JPH0336148U - - Google Patents

Info

Publication number
JPH0336148U
JPH0336148U JP1989097650U JP9765089U JPH0336148U JP H0336148 U JPH0336148 U JP H0336148U JP 1989097650 U JP1989097650 U JP 1989097650U JP 9765089 U JP9765089 U JP 9765089U JP H0336148 U JPH0336148 U JP H0336148U
Authority
JP
Japan
Prior art keywords
heat dissipation
substrate
semiconductor element
heat
dissipation structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989097650U
Other languages
English (en)
Other versions
JPH087641Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989097650U priority Critical patent/JPH087641Y2/ja
Publication of JPH0336148U publication Critical patent/JPH0336148U/ja
Application granted granted Critical
Publication of JPH087641Y2 publication Critical patent/JPH087641Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図はパワーモジユール素子の放熱構造を表
す正面図、第２図はその放熱構造の各部の熱抵抗
を示すグラフ、第３図はパワーモジユール素子の
回路構成図である。 １……基板、２……回路板、３……銅板、４…
…静電誘導トランジスタ、５……ＰＷＭ制御回路
、６……金属フイラー、７……シリコーン樹脂、
８……放熱板、１０…パワーモジユール素子。

Claims (1)

  1. 【実用新案登録請求の範囲】 表面に半導体素子を載置した基板の裏面に放熱
    板を接着し、上記半導体素子の発生する熱を上記
    基板を介して上記放熱板に伝導する半導体素子の
    放熱構造において、 柱状あるいは球状の径の等しい複数の金属フイ
    ラーを混入した接着剤層を、上記放熱板と上記基
    板との間に、該金属フイラーが両者に当接介在す
    るよう形成してなる半導体素子の放熱構造。
JP1989097650U 1989-08-22 1989-08-22 半導体素子の放熱構造 Expired - Lifetime JPH087641Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989097650U JPH087641Y2 (ja) 1989-08-22 1989-08-22 半導体素子の放熱構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989097650U JPH087641Y2 (ja) 1989-08-22 1989-08-22 半導体素子の放熱構造

Publications (2)

Publication Number Publication Date
JPH0336148U true JPH0336148U (ja) 1991-04-09
JPH087641Y2 JPH087641Y2 (ja) 1996-03-04

Family

ID=31646785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989097650U Expired - Lifetime JPH087641Y2 (ja) 1989-08-22 1989-08-22 半導体素子の放熱構造

Country Status (1)

Country Link
JP (1) JPH087641Y2 (ja)

Also Published As

Publication number Publication date
JPH087641Y2 (ja) 1996-03-04

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