JPH03272191A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH03272191A JPH03272191A JP7246090A JP7246090A JPH03272191A JP H03272191 A JPH03272191 A JP H03272191A JP 7246090 A JP7246090 A JP 7246090A JP 7246090 A JP7246090 A JP 7246090A JP H03272191 A JPH03272191 A JP H03272191A
- Authority
- JP
- Japan
- Prior art keywords
- board
- wiring board
- printed wiring
- insulating
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 13
- 239000011810 insulating material Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 239000011347 resin Substances 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 230000004907 flux Effects 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 1
- 230000003670 easy-to-clean Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は印刷配線板に関し、特に絶縁基板の表裏両面の
回路パターンの電気導通を絶縁基板に埋込まれた電気導
通材料により行う印刷配線板に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a printed wiring board, and particularly to a printed wiring board in which electrical continuity between circuit patterns on both the front and back surfaces of an insulating substrate is achieved by an electrically conductive material embedded in the insulating substrate. Regarding.
従来、この種の印刷配線板は、第３図に示す如く、絶縁
基板４に孔を穿孔し、孔の内壁及び表面に電気導伝性金
属を析出させ、回路パターン７及びスルホール８を形成
し、印刷配線板の表裏両面の導通を行っていた。Conventionally, this type of printed wiring board has been produced by drilling holes in an insulating substrate 4 and depositing electrically conductive metal on the inner wall and surface of the hole to form circuit patterns 7 and through holes 8, as shown in FIG. , conduction was performed on both the front and back sides of the printed wiring board.
しかし、上述した従来の印刷配線板は、次のような欠点
がある。However, the conventional printed wiring board described above has the following drawbacks.
１）印刷配線板の表裏両面の電気導通を絶縁基板に孔を
穿孔し、スルホールを形成して行っているため、高密度
な印刷配線板を設計する際に、スルホールに大きく場所
を占有されるため、高密度な印刷配線板の設計ができな
い。1) Electrical continuity between the front and back sides of a printed wiring board is achieved by drilling holes in the insulating substrate to form through holes, so when designing a high-density printed wiring board, the through holes take up a large amount of space. Therefore, it is not possible to design high-density printed wiring boards.
２）孔を穿孔する工程において、高密度な印刷配線板は
非常に多くのスルホールを必要とするため、非常に工数
がかかる。2) In the process of drilling holes, a high-density printed wiring board requires a large number of through holes, which requires a large number of man-hours.
３）スルホールは貫通孔となっているため部品実装時の
フラックス及びはんだの吹き上がりがある。また、部品
実装後のフラックス洗浄工程でスルホールにたまったフ
ラックスの洗浄性か悪い。3) Since the through hole is a through hole, flux and solder may blow up when mounting components. Also, cleaning performance of flux accumulated in through holes during the flux cleaning process after component mounting is poor.
本発明の目的は、高密度な設計が可能で、少い工数て製
造ができ、部品実装時にフラックス及びはんだの吹き上
がりがなく、洗浄性の良い印刷配線板を提供することに
ある。An object of the present invention is to provide a printed wiring board that allows for high-density design, can be manufactured with fewer man-hours, does not cause flux and solder to blow up during component mounting, and is easy to clean.
本発明は、絶縁基板の表裏両面に回路パターンが形成さ
れた印刷配線板において、前記絶縁基板の表裏両面の前
記回路パターンを結ぶように直径が５〜５０μｍの細線
状の電気導通材料を一定間隔に前記絶縁基板に埋込み配
置し、前記電気導通材料により、前記絶縁材料の表裏両
面の前記回路パターンの電気導通が行われる。The present invention provides a printed wiring board in which a circuit pattern is formed on both the front and back surfaces of an insulating substrate, in which thin wire-shaped electrically conductive materials having a diameter of 5 to 50 μm are arranged at regular intervals so as to connect the circuit patterns on both the front and back surfaces of the insulating substrate. The circuit pattern is embedded in the insulating substrate, and the electrically conductive material provides electrical continuity between the circuit patterns on both the front and back surfaces of the insulating material.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の第コの実施例の縦断面図である。FIG. 1 is a longitudinal sectional view of a fourth embodiment of the present invention.
第１の実施例は、第１図に示すように、直径か５〜５０
μｍの銅細線１−を垂直方向に一定間隔に配置し埋込ん
だ絶縁基板２の表裏両面に、表裏両面の導通を行う箇所
を除き絶縁樹脂５を形成し、表裏両面の導通を行う箇所
と前記絶縁樹脂５の上面に任意の回路パターン７を形成
し、はんだ接続箇所を除く表裏両面にソルダレジスト６
を形成する。The first embodiment has a diameter of 5 to 50 mm, as shown in FIG.
An insulating resin 5 is formed on both the front and back sides of an insulating substrate 2 in which micron copper wires 1- are arranged vertically at regular intervals and embedded, except for the areas where conduction is to be made between the front and back sides. An arbitrary circuit pattern 7 is formed on the upper surface of the insulating resin 5, and a solder resist 6 is applied on both the front and back surfaces excluding the solder connection points.
form.
第２図は本発明の第２の実施例の縦断面図である。FIG. 2 is a longitudinal sectional view of a second embodiment of the invention.
第２の実施例は、第２図に示すように、直径が５〜５０
μｍの金相線９を垂直方向に一定間隔に配置し埋込んだ
絶縁基板３の表裏両面に、表裏両面の導通を行う箇所を
除き絶縁樹脂５を形成し、表裏両面の導通を行う箇所と
前記絶縁樹脂５の上面に任意の回路パターン７を形成し
、はんだ接続箇所を除く表裏両面にツルタレジス１〜６
を形成する。The second embodiment has a diameter of 5 to 50 mm, as shown in FIG.
Insulating resin 5 is formed on both the front and back sides of the insulating substrate 3 in which μm gold-phase wires 9 are arranged and embedded at regular intervals in the vertical direction, except for the places where conduction is to be made on both the front and back sides. An arbitrary circuit pattern 7 is formed on the upper surface of the insulating resin 5, and Tsuruta resists 1 to 6 are formed on both the front and back surfaces excluding the solder connection points.
form.
以上説明した様に本発明によれば、次に列挙する効果が
ある。As explained above, the present invention has the following effects.
１）孔をあけてスルホールを形成して印刷配線板の表裏
両面の導通が行われないため、スルホールによる回路パ
ターン配線場所が狭くなることがなく、高密度な印刷配
線板が設計できる。1) Since conduction is not performed between the front and back surfaces of the printed wiring board by forming through holes, the circuit pattern wiring area does not become narrow due to through holes, and a high-density printed wiring board can be designed.
２）表裏両面導通用にスルホールを必要としないため、
孔あけの工数を節減することができる。2) No through holes are required for both front and back sides, so
The man-hours for drilling can be reduced.
３）スルホールという貫通孔を必要としないため、部品
実装時のフラックス及びはんだ吹き上がりがない。また
、部品実装後のフラックス洗浄工程でスルポールといっ
た孔がないための洗浄性が良い。3) No through-holes are required, so there is no flux or solder blown up during component mounting. In addition, cleaning performance is good because there are no holes such as pores in the flux cleaning process after component mounting.
第１図は本発明の第１の実施例の縦断面図、第２図は本
発明の第２の実施例の縦断面図、第３図は従来の印刷配
線板の一例の縦断面図である。
１・・・銅細線、２，３．４・・・絶縁基板、５・・・
絶縁樹脂、６・・ソルダレジスト、７・・・回路パター
ン、８・・・スルホール、９・・・金細線。FIG. 1 is a longitudinal sectional view of a first embodiment of the present invention, FIG. 2 is a longitudinal sectional view of a second embodiment of the invention, and FIG. 3 is a longitudinal sectional view of an example of a conventional printed wiring board. be. 1... Copper thin wire, 2, 3.4... Insulated substrate, 5...
Insulating resin, 6...Solder resist, 7...Circuit pattern, 8...Through hole, 9...Gold wire.
Claims (1)
線板において、前記絶縁基板の表裏両面の前記回路パタ
ーンを結ぶように直径が５〜５０μｍの細線状の電気導
通材料を一定間隔に前記絶縁基板に埋込み配置し、前記
電気導通材料により、前記絶縁材料の表裏両面の前記回
路パターンの電気導通を行ったことを特徴とする印刷配
線板。In a printed wiring board in which circuit patterns are formed on both the front and back sides of an insulating substrate, thin wire-shaped electrically conductive material having a diameter of 5 to 50 μm is spaced at regular intervals on the insulating substrate so as to connect the circuit patterns on both the front and back sides of the insulating substrate. 1. A printed wiring board, characterized in that the circuit pattern is embedded in the insulating material and electrically conducts the circuit pattern on both the front and back surfaces of the insulating material by the electrically conductive material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7246090A JPH03272191A (en) | 1990-03-20 | 1990-03-20 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7246090A JPH03272191A (en) | 1990-03-20 | 1990-03-20 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03272191A true JPH03272191A (en) | 1991-12-03 |
Family
ID=13489937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7246090A Pending JPH03272191A (en) | 1990-03-20 | 1990-03-20 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03272191A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6093476A (en) * | 1997-05-02 | 2000-07-25 | Shinko Electric Industries Co., Ltd. | Wiring substrate having vias |
| CN111223833A (en) * | 2020-01-10 | 2020-06-02 | 四川豪威尔信息科技有限公司 | Integrated circuit structure and forming method thereof |
-
1990
- 1990-03-20 JP JP7246090A patent/JPH03272191A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6093476A (en) * | 1997-05-02 | 2000-07-25 | Shinko Electric Industries Co., Ltd. | Wiring substrate having vias |
| CN111223833A (en) * | 2020-01-10 | 2020-06-02 | 四川豪威尔信息科技有限公司 | Integrated circuit structure and forming method thereof |
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