JPH0330438U - - Google Patents
Info
- Publication number
- JPH0330438U JPH0330438U JP1989091267U JP9126789U JPH0330438U JP H0330438 U JPH0330438 U JP H0330438U JP 1989091267 U JP1989091267 U JP 1989091267U JP 9126789 U JP9126789 U JP 9126789U JP H0330438 U JPH0330438 U JP H0330438U
- Authority
- JP
- Japan
- Prior art keywords
- resin package
- semiconductor device
- view
- easily charged
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す半導体装置の
斜視図、第２図は第１図−線における断面図
、第３図第４図は本考案の他の実施例を示す斜視
図、第５図は従来の半導体装置の斜視図、第６図
は第５図−線における断面図である。 図において、１……半導体素子、２……フレー
ム、３……接合材、４……端子、５……リード線
、６……樹脂パツケージ、７……帯電しやすい材
料を示す。なお、図中、同一符号は同一、または
相当部分を示す。
斜視図、第２図は第１図−線における断面図
、第３図第４図は本考案の他の実施例を示す斜視
図、第５図は従来の半導体装置の斜視図、第６図
は第５図−線における断面図である。 図において、１……半導体素子、２……フレー
ム、３……接合材、４……端子、５……リード線
、６……樹脂パツケージ、７……帯電しやすい材
料を示す。なお、図中、同一符号は同一、または
相当部分を示す。
Claims (1)
- 半導体素子を樹脂パツケージしてなる半導体装
置に於いて、前記樹脂パツケージの表面又は裏面
もしくはその両面に帯電しやすい材料を形成した
ことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091267U JPH0330438U (ja) | 1989-08-01 | 1989-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989091267U JPH0330438U (ja) | 1989-08-01 | 1989-08-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0330438U true JPH0330438U (ja) | 1991-03-26 |
Family
ID=31640763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989091267U Pending JPH0330438U (ja) | 1989-08-01 | 1989-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0330438U (ja) |
-
1989
- 1989-08-01 JP JP1989091267U patent/JPH0330438U/ja active Pending