JPH0331092Y2 - - Google Patents

Info

Publication number
JPH0331092Y2
JPH0331092Y2 JP1985130097U JP13009785U JPH0331092Y2 JP H0331092 Y2 JPH0331092 Y2 JP H0331092Y2 JP 1985130097 U JP1985130097 U JP 1985130097U JP 13009785 U JP13009785 U JP 13009785U JP H0331092 Y2 JPH0331092 Y2 JP H0331092Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit element
printed wiring
wiring board
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985130097U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6245870U (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985130097U priority Critical patent/JPH0331092Y2/ja
Publication of JPS6245870U publication Critical patent/JPS6245870U/ja
Application granted granted Critical
Publication of JPH0331092Y2 publication Critical patent/JPH0331092Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP1985130097U 1985-08-27 1985-08-27 Expired JPH0331092Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985130097U JPH0331092Y2 (cs) 1985-08-27 1985-08-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985130097U JPH0331092Y2 (cs) 1985-08-27 1985-08-27

Publications (2)

Publication Number Publication Date
JPS6245870U JPS6245870U (cs) 1987-03-19
JPH0331092Y2 true JPH0331092Y2 (cs) 1991-07-01

Family

ID=31027269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985130097U Expired JPH0331092Y2 (cs) 1985-08-27 1985-08-27

Country Status (1)

Country Link
JP (1) JPH0331092Y2 (cs)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2541494B2 (ja) * 1993-12-15 1996-10-09 日本電気株式会社 半導体装置
JP2550477B2 (ja) * 1994-05-27 1996-11-06 株式会社オーケープリント メモリ装置用部品取付板およびメモリユニット
US20220031573A1 (en) 2018-09-20 2022-02-03 Neuroceuticals Inc. Medical tube position confirmation system
US20240390235A1 (en) 2020-03-30 2024-11-28 E.Z.N.G Technologies Ltd Apparatus and method for nasogastric tube insertion guide

Also Published As

Publication number Publication date
JPS6245870U (cs) 1987-03-19

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