JPH0332465U - - Google Patents

Info

Publication number
JPH0332465U
JPH0332465U JP1989092987U JP9298789U JPH0332465U JP H0332465 U JPH0332465 U JP H0332465U JP 1989092987 U JP1989092987 U JP 1989092987U JP 9298789 U JP9298789 U JP 9298789U JP H0332465 U JPH0332465 U JP H0332465U
Authority
JP
Japan
Prior art keywords
board
double
thickness
conductive ink
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989092987U
Other languages
English (en)
Other versions
JPH0635499Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989092987U priority Critical patent/JPH0635499Y2/ja
Priority to KR2019890016706U priority patent/KR920002343Y1/ko
Priority to GB9017182A priority patent/GB2235825A/en
Publication of JPH0332465U publication Critical patent/JPH0332465U/ja
Application granted granted Critical
Publication of JPH0635499Y2 publication Critical patent/JPH0635499Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0221—Perforating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の両面プリント基板の構成部材
を分解して示す斜視図、第２図は完成品を補強板
の当接面側から捕らえた斜視図、第３図は導通部
を示す拡大斜視図、第４図は従来構造の基板を示
す斜視図、第５図は従来構造における導通部の導
通作業を示す一部を切欠した拡大斜視図である。 １……基板、１ａ，１ｂ……電気回路、２……
導通部、２１……導通用の孔、３……導通用のイ
ンク、４……押し込み用のピン、５……端子接続
部、６……補強板、６１……透孔。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 電気絶縁性を有し、表裏両面にエツチング
    手段等により電気回路を表示形成する基板の板厚
    をそれ自体では独立して強度を維持することがで
    きないような肉薄のものとし、前記する基板の片
    側面に形成した電気回路の導通部に導通用のイン
    クを印刷した場合にその印刷された導通用のイン
    クが印刷と同時に基板の裏面に形成したもう一つ
    の電気回路に達することができるように構成し、
    次いでこれらの印刷手段が完了した後に前記した
    基板素材の片面に、適宜位置に端子接続用の透孔
    を穿設した補強用の板材を当接一体化させること
    によつて基板自体が独立して強度を維持できるよ
    うに構成してなる両面プリン基板の構造。 (2) 使用する基板の厚さが０．６mm厚以下のも
    のである実用新案登録請求の範囲第１項記載の両
    面プリント基板。
JP1989092987U 1989-08-09 1989-08-09 両面プリント基板 Expired - Lifetime JPH0635499Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1989092987U JPH0635499Y2 (ja) 1989-08-09 1989-08-09 両面プリント基板
KR2019890016706U KR920002343Y1 (ko) 1989-08-09 1989-11-13 양면 프린트 기판
GB9017182A GB2235825A (en) 1989-08-09 1990-08-06 Double-sided composite printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989092987U JPH0635499Y2 (ja) 1989-08-09 1989-08-09 両面プリント基板

Publications (2)

Publication Number Publication Date
JPH0332465U true JPH0332465U (ja) 1991-03-29
JPH0635499Y2 JPH0635499Y2 (ja) 1994-09-14

Family

ID=14069727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989092987U Expired - Lifetime JPH0635499Y2 (ja) 1989-08-09 1989-08-09 両面プリント基板

Country Status (3)

Country Link
JP (1) JPH0635499Y2 (ja)
KR (1) KR920002343Y1 (ja)
GB (1) GB2235825A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008023506A1 (ja) * 2006-08-02 2010-01-07 株式会社村田製作所 チップ素子

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185893A (ja) * 1984-10-04 1986-05-01 横浜ゴム株式会社 可撓性フイルムへの電子回路印刷法
JPS6187392A (ja) * 1984-10-05 1986-05-02 横浜ゴム株式会社 可撓性プリント配線板の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Industrial Co Ltd Electronic circuit part and method of mounting same
GB2101411B (en) * 1981-06-04 1985-06-05 Standard Telephones Cables Ltd Flexi-rigid printed circuit boards
JPS60149196A (ja) * 1984-01-17 1985-08-06 ソニー株式会社 プリント基板およびその製造方法
DE3429236A1 (de) * 1984-08-08 1986-02-13 Krone Gmbh, 1000 Berlin Folie mit beidseitig aufgedruckten elektrischen leiterbahnen
GB2219892B (en) * 1988-06-16 1992-07-15 Plessey Co Plc A circuit board laminate and method of providing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6185893A (ja) * 1984-10-04 1986-05-01 横浜ゴム株式会社 可撓性フイルムへの電子回路印刷法
JPS6187392A (ja) * 1984-10-05 1986-05-02 横浜ゴム株式会社 可撓性プリント配線板の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2008023506A1 (ja) * 2006-08-02 2010-01-07 株式会社村田製作所 チップ素子
JP4561836B2 (ja) * 2006-08-02 2010-10-13 株式会社村田製作所 チップ素子

Also Published As

Publication number Publication date
GB9017182D0 (en) 1990-09-19
GB2235825A (en) 1991-03-13
KR920002343Y1 (ko) 1992-04-09
KR910010399U (ko) 1991-06-29
JPH0635499Y2 (ja) 1994-09-14

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