixture was cooled to 30°C, 120g (0.80 mol) of tetrahydrophthalic anhydride was added, and the mixture was reacted at 80°C for 3 hours to obtain compound e.

Reference Example 6 Compound f was obtained by operating in the same manner as in Reference Example 5, except that 186 g of bromophenol novolac resin was used in place of the p-talesol novolac resin.

Reference Example 7 Compound g was obtained by operating in the same manner as in Reference Example 5, except that 78 g (0.80 mol) of maleic anhydride was used in place of tetrahydrophthalic anhydride.

Reference Example 8 A compound was obtained by operating in the same manner as in Reference Example 1 except that the amount of glycidyl methacrylate was changed to 7 g (0.05 mol).

Reference Example 9 In Reference Example 1, the amount of succinic anhydride was changed to 5g (0,0
Compound i was obtained by operating in the same manner as in Reference Example 1 except that 5 mol) was used.

Examples 1-7. Comparative Examples 1-2 Component (A), component (B), and (C) obtained in Reference Examples 1-9
) ingredients, photopolymerizable monomers, fillers, pigments.

Thermosetting agent 1 A polymerization inhibitor and an organic solvent were blended in the proportions (parts by weight) shown in Table 1 and kneaded using a three-roll test roll mill to prepare a resist ink. Next, the obtained resist ink was applied onto the degreased and cleaned copper-clad laminate and dried.

A negative film was attached, exposed to N light, developed after N exposure, and heat treated. In this case, the drying properties of the coating film, exposure sensitivity, developability with respect to alkaline solutions, and coating film hardness.

The adhesion between the coating film and the substrate, soldering heat resistance, electroless gold plating resistance of the coating film, chemical resistance, and insulation resistance were evaluated as detailed below. The results are shown in Table 2.

The drying properties of the coating film were tested using resist ink applied to a thickness of 17 to 25 μm on a copper-clad laminate with a thickness of 1.6 mm, and the exposure sensitivity and developability with respect to alkaline solutions were further tested at 70 μm. The coating film obtained by drying at ℃ for 30 minutes was tested.

In addition, the adhesion with the substrate, soldering heat resistance, electroless gold plating resistance, chemical resistance, solvent resistance, and insulation resistance were determined after exposure and development as described above.

After heating at 145° C. for 50 minutes and completely curing, the coating film as a solder resist was tested.

Each evaluation was performed as follows.

(1) Drying property of coating film Tested according to JIS K-5400. The evaluation ranks are as follows.

○: No tack observed at all △: Only one tack can be tolerated A negative film with a density step of 0, 15, or 21 steps) was adhered to the coating film, and an IKW ultra-high pressure mercury lamp [-
Wavelength 365 using new oak manufactured HMW-6-N]
Ultraviolet light around nm for 100 seconds at an illuminance of 5 mw/cm2 (
Irradiated with a light intensity of 500 mJ/cm2), and
) The number of step tablets remaining on the copper foil was examined in the same manner as the developability test for a weak alkaline aqueous solution. In this evaluation method, the higher the sensitivity, the greater the number of remaining stages.

(3) Developability in a weak alkaline aqueous solution For those exposed as described in (2) above.

Using a 1% by weight aqueous sodium carbonate solution, a developing machine (
Manufactured by Furuya Shokai ■, YCE-85), 2.1kg /
Development was carried out at 30° C. for 80 seconds under a pressure of cnf.

After development, it was observed under 30x magnification, and the remaining resin was visually evaluated.

The evaluation ranks are as follows.

○: Good developability (no resist remains on the copper surface) ×: Poor developability (some resist remains on the copper surface) (4) Coating film hardness (2) and Expose and develop as in (3), 14
The hardness of the coating film heated at 5℃ for 50 minutes is determined by JIS K-
When a load of 1 kg was applied using a pencil hardness tester according to the test method of No. 5400, the highest hardness that would not cause scratches on the coating was indicated. The pencil used was ``Mitsubishi Hi-Uni'' (manufactured by Mitsubishi Pencil Co., Ltd.).

(5) Adhesion to the substrate Exposure and development as described in (2) and (3) above,
After heating the coating at 5°C for 50 minutes, crosscuts were made to obtain at least 100 base marks.
A peeling test was performed using adhesive tape.

The state of peeling of the base grains was visually evaluated. The evaluation ranks are as follows.

○: No peeling was observed at all measurement points △: Peeling was observed at 1 to 20 of 100 measurement points X: Peeling was observed at 21 or more points out of 100 measurement points Recognized items (6) Solder heat resistance Exposure and development as described in (2) and (3) above,
Regarding the coating film heated at 5℃ for 50 minutes, JIS D-
0202, it was immersed in a 260°C solder bath for 20 seconds, and the state of the coating film after immersion was evaluated. The evaluation ranks are as follows.

○: No abnormality in the appearance of the coating film ×: Blistering, melting, and peeling in the appearance of the coating film (7) Resistance to electroless gold adhesion Exposure and development as in (2) and (3) above, 14
The patterned substrate was heated at 5° C. for 50 minutes, degreased and cleaned, subjected to catalyst activation treatment, and treated at 90° C. for 15 minutes using a commercially available electroless nickel plating solution (PH=6). Furthermore, an electroless gold plating solution [PH=6. KAu (CN)
3 g/R] at 90° C. for 90 minutes to adhere gold to a thickness of 2 μm, a peeling test was performed using an adhesive tape, and the state of peeling on the copper circuit was visually evaluated. The evaluation ranks are as follows.

○: No peeling was observed on the copper circuit △: 1 to 2
Items in which peeling was observed in some places ×: Items in which peeling was observed in 3 or more areas (8) Chemical resistance Exposure and development as described in (2) and (3) above.
The coating film heated at 5° C. for 50 minutes was immersed in each of the following chemicals at 25° C. for 1 hour, and the appearance and adhesion after immersion were evaluated.

■Acid resistance 10% by weight HCj2 aqueous solution ■Alkali resistance 10% by weight NaOH aqueous solution ■Solvent resistance trichloroethane methylene chloride Isopropyl alcohol The evaluation ranks are as follows.

○: No abnormality ×: Dissolution or swelling (9) Insulation resistance Exposure and development as in (2) and (3) above, 14
JIS Z-319 on the coating film heated at 5℃ for 50 minutes.
A circular electrode was prepared according to 7, normal condition and 55°C, 95%
RH, insulation after 100 hours, manufactured by Toa Denpa ■, 5up
er MegohmeterModel SM-5
It was measured using h.

As is clear from Tables 1 and 2, the coating film made of the resin composition of the present invention has excellent electroless gold plating resistance,
It can be seen that other properties are also excellent.

(Effects of the Invention) Since the present invention is constructed as described above, a film made of the alkali-developable photosensitive resin composition of the present invention is formed on a printed wiring board, exposed to light, and then developed with an alkali. , alkali resistance, solvent resistance, soldering heat resistance, electrical insulation 9 mechanical strength.

A protective mask with excellent surface hardness etc. can be obtained. Furthermore, these properties are improved by thermally curing the exposed areas. It also has resistance to electroless plating, so electroless gold plating can be applied thereon.

You can avoid wasting expensive money.

The alkali-developable photosensitive resin composition of the present invention is.

Resist inks, etching resists related to printed wiring boards, interlayer insulation materials, photosensitive adhesives, paints, plastic reliefs, hard coating agents for plastics, PS plates for offset printing boards, photosensitive liquids for screen printing, etc. 1 It can be used in a wide range of fields.

Claims (1)

[Claims] (1) Consisting of the following components (A), (B) and (C), (
The ratio of component (B) to 100 parts by weight of component A) is 5 to 5.
100 parts by weight, and the proportion of component (C) is 0.1 to 30
Parts by weight of an alkali-developable photosensitive resin composition. Component (A): A photopolymerizable unsaturated compound obtained by reacting the phenolic hydroxyl group of a novolak type resin with glycidyl (meth)acrylate and reacting this product with a polybasic acid anhydride. Component (B): A compound having at least one epoxy group. Component (C): photopolymerization initiator or sensitizer.