JPH03280594A - Board unit mounting structure - Google Patents

Abstract

PURPOSE:To suppress an impact force to be transmitted to a board to a minimum limit, and to prevent soldering crack of a lead mounting part of an electronic component, craze and crack of the board by forming a heat sink unit to be mounted on the board and the board in a structure to be clamped together at a sheath. CONSTITUTION:A heat sink unit 4 is secured to a board 5 at heat sink securing holes 9 by heat sink securing screws 7. Further, an electronic component 3 is so secured to the unit 4 by an electronic component securing screw 6 as to be brought into close contact with the unit 4 in order to raise heat dissipating effect. Heat sink securing legs 8 of parts of the unit 4 are provided with clamping securing holes 13 coaxially with board unit securing holes 12 formed at the board 5. A board unit 1 is so secured to the board unit mounting boss 10 of a sheath body 2 as to clamp the unit 4 together with the board 5 at the body 2 by board unit securing screws 11.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a board unit comprising electronic parts, mechanical parts, and a board.

[Prior Art] FIG. 3(a) is a perspective view showing the configuration of a conventional board unit mounted on an exterior part, and FIG. 3(b) is an exploded perspective view of the conventional board unit and exterior part. In the figure, 1 is a board unit, 2 is an exterior main body to which the board unit l is attached, 3 is an electronic component that generates heat, 4 is a heat radiator that radiates heat generated from the electronic component 3, and 5 is an electronic component 3 and radiator 4
6 is an electronic component fixing screw for fixing the electronic component 3 to the heatsink 4, 7 is a heatsink fixing screw for fixing the heatsink 4 to the board, and 8 is heat dissipation by the heatsink fixing screw 7. A radiator fixing foot for fixing the device 4 to the board 5, 9 a radiator fixing hole provided in the radiator fixing leg 8, and 10 a board for mounting the board unit t provided in the exterior main body 2. The unit mounting boss 11 is a board unit fixing screw for fixing the board unit 1 to the board unit mounting boss lO, and 12 is a board unit fixing hole provided in the board 5.

[Problems to be Solved by the Invention] Since the conventional board unit is configured as described above, when an impact such as vibration or dropping is applied to the exterior part main body 2, the impact may damage the board unit mounting boss 10. A force is locally applied to the substrate 5 of the substrate unit 1 through this. As a result, the board 5 may be deformed, causing cracks in the solder at the part where the leads of the electronic component 3 are attached, or, if the board 5 is made of a paper base material with low bending strength, cracks may occur in the A part of the board 5. There were problems with it getting in and breaking.

This invention has been made to solve the above-mentioned problems, and aims to provide a board unit that does not cause solder cracks or cracks or cracks in the board when attaching leads to electronic components.

[Means for Solving the Problems] The board unit mounting structure of the present invention is a board unit on which a heat radiator is mounted, in which the heat radiator is provided with a fixing portion for fastening the board to an exterior part.

[Example] Hereinafter, an example of the present invention will be described in detail based on the drawings.

FIGS. 1(a)-(b) show a first embodiment of the present invention,
FIG. 1(a) is a perspective view showing the configuration when the board unit is attached to the exterior part, and FIG. 1(b) is an exploded perspective view of the board unit and the exterior part. In FIG. 1(b), reference numeral 13 indicates a fixing hole for co-tightening provided in the radiator fixing leg 8.

In the board unit l, an electronic component 3 that generates heat is mounted on a board 5 by soldering. A radiator 4 that radiates heat emitted from the electronic component 3 is attached to the substrate 5 by a radiator fixing screw 7 through a radiator fixing hole 9 provided in a radiator fixing foot 8.
is fixed.

Further, the electronic component 3 is fixed to the heat radiator 4 by an electronic component fixing screw 6 so as to be in close contact with the heat radiator 4 in order to improve the heat dissipation effect. Further, the heatsink fixing foot 8 which is a part of the heatsink 4 is provided with a co-tightening fixing hole 13 coaxially with the board unit fixing hole 12 provided in the board 5.

The board unit 1 configured as described above is fixed to the board unit mounting boss 10 of the exterior body 2 with the board unit fixing screws 11 so that the radiator 4 and the board 5 are fastened together to the body 2 of the exterior body.

By fixing the board unit l to the exterior main body 2 in this way, even if shocks such as vibration or dropping are applied to the exterior main body 2, the heatsink 4 mounted on the board 5 will be attached to the board unit mounting post 10 together with the board 5. Because they are fastened together, the mechanical strength of the heatsink 4 minimizes the impact force transmitted to the board 5.
Attaching leads to the electronic component 3 can prevent solder cracks and cracks and cracks in the board 5.

2(a) to 2(b) show other embodiments of the present invention, FIG. 2(a) is a perspective view showing the configuration when the board unit is attached to the exterior part, and FIG. 2(b) FIG. 2 is an exploded perspective view of a board unit and an exterior part according to the same embodiment. In FIG. 2(b), reference numeral 14 denotes a radiator fixing terminal attached to the radiator 4. As shown in FIG.

The heatsink 4 is fixed to the board 5 together with the electronic component 3 by soldering the heatsink fixing terminal 14 to the board 5. Further, a part of the heat sink 4 is machined, and a co-tightening fixing hole 13 is provided coaxially with the substrate unit fixing hole 12 provided in the substrate 5.

Therefore, as in the first embodiment, the mechanical strength of the heat sink 4 minimizes the impact force transmitted to the board 5, and the lead attachment of the electronic component 3 prevents cracks in the solder and cracks in the board 5. I can do it.

It should be noted that the present invention is not limited to the configuration of the above-mentioned embodiments, and the configuration of each part can be arbitrarily changed and embodied without departing from the spirit of the invention.

[Effects of the Invention] As described above, according to the present invention, when an impact such as vibration or dropping is applied to the main body of the exterior part, the heat sink mounted on the board and the board are fastened together to the exterior part. As a result, the impact force transmitted to the board can be suppressed to a minimum, and it is possible to prevent solder cracks in the lead attachment of electronic components and cracks and breaks in the board.

[Brief explanation of drawings]

FIG. 1(a) is a perspective view showing the configuration when the board unit according to the first embodiment of the present invention is attached to the exterior part.
FIG. 2(b) is an exploded perspective view of the board unit and the exterior part according to the same embodiment, FIG.
Figure (b) is an exploded perspective view of the board unit and exterior part according to the same embodiment, Figure 3 (a) is a perspective view showing the configuration when the conventional board unit is attached to the exterior part, and Figure 3 (b) FIG. 2 is an exploded perspective view of a conventional board unit and an exterior part. In addition, in the figures, the same reference numerals indicate the same or corresponding parts. l ・ 2 ・ 4 ・ 5 ・ 10 ・ 1 l ・ l 3 ・・Board unit・・Exterior body・・Radiator・・Board board unit mounting boss More than the fixing hole for tightening the board unit fixing screws

Claims (1)

[Claims] 1. A board unit mounting structure on which a heat sink is mounted, wherein the heat sink is provided with a fixing portion for fastening the board to an exterior part.