JPH0331073Y2 - - Google Patents

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Publication number
JPH0331073Y2
JPH0331073Y2 JP1987013535U JP1353587U JPH0331073Y2 JP H0331073 Y2 JPH0331073 Y2 JP H0331073Y2 JP 1987013535 U JP1987013535 U JP 1987013535U JP 1353587 U JP1353587 U JP 1353587U JP H0331073 Y2 JPH0331073 Y2 JP H0331073Y2
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Japan
Prior art keywords
substrate
section
holding
support
holding part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
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JP1987013535U
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Japanese (ja)
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JPS63121434U (en
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Priority to JP1987013535U priority Critical patent/JPH0331073Y2/ja
Publication of JPS63121434U publication Critical patent/JPS63121434U/ja
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Description

【考案の詳細な説明】 〔産業上の利用分野〕 本考案は、フオトマスクブランク、透明導電膜
付基板等の被エツチング層を有する正方形状、長
方形状の基板上にレジスト膜を塗布する回転塗布
装置に関し、特に基板を保持し、かつ基板裏面に
レジストの糸状物の付着を防止する、保持部と、
他のところから保持部に基板を搬送する、又は保
持部から他のところに搬送する、搬送部とを備え
た回転塗布装置に関するものである。
[Detailed description of the invention] [Industrial application field] The present invention is a spin coating method for applying a resist film onto a square or rectangular substrate having a layer to be etched, such as a photomask blank or a substrate with a transparent conductive film. Regarding the apparatus, in particular, a holding part that holds the substrate and prevents resist filaments from adhering to the back surface of the substrate;
The present invention relates to a spin coating device that includes a conveying section that conveys a substrate from another location to a holding section or from the holding section to another location.

〔従来の技術〕[Conventional technology]

従来、この装置としては第7図及び第8図に示
すものがあつた。なお、第7図は平面図、第8図
は正面図である。
Conventionally, this device has been shown in FIGS. 7 and 8. Note that FIG. 7 is a plan view, and FIG. 8 is a front view.

この装置は、レジスト膜を塗布する、フオトマ
スクブランク等の正方形の基板1を保持する保持
部2と、この保持部2に基板1を搬送する、また
はレジスト膜を塗布した基板1を、基板収納容器
等に搬送する搬送部3とを備えている。
This device includes a holding section 2 that holds a square substrate 1 such as a photomask blank on which a resist film is applied, and a holding section 2 that transports the substrate 1 to this holding section 2 or stores the substrate 1 coated with a resist film. It is equipped with a conveying section 3 for conveying to a container or the like.

この保持部2は、円板状物からなり、その直径
が基板1の対角線の寸法よりも小さく、かつ基板
1を真空吸着するための真空吸着用穴4が形成さ
れている。また、保持部2には、この保持部2を
回転させる回転用軸5が付設されている。
This holding part 2 is made of a disc-shaped object, the diameter of which is smaller than the diagonal dimension of the substrate 1, and a vacuum suction hole 4 for vacuum suction of the substrate 1 is formed. Further, the holding portion 2 is provided with a rotation shaft 5 for rotating the holding portion 2.

また、搬送部3は、基板1の搬送中、基板1を
支持する棒状の支持部6と、この支持部6が基板
1の下方において保持部2方向に移動したとき、
その移動距離を検知する棒状の検知部7と、支持
部6と検知部7とを連結する連結部8と、この連
結部8を介して支持部6と検知部7とを第7図に
おいて矢印方向に移動させるための移動部9とを
備えたものである。そして、この搬送部3は、保
持部2を介して対向して一対設けられており、そ
の左右の搬送部3,3の移動は同期している。
Further, during the transportation of the substrate 1, the transportation section 3 includes a rod-shaped support section 6 that supports the substrate 1, and when the support section 6 moves toward the holding section 2 below the substrate 1,
A rod-shaped detection section 7 that detects the moving distance; a connection section 8 that connects the support section 6 and the detection section 7; It is provided with a moving section 9 for moving the device in the direction shown in FIG. A pair of these conveyance sections 3 are provided facing each other via the holding section 2, and the movements of the left and right conveyance sections 3, 3 are synchronized.

次に、この回転塗布装置における、レジスト膜
塗布及び塗布後のレジスト膜付基板の搬送方法に
ついて説明する。なお、基板を保持部に搬送する
方法は、塗布後のレジスト膜付基板の搬送方法と
逆の工程であることから説明を省略する。
Next, a method of applying a resist film and transporting a resist film coated substrate after application in this spin coating apparatus will be described. Note that the method for transporting the substrate to the holding section is a step opposite to the method for transporting the resist film-coated substrate after coating, so the explanation will be omitted.

先ず、保持部2に搬送され真空吸着された基板
1上にレジストを滴下し、所望する回転数及び回
転時間で、保持部2を回転、すなわち基板1を回
転してレジスト膜を基板1の主表面1a(表面)
に塗布する。次に、搬送部3,3のそれぞれの支
持部6を基板1の下方において保持部2方向に、
それぞれの検知部7が保持部2の側面2aに当接
するまで移動させる。次に側面2aに検知部7が
当接した後、さらに移動させると移動部9を介し
て、この搬送部3,3を移動させるモータに負荷
がかかり、この負荷を検出したとき、搬送部3,
3の移動を停止させる。すなわち、第7図、第8
図に示すとおりとなる。次に、基板1の真空吸着
を解除し、左右の搬送部3,3のそれぞれの支持
部6を離間する方向、すなわち第7,8図におい
て左の搬送部3の支持部6は左方向、右の搬送部
3の支持部6は右方向に、支持部6が上昇したと
き基板1を支持できる程度に移動し、検知部7,
7を保持部2から離間する。次に、搬送部3,3
を上昇させ、それぞれの支持部6を基板1のもう
一方の主表面1b(裏面)に当接し、さらに上昇
させて支持部6により基板1を支持して、例えば
基板収納容器等に搬送する。
First, a resist is dropped onto the substrate 1 that has been transferred to the holding section 2 and vacuum-adsorbed, and the holding section 2 is rotated at a desired rotation speed and rotation time, that is, the substrate 1 is rotated to coat the resist film on the main surface of the substrate 1. Surface 1a (surface)
Apply to. Next, the support parts 6 of the transport parts 3, 3 are placed below the substrate 1 in the direction of the holding part 2,
It is moved until each detection part 7 comes into contact with the side surface 2a of the holding part 2. Next, after the detection part 7 comes into contact with the side surface 2a, when the detection part 7 is moved further, a load is applied to the motor that moves the transport parts 3, 3 via the moving part 9, and when this load is detected, the transport part 3 ,
Stop the movement of 3. That is, Figures 7 and 8
As shown in the figure. Next, the vacuum suction of the substrate 1 is released, and the support parts 6 of the left and right transport parts 3, 3 are separated from each other, that is, the support part 6 of the left transport part 3 is moved in the left direction in FIGS. The support section 6 of the right transport section 3 moves rightward to the extent that it can support the substrate 1 when the support section 6 rises, and the detection section 7,
7 is separated from the holding part 2. Next, the transport section 3, 3
is raised, each support part 6 comes into contact with the other main surface 1b (back surface) of the substrate 1, and the substrate 1 is further raised to be supported by the support part 6 and transported to, for example, a substrate storage container.

〔考案が解決しようとする問題点〕[Problem that the invention attempts to solve]

しかしながら、従来の回転塗布装置において、
その搬送部の支持部6が、保持部2から突出して
いる、基板1の角部1cの裏面1bに当接して支
持することを目的としたものであることから、保
持部2の直径は、基板1の主表面の対角線の寸法
よりも小さい寸法が要求され、そのために、第9
図に示すように基板1の裏面1bの角部には、剥
離してゴミとなる、レジストの糸状物10が付着
してしまう問題点があつた。すなわち、保持部2
に基板1を保持し、回転したとき、保持部2から
外側の、基板1の部分(図で示す二点鎖線よりも
外側の部分)のみならず、二点鎖線の内側にも糸
状物10が付着してしまう問題点があつた。これ
は、基板1が回転すると、基板1の保持部2から
外に出ている角部に対する空気抵抗が大きく、そ
の空気抵抗によつて、裏面1bの角部に、回転中
に基板1から飛散したレジストの糸状物10が付
着する。
However, in conventional spin coating equipment,
Since the supporting part 6 of the conveying part is intended to abut and support the back surface 1b of the corner part 1c of the substrate 1, which protrudes from the holding part 2, the diameter of the holding part 2 is as follows. A dimension smaller than the diagonal dimension of the main surface of the substrate 1 is required, and therefore, the ninth
As shown in the figure, there was a problem in that resist filaments 10, which peeled off and became dust, were attached to the corners of the back surface 1b of the substrate 1. That is, the holding part 2
When the substrate 1 is held and rotated, the filamentous material 10 is found not only in the part of the substrate 1 outside the holding part 2 (the part outside the two-dot chain line shown in the figure) but also inside the two-dot chain line. There was a problem with it sticking. This is because when the substrate 1 rotates, there is a large air resistance against the corner of the substrate 1 protruding from the holding part 2, and due to this air resistance, the air is scattered from the substrate 1 to the corner of the back surface 1b. The filament 10 of the applied resist is attached.

〔問題点を解決するための手段〕[Means for solving problems]

本考案は前述した問題点を除去するためになさ
れたもので、その特徴は、レジスト膜を塗布する
基板を保持し、回転させる保持部と、前記基板を
搬送する搬送部とを具備する回転塗布装置におい
て、前記保持部が、その直径が前記基板の主表面
の対角線寸法以上の寸法である円板であり、かつ
前記保持部に前記基板を保持したとき、前記基板
の2側面により形成される角部近傍の下に位置
し、その位置から前記保持部の側面まで切り取ら
れた切欠部を有し、さらに前記搬送部が、前記切
欠部を通し、かつ搬送のときに前記基板を支持す
る支持部を備えている回転塗布装置である。
The present invention was devised to eliminate the above-mentioned problems, and its features include a rotary coating system comprising a holding section that holds and rotates a substrate on which a resist film is to be applied, and a transport section that transports the substrate. In the apparatus, the holding part is a disk whose diameter is equal to or larger than the diagonal dimension of the main surface of the substrate, and when the holding part holds the substrate, the holding part is formed by two side surfaces of the substrate. A support that is located below near a corner and has a notch cut out from that position to a side surface of the holding part, and further allows the conveying part to pass through the notch and support the substrate during conveyance. It is a rotary coating device equipped with a section.

なお、本考案の望ましい態様は、前記切欠部
が、前記角部を形成する2側面のうち、前記基板
が回転する方向の後方の側面の下に設けられてい
ることである。
In addition, a desirable aspect of the present invention is that the cutout portion is provided under the rear side surface in the direction in which the substrate rotates, of the two side surfaces forming the corner portion.

〔実施例〕〔Example〕

本考案の回転塗布装置の一実施例を第1図〜第
6図に基づいて詳細に説明する。なお、第1図は
平面図、第2図は正面図、第3図及び第4図はそ
れぞれ、第1図のX1−X1線断面図及びY1−Y1線
断面図であり、第5図及び第6図はそれぞれ、基
板に支持部が当接したときの、X1−X1線断面図
及びY1−Y1線断面図である。
An embodiment of the spin coating device of the present invention will be described in detail with reference to FIGS. 1 to 6. In addition, FIG. 1 is a plan view, FIG. 2 is a front view, and FIGS. 3 and 4 are sectional views taken along the lines X1 - X1 and Y1 - Y1 in FIG. 1, respectively. FIG. 5 and FIG. 6 are respectively a sectional view taken along the line X 1 -X 1 and sectional view taken along the line Y 1 -Y 1 when the support portion is in contact with the substrate.

本例の回転塗布装置は、主表面が4インチ×4
インチである、ガラス基板(厚さ0.09インチ)上
にクロム膜からなる遮光性膜を被着したフオトマ
スクブランクである基板20を保持する保持部2
1と、基板20を搬送する、一対の搬送部22,
22とを具備したものである。そして、保持部2
1の直径は、基板20を保持部21に保持したと
き、平面視、基板20が保持部21の円に内接す
るように、141.4mmであり、その厚さt1は7mmで
ある。また、この保持部21は、4個の切欠部2
1aを有しており、この切欠部21aは、基板2
0を保持部21に保持したとき、基板20の角部
20cを形成する2側面20a,20bのうち、
第1図に示す矢印方向に基板20を回転したとき
の回転方向後方の側面20bの下及び角部20近
傍に形成されている。また、切欠部21aは、保
持部21の側面21bまで切り欠かれており、ま
た切欠部21aの幅寸法l1は12mm、基板20の側
面からの奥行寸法l2は10mmである。さらに、保持
部21には、基板20を真空吸着するための真空
吸着用穴21cが設けられており、また、保持部
21を回転させる回転用軸23が付設されてい
る。一方、搬送部22は、基板20を支持する、
直状の支持部22aとL字状の支持部22bとを
備え、また支持部22a,22bが基板20の下
方において保持部21方向に移動したとき、その
移動距離を検知する棒状の検知部22cと、支持
部22a,22b及び検知部22cとを連結する
連結部22dと、これら支持部22a,22b、
検知部22c、連結部22dを、第1図の矢印
A,Bで示す方向に移動させる移動部22eとを
備えている。
The spin coating device of this example has a main surface of 4 inches x 4
Holding unit 2 that holds a substrate 20, which is a photomask blank made of a glass substrate (0.09 inch thick) coated with a light-shielding film made of chromium film.
1, a pair of transport units 22 that transport the substrate 20,
22. And the holding part 2
1 has a diameter of 141.4 mm when the substrate 20 is held in the holding part 21 so that the substrate 20 is inscribed in the circle of the holding part 21 in plan view, and its thickness t 1 is 7 mm. Moreover, this holding part 21 has four notches 2
1a, and this notch 21a is connected to the substrate 2.
0 is held in the holding part 21, among the two side surfaces 20a and 20b forming the corner 20c of the substrate 20,
It is formed under the side surface 20b and near the corner 20 at the rear in the direction of rotation when the substrate 20 is rotated in the direction of the arrow shown in FIG. The notch 21a is cut out to the side surface 21b of the holding portion 21, and the width l1 of the notch 21a is 12 mm, and the depth l2 from the side surface of the substrate 20 is 10 mm. Furthermore, the holding part 21 is provided with a vacuum suction hole 21c for vacuum suctioning the substrate 20, and is also provided with a rotation shaft 23 for rotating the holding part 21. On the other hand, the transport unit 22 supports the substrate 20.
A rod-shaped detection section 22c includes a straight support section 22a and an L-shaped support section 22b, and detects the moving distance when the support sections 22a and 22b move toward the holding section 21 below the substrate 20. , a connecting part 22d that connects the supporting parts 22a, 22b and the detecting part 22c, and these supporting parts 22a, 22b,
It includes a moving section 22e that moves the detecting section 22c and the connecting section 22d in the directions indicated by arrows A and B in FIG.

さらに、第3図及び第4図に示すように、支持
部22a,22bのそれぞれの一端部は、段差を
設けており、その底面22a1,22b1は基板20
を支持する面であり、支持部22aの段差の側面
22a2は基板20の搬送において、基板20を挾
持する面であり、一方支持部22bの段差の側面
22b2は、後記する搬送方法において、基板20
に支持部22bを当接したとき、確実にその底面
22b1に当接させるための傾斜面である。なお、
支持部22aの一端から検知部22cまでの長さ
寸法l4は31mmであり、支持部22a,22bのそ
れぞれの幅寸法l3は10mmで、検知部22cが保持
部21に当接したときの、支持部22aの一端か
ら基板20の側面までの長さ寸法l5は9mmであ
る。さらに、支持部22a,22bのそれぞれの
段差の底面22a1,22b1の長さ寸法l6は10mmで
あり、段差寸法l7は1mmである。また支持部22
a,22bの材質はポリアセタール樹脂である。
Further, as shown in FIGS. 3 and 4, one end of each of the support parts 22a and 22b is provided with a step, and the bottom surfaces 22a 1 and 22b 1 of the support parts 22a and 22b are connected to the substrate 20.
The side surface 22a 2 of the step of the support part 22a is a surface that clamps the substrate 20 during transportation of the substrate 20, while the side surface 22b 2 of the step of the support part 22b is a surface that supports the substrate 20 in the transport method to be described later. Substrate 20
This is an inclined surface for ensuring that when the supporting portion 22b is brought into contact with the bottom surface 22b1 . In addition,
The length l4 from one end of the support part 22a to the detection part 22c is 31 mm, and the width l3 of each of the support parts 22a and 22b is 10 mm. , the length l5 from one end of the support portion 22a to the side surface of the substrate 20 is 9 mm. Further, the length l 6 of the bottom surfaces 22a 1 and 22b 1 of the respective steps of the support portions 22a and 22b is 10 mm, and the step dimension l 7 is 1 mm. Also, the support part 22
The material of a and 22b is polyacetal resin.

次に、本例における搬送方法について以下に述
べる。なお、レジスト膜の塗布方法は従来と同様
であることから説明を省略し、また基板20を保
持部21から取り外す搬送方法について述べる。
Next, the transport method in this example will be described below. Note that since the method of applying the resist film is the same as the conventional method, a description thereof will be omitted, and the method of transporting the substrate 20 to be removed from the holding section 21 will be described.

先ず、レジスト膜が基板20上に塗布された
後、移動部22eを介して、支持部22a,22
b及び検知部22cを基板20側に移動させる。
なお、左右の搬送部22,22は同期している。
そして、検知部22cが保持部21の側面21b
に当接し、すなわち、搬送部22の支持部22
a,22bの一端が、基板20の下方及び切欠部
21aの下方に位置し、さらに移動させると、移
動部22eを介して、この搬送部22を移動させ
るモータに負荷がかかり、負荷検出手段によりこ
の負荷を検出し、搬送部22の移動を停止する。
したがつて、第1図〜第4図に示すように、搬送
部22の支持部22a,22bの一端の底面22
a1,22b1が基板20の下方にくる。次に、搬送
部22を基板20から離れる方向、すなわち左の
搬送部22は左方向、右の搬送部22は右方向に
それぞれ0.5mm移動し、検知部22cを保持部2
1から離間させる。次に、左右の搬送部22,2
2を上昇し、基板20に支持部22a,22bの
段差の底面22a1,22b1を当接し(第5図及び
第6図参照)、さらに搬送部22を上昇させなが
ら、左右の搬送部22,22を基板20側に移動
し、支持部22aの段差の側面22a2により基板
20を挾持し、基板20を支持部22a,22b
によつて支持して上昇させる。なお、この基板2
0の上昇の前に、勿論基板20の真空吸着は解除
しておく。
First, after a resist film is applied onto the substrate 20, the supporting parts 22a and 22 are moved through the moving part 22e.
b and the detection unit 22c are moved to the substrate 20 side.
Note that the left and right conveyance units 22, 22 are synchronized.
Then, the detection section 22c detects the side surface 21b of the holding section 21.
In other words, the support part 22 of the conveying part 22
One end of a, 22b is located below the substrate 20 and below the notch 21a, and when it is moved further, a load is applied to the motor that moves this conveying section 22 via the moving section 22e, and the load detection means detects the This load is detected and the movement of the transport section 22 is stopped.
Therefore, as shown in FIG. 1 to FIG.
a 1 and 22b 1 are located below the substrate 20. Next, the transport section 22 is moved in the direction away from the substrate 20, that is, the left transport section 22 is moved to the left, and the right transport section 22 is moved to the right by 0.5 mm, and the detection section 22c is moved to the holding section 20.
Separate from 1. Next, the left and right conveyance sections 22, 2
2, and touch the bottom surfaces 22a 1 and 22b 1 of the steps of the support parts 22a and 22b to the substrate 20 (see FIGS. 5 and 6), and while further raising the transport part 22, the left and right transport parts 22 , 22 to the substrate 20 side, sandwich the substrate 20 by the stepped side surfaces 22a 2 of the support section 22a, and then move the substrate 20 onto the support sections 22a, 22b.
to support and raise it. Note that this board 2
Of course, before the temperature rises to 0, the vacuum suction of the substrate 20 is released.

次に、支持部22によつて支持された基板20
を、例えば基板収納容器等に搬送する。
Next, the substrate 20 supported by the support part 22
, for example, to a substrate storage container or the like.

以上、本例においては、保持部21に切欠部2
1aを形成し、この切欠部21aに、搬送部22
の支持部22a,22bを通して基板20を支持
するようにしていることから、基板20の対角線
の寸法よりも直径が大きい保持部21を用いるこ
とができ、その結果基板20の角部20cが保持
部21から突出することがないのでレジストの糸
状物が基板20の裏面に付着することもなく、ま
た切欠部21aの形成されている位置が、回転方
向の後方側面の角部近傍であることから、その切
欠部21aを形成してもレジストの糸状物は基板
20の裏面に付着しない。
As described above, in this example, the notch 2 is provided in the holding part 21.
1a, and a conveying section 22 is formed in this notch 21a.
Since the substrate 20 is supported through the supporting portions 22a and 22b of the substrate 20, it is possible to use the holding portion 21 having a diameter larger than the diagonal dimension of the substrate 20, and as a result, the corner portion 20c of the substrate 20 is 21, so that the filamentous resist does not stick to the back surface of the substrate 20, and since the notch 21a is formed near the corner of the rear side surface in the rotation direction, Even if the cutout portion 21a is formed, the filamentous resist does not adhere to the back surface of the substrate 20.

本考案は前記実施例に限らず下記のものであつ
てもよい。
The present invention is not limited to the above-described embodiments, but may include the following embodiments.

先ず、保持部の切欠部の位置は前記実施例のよ
うに、基板の各側面下方に設けずに、相対向する
2側面のそれぞれに2個設けてもよい。しかしな
がら、角部を形成する2側面の回転方向の前方方
向の側面に設けられた、切欠部のところの基板の
裏面にはレジストの糸状物が付着することもある
ので望ましくは前記実施例のような位置がよい。
また、前記実施例では支持部の一端に段差を形成
したが、なくてもよい。また、前記実施例の支持
部22bの底面22b1を傾斜させてもよい。ま
た、切欠部の数は4個に限らず、4個以上であつ
てもよいが、レジストの糸状物の付着防止から、
基板の角部の数と同じ4個がよい。また切欠部の
形状は、支持部の形状を考慮して適宜決定すれば
よい。また、保持部には環状の基板載置用突起を
設けてもよい。また搬送部には凸状の検知部を設
けなくてもよい。このときは、例えば、搬送部の
基板方向への移動距離を予じめ定めておけばよ
い。さらに、保持部の直径は、基板が内接する寸
法でなくてもよく、基板の対角線の寸法以上であ
ればよい。
First, the positions of the notches of the holding part do not need to be provided below each side surface of the substrate as in the above embodiment, but two notches may be provided on each of two opposing side surfaces. However, since filaments of resist may adhere to the back surface of the substrate at the notch provided on the front side in the direction of rotation of the two side surfaces forming the corner, it is preferable to use the method described in the above embodiment. A good position is good.
Further, in the embodiment described above, a step is formed at one end of the support portion, but it is not necessary. Furthermore, the bottom surface 22b 1 of the support portion 22b in the embodiment described above may be inclined. Further, the number of notches is not limited to four, and may be four or more, but from the viewpoint of preventing the attachment of filaments of the resist,
It is preferable to have four pieces, which is the same number as the corners of the board. Moreover, the shape of the notch portion may be appropriately determined in consideration of the shape of the support portion. Further, the holding portion may be provided with an annular substrate mounting protrusion. Moreover, the convex detection part does not need to be provided in the conveyance part. In this case, for example, the moving distance of the transport section in the direction of the substrate may be determined in advance. Further, the diameter of the holding portion does not have to be such that the substrate is inscribed therein, but may be equal to or larger than the diagonal of the substrate.

〔考案の効果〕[Effect of idea]

以上のとおり、本考案の回転塗布装置によれ
ば、基板の裏面にレジストの糸状物を付着させる
ことなく、レジスト膜を塗布し搬送することがで
きる。
As described above, according to the spin coating apparatus of the present invention, a resist film can be coated and transported without attaching resist filaments to the back surface of a substrate.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第6図は本考案の回転塗布装置の一実
施例を示す図であり、第1図は平面図、第2図は
正面図、第3図は第1図のX1−X1線断面図、第
4図は第1図のY1−Y1線断面図、第5図及び第
6図はそれぞれ基板に支持部が当接したときの、
X1−X1線断面図及びY1−Y1線断面図である。第
7図及び第8図は従来の回転塗布装置を示す図で
あり、第7図は平面図、第8図は正面図である。
第9図は従来の回転塗布装置によつてレジスト膜
を塗布したときのレジストの糸状物を示す基板の
平面図である。 20……基板、20a,20b……側面、20
c……角部、21……保持部、21a……切欠
部、22……搬送部、22a,22b……支持
部、23……回転用軸。
1 to 6 are diagrams showing one embodiment of the spin coating device of the present invention, in which FIG. 1 is a plan view, FIG. 2 is a front view, and FIG. 3 is an X 1 -X diagram of FIG. 1 line sectional view, FIG. 4 is a sectional view taken along Y 1 - Y 1 line in FIG. 1, and FIGS.
They are a sectional view taken along the line X 1 -X 1 and a sectional view taken along the line Y 1 -Y 1 . 7 and 8 are views showing a conventional spin coating device, with FIG. 7 being a plan view and FIG. 8 being a front view.
FIG. 9 is a plan view of a substrate showing filaments of resist when a resist film is applied by a conventional spin coating device. 20...Substrate, 20a, 20b...Side surface, 20
c...Corner part, 21...Holding part, 21a...Notch part, 22...Transporting part, 22a, 22b...Supporting part, 23...Rotating shaft.

Claims (1)

【実用新案登録請求の範囲】 (1) レジスト膜を塗布する基板を保持し、回転さ
せる保持部と、前記基板を搬送する搬送部とを
具備する回転塗布装置において、前記保持部
が、その直径が前記基板の主表面の対角線寸法
以上の寸法である円板であり、かつ前記保持部
に前記基板を保持したとき、前記基板の2側面
により形成される角部近傍の下に位置し、その
位置から前記保持部の側面まで切り取られた切
欠部を有し、さらに前記搬送部が、前記切欠部
を通し、かつ搬送のときに前記基板を支持する
支持部を備えていることを特徴とする回転塗布
装置。 (2) 実用新案登録請求の範囲第(1)項記載におい
て、前記切欠部が、前記角部を形成する2側面
のうち、前記基板が回転する方向の後方の側面
の下に設けられていることを特徴とする回転塗
布装置。
[Claims for Utility Model Registration] (1) A rotary coating device comprising a holding part that holds and rotates a substrate to be coated with a resist film, and a conveyance part that transports the substrate, wherein the holding part has a diameter is a circular plate having a dimension equal to or larger than the diagonal dimension of the main surface of the substrate, and when the substrate is held in the holding part, the disk is located under the vicinity of the corner formed by the two side surfaces of the substrate; The substrate has a notch cut out from the position to a side surface of the holding part, and the transport part further includes a support part that passes through the notch and supports the substrate during transport. Rotary coating device. (2) In the utility model registration claim (1), the notch is provided under the rear side in the direction in which the substrate rotates, of the two side surfaces forming the corner. A rotary coating device characterized by:
JP1987013535U 1987-01-30 1987-01-30 Expired JPH0331073Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987013535U JPH0331073Y2 (en) 1987-01-30 1987-01-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987013535U JPH0331073Y2 (en) 1987-01-30 1987-01-30

Publications (2)

Publication Number Publication Date
JPS63121434U JPS63121434U (en) 1988-08-05
JPH0331073Y2 true JPH0331073Y2 (en) 1991-07-01

Family

ID=30802683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987013535U Expired JPH0331073Y2 (en) 1987-01-30 1987-01-30

Country Status (1)

Country Link
JP (1) JPH0331073Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4642692B2 (en) * 2006-05-08 2011-03-02 東京エレクトロン株式会社 Substrate processing system

Also Published As

Publication number Publication date
JPS63121434U (en) 1988-08-05

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