JPH0338014A - Electronic component - Google Patents
Electronic componentInfo
- Publication number
- JPH0338014A JPH0338014A JP1174477A JP17447789A JPH0338014A JP H0338014 A JPH0338014 A JP H0338014A JP 1174477 A JP1174477 A JP 1174477A JP 17447789 A JP17447789 A JP 17447789A JP H0338014 A JPH0338014 A JP H0338014A
- Authority
- JP
- Japan
- Prior art keywords
- pair
- insulating plate
- lead wires
- electronic component
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント基板に面実装されるチップ形アルミ
電解コンデンサ等の電子部品に関するも（６）
のである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to electronic components such as chip-type aluminum electrolytic capacitors that are surface-mounted on printed circuit boards.
従来の技術
従来のこの種の電子部品であるチップ形アルミ電解コン
デンサは、第７図および第８図に示すように構成されて
いた。すなわち、コンデンサ素子１を内蔵した本体２は
有底円筒状に構成され、かつ前記コンデンサ素子１から
は一対のリード電極３が導出されている。また前記本体
２の開口部は封口体４により封口され、かつこの本体２
の開口部側には絶縁板５が配設されている。そして前記
一対のリード電極３は封口体４の内部を貫通し、かつ端
面を前記本体２の開口部を介して絶縁板５に臨ませてい
る。また前記絶縁板５には貫通穴６を設けるとともに、
この貫通穴６と連続して収納用凹部７を設けている。そ
してまた前記一対のリード電極３には偏平状に構成され
たリード線８が接続され、このリード線８は前記絶縁板
５に設けた貫通穴６を貫通し、かつその先端部は絶縁板
５の底面に沿って折り曲げ、前記収納用凹部７に収納し
ている。2. Description of the Related Art A chip-type aluminum electrolytic capacitor, which is a conventional electronic component of this type, was constructed as shown in FIGS. 7 and 8. That is, the main body 2 containing the capacitor element 1 has a cylindrical shape with a bottom, and a pair of lead electrodes 3 are led out from the capacitor element 1. Further, the opening of the main body 2 is sealed with a sealing body 4, and the main body 2
An insulating plate 5 is arranged on the opening side. The pair of lead electrodes 3 penetrate the inside of the sealing body 4, and have end faces facing the insulating plate 5 through the opening of the main body 2. Further, the insulating plate 5 is provided with a through hole 6, and
A storage recess 7 is provided continuously with the through hole 6. Further, a flat lead wire 8 is connected to the pair of lead electrodes 3, and this lead wire 8 passes through a through hole 6 provided in the insulating plate 5, and its tip end is connected to the insulating plate 5. It is folded along the bottom surface and stored in the storage recess 7.
発明が解決しようとする課題
上記した従来のチップ形アルミ電解コンデンサは、プリ
ント基板に面実装されるが、この面実装は偏平状に構成
された一対のリード線８をプリント基板にリフロー半田
付けすることにより行っている。Problems to be Solved by the Invention The above-mentioned conventional chip-type aluminum electrolytic capacitor is surface-mounted on a printed circuit board, but this surface mounting involves reflow soldering a pair of flat lead wires 8 to the printed circuit board. This is done by doing this.
一般に、同一のプリント基板に熱容量の異なる複数の面
実装部品を半田付けする場合、例えば熱容量の小さい面
実装部品を基準にして半田付は温度を低く設定すると、
熱容量の大きい面実装部品においては、半田が溶けない
ものが発生したり、逆に、熱容量の大きい面実装部品を
基準にして半田付は温度を高く設定すると、熱容量の小
さい面実装部品においては、熱ストレスが厳しくなって
、面実装部品の外観の変形や、特性、性能の劣化をきた
すものであった。Generally, when soldering multiple surface-mounted components with different heat capacities to the same printed circuit board, for example, if the soldering temperature is set low based on the surface-mounted components with small heat capacities,
For surface mount components with large heat capacity, some solder may not melt, and conversely, if the soldering temperature is set high based on surface mount components with large heat capacity, surface mount components with small heat capacity may not melt. Thermal stress becomes severe, causing deformation of the appearance of surface-mounted components and deterioration of characteristics and performance.
上記した従来のチップ形アルミ電解コンデンサは、偏平
状に構成された一対のリード線８を絶縁板５に設けた収
納用凹部７に収納しているもので、この一対のリードＭ
８をプリント基板にリフロー半田付けする場合、前記絶
縁板５に設けた収納用凹部７内に一対のリード線８が位
置し、かつ両者の接触面積も大きいため、一対のリード
線８に伝達された熱はコンデンサ素子ｌを内蔵した本体
２ｆｔ４に奪われることになり、その結果、一対のリー
ド線８の温度があまり上がらないため、例えばリフロー
半田付は温度が低く設定されている場合は、半田が溶け
ないという問題点があった。The conventional chip-type aluminum electrolytic capacitor described above has a pair of flat lead wires 8 housed in a storage recess 7 provided in an insulating plate 5.
When reflow soldering 8 to a printed circuit board, the pair of lead wires 8 are located in the storage recess 7 provided in the insulating plate 5, and the contact area between them is large. The heat generated will be taken away by the 2ft4 main body that contains the capacitor element l, and as a result, the temperature of the pair of lead wires 8 will not rise much. For example, if the temperature is set low in reflow soldering, The problem was that it did not dissolve.
本発明は上記従来の問題点を解決するもので、熱容量の
小さい面実装部品を基準にしてリフロー半田付は温度が
低く設定されていたとしても、対のリードに線伝達され
た熱が電子部品本体に奪われることなく、効果的に半田
付けを行うことができる電子部品を提供することを目的
とするものである。The present invention solves the above-mentioned conventional problems. Even if reflow soldering is set at a low temperature based on surface mount components with a small heat capacity, the heat transferred to the pair of leads through the wire is transferred to the electronic component. The object of the present invention is to provide an electronic component that can be effectively soldered without being stolen by the main body.
課題を解決するための手段
上記目的を達成するために本発明の電子部品は、素子を
内蔵した電子部品本体と、前記素子から導出された一対
のリード線と、前記電子部品本体とプリント基板との間
の絶縁を行う絶縁板とを備え、前記絶縁板に貫通穴を設
け、この貫通穴に前記一対のリード線を通すとともに、
前記絶縁板の底面より外方に突出させ、さらにこの一対
のリード線を前記絶縁板の底面に沿って、絶縁板の底面
との間に隙間をもたせた状態で折り曲げたものである。Means for Solving the Problems In order to achieve the above object, an electronic component of the present invention includes an electronic component body incorporating an element, a pair of lead wires led out from the element, and a connection between the electronic component body and a printed circuit board. an insulating plate that performs insulation between the two, a through hole is provided in the insulating plate, the pair of lead wires are passed through the through hole, and
The lead wires are made to protrude outward from the bottom surface of the insulating plate, and the pair of lead wires are bent along the bottom surface of the insulating plate with a gap between them and the bottom surface of the insulating plate.
作用
上記構成の電子部品は、電子部品本体とプリント基板と
の間の絶縁を行う絶縁板に貫通穴を設け、この貫通穴に
、素子から導出された一対のリード線を通すとともに、
前記絶縁板の底面より外方に突出させ、さらにこの一対
のリード線を前記絶縁板の底面に沿って、絶縁板の底面
との間に隙間をもたせた状態で折り曲げているもので、
この電子部品をプリント基板に面実装するために一対の
リード線をプリント基板に載置して半田付けを行う場合
、絶縁板の底面より一対のリード線が外方に突出してい
るとともに、一対のリード線の折り曲げ部と絶縁板の底
面との間に隙間が存在することにより、一対のリード線
と電子部品本体側は完全に隔離されることになるため、
一対のリード線に伝達された熱が電子部品本体に奪われ
るということはなくなり、その結果、一対のリード線の
温度は効率的に上昇するため、プリント基板への半田付
けを効果的に行うことができる。Function The electronic component having the above structure has a through hole provided in the insulating plate that provides insulation between the electronic component main body and the printed circuit board, and a pair of lead wires led out from the element are passed through the through hole.
The lead wires are made to protrude outward from the bottom surface of the insulating plate, and the pair of lead wires are bent along the bottom surface of the insulating plate with a gap between them and the bottom surface of the insulating plate,
When mounting a pair of lead wires on a printed circuit board and soldering them in order to surface-mount this electronic component on a printed circuit board, the pair of lead wires protrudes outward from the bottom of the insulating board, and Because there is a gap between the bent part of the lead wire and the bottom of the insulating plate, the pair of lead wires and the electronic component body are completely isolated.
The heat transferred to the pair of lead wires is no longer taken away by the electronic component body, and as a result, the temperature of the pair of lead wires increases efficiently, making it possible to effectively solder to the printed circuit board. I can do it.
このように一対のリード線の温度を効率的に上昇させる
ことができるため、同一のプリント基板に熱容量の興な
る複数の面実装部品を半田付けする場合、熱容量の小さ
い面実装部品を基準にしてリフロー半田付は温度が低く
設定されていたとしても、半田が溶けないという問題点
はなくなり、また、これにより、リフロー半田付は温度
を低く設定することができるため、電子部品の外観の変
形や、特性、性能の劣化も速実に防止することができる
ものである。In this way, the temperature of a pair of lead wires can be raised efficiently, so when soldering multiple surface mount components with high heat capacity to the same printed circuit board, it is possible to increase the temperature of the pair of lead wires by using the surface mount component with low heat capacity as the standard. Reflow soldering eliminates the problem of the solder not melting even if the temperature is set low; , deterioration of characteristics and performance can be promptly prevented.
実施例
以下、本発明の一実施例を添付図面にもとづいて説明す
る。第１図および第２図において、１１はチップ形アル
ミ電解コンデンサ素子１２を内蔵したアルミケースより
なるコンデンサ本体で、このコンデンサ本体１１は有底
円筒状に構成され、かつ前記コンデンサ素子１２からは
一対のリード電極１３が導出されている。また前記コン
デンサ本体１１の開口部は封口体１４により封口され、
かつこのコンデンサ本体１１の開口部側には、プリント
基板とコンデンサ本体１１の絶縁を行う絶縁板１５が配
設されている。そして前記一対のリード電極１３は封口
体１４の内部を貫通し、かつ端面を前記コンデンサ本体
１１の開口部を介して絶縁板１５に臨ませ、さらにこの
一対のリード電極１３には偏平状に構成されたリード線
１６が接続されている。Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings. 1 and 2, reference numeral 11 denotes a capacitor body made of an aluminum case containing a chip-type aluminum electrolytic capacitor element 12. This capacitor body 11 has a cylindrical shape with a bottom. A lead electrode 13 is led out. Further, the opening of the capacitor body 11 is sealed with a sealing body 14,
An insulating plate 15 for insulating the printed circuit board and the capacitor body 11 is disposed on the opening side of the capacitor body 11. The pair of lead electrodes 13 penetrate the inside of the sealing body 14, and have their end faces facing the insulating plate 15 through the opening of the capacitor body 11. The lead wire 16 is connected.
また前記絶縁板１５の底面の略中央部には四角形状の突
出部１７を設け、この突出部１７の部分に貫通穴１８を
設けており、前記一対のリード線１６はこの貫通穴１８
を貫通して絶縁板１５の突出部１７より外方に突出し、
そしてその先端部を突出部１７の底面に沿って折り曲げ
ることにより、絶縁板１５の底面と一対のリード線１６
の折り曲げ部１６ａとの間に隙間１９をもたせている。Further, a rectangular protrusion 17 is provided approximately in the center of the bottom surface of the insulating plate 15, and a through hole 18 is provided in the protrusion 17, and the pair of lead wires 16 are inserted into the through hole 18.
penetrates through and protrudes outward from the protrusion 17 of the insulating plate 15,
By bending the tip end along the bottom surface of the protrusion 17, the bottom surface of the insulating plate 15 and the pair of lead wires 16
A gap 19 is provided between the bent portion 16a and the bent portion 16a.
そしてまた前記絶縁板１５の底面には、絶縁板１５の略
中央に位置する一対の偏平状のリード線１６の両側に位
置して突起部２０を複数個一体に形成しているもので、
この突起部２０はコンデンサ本体１１をプリント基板に
載置した場合に、コンデンサ本体１１のぐらつきを防止
するとともに、プリント基板とＩｌ！縁板１５の底面と
の間に隙間を確保する役目もなしている。Furthermore, on the bottom surface of the insulating plate 15, a plurality of protrusions 20 are integrally formed on both sides of a pair of flat lead wires 16 located approximately in the center of the insulating plate 15.
This protrusion 20 prevents the capacitor body 11 from wobbling when the capacitor body 11 is placed on the printed circuit board, and also prevents the capacitor body 11 from wobbling when placed on the printed circuit board. It also serves to ensure a gap between it and the bottom surface of the edge plate 15.
また前記絶縁板１５の底面には、絶縁板１５の略中央に
′位置する一対の偏平状のリード線１６の両側面に位置
して回り止め用突起２１を複数個−体に形成しているも
ので、この回り止め用突起２１は、コンデンサ本体１１
がプリント基板に実装されていない状態において、コン
デンサ本体１１と絶縁板１５とが相対的に回るのを防止
して、絶縁板１５をコンデンサ本体１１に対して所定の
方向に位置決めするものである。このような構造とする
ことにより、コンデンサ本体１１をプリント基板に実装
する場合、その位置決めが容易に行えるものである。Further, on the bottom surface of the insulating plate 15, a plurality of anti-rotation protrusions 21 are formed on both sides of a pair of flat lead wires 16 located approximately at the center of the insulating plate 15. This anti-rotation protrusion 21 is attached to the capacitor body 11.
This is to prevent the capacitor body 11 and the insulating plate 15 from rotating relative to each other and position the insulating plate 15 in a predetermined direction with respect to the capacitor body 11 when the capacitor body 11 and the insulating plate 15 are not mounted on a printed circuit board. With this structure, when the capacitor main body 11 is mounted on a printed circuit board, its position can be easily performed.
上記構成において、次にその作用を説明する。The operation of the above configuration will be explained next.
上記チップ形アルミ電解コンデンサをプリント基板に面
実装する場合、一対の偏平状のリード線１６をプリント
基板にリフロー半田付けするが、この場合、電解コンデ
ンサをプリント基板に載置すると、絶縁板１５の底面の
略中央部に設けた四角形状の突出部１７より外方に突出
している一対の偏平状のリード線１６がプリント基板に
接触するとともに、絶縁板１５の底面に一体に形成した
複数個の突起部２０がプリント基板に接触することにな
る。これにより、絶縁板１５の底面とプリント基板との
間には、複数個の突起部２０の高さ分だけ、隙間が確保
されることになる。また一対のリード１ｓ１６を絶縁板
１５の底面の略中央部に設けた四角形状の突出部１７の
底面より外方に突出させるとともに、一対のリード１１
１！１６の折り曲げ部１６ａとの間に隙間１９をもたせ
ているため、対のリード線１６とコンデンサ本体１１側
とは隙間１９の存在により完全に隔離されることになリ
、これにより、一対のリード線１６に伝達された熱がコ
ンデンサ本体１１に奪われるということはなくなるため
、一対のリード線１６の温度は効率的に上昇し、プリン
ト基板への半田付けを効果的に行うことができるもので
ある。When surface mounting the chip type aluminum electrolytic capacitor on a printed circuit board, a pair of flat lead wires 16 are reflow soldered to the printed circuit board. A pair of flat lead wires 16 protruding outward from a rectangular protrusion 17 provided approximately at the center of the bottom surface contacts the printed circuit board, and a plurality of flat lead wires 16 integrally formed on the bottom surface of the insulating plate 15 contact the printed circuit board. The protrusion 20 will come into contact with the printed circuit board. Thereby, a gap corresponding to the height of the plurality of protrusions 20 is secured between the bottom surface of the insulating plate 15 and the printed circuit board. Further, a pair of leads 1s16 are made to protrude outward from the bottom surface of a rectangular protrusion 17 provided approximately in the center of the bottom surface of the insulating plate 15, and a pair of leads 1s16
Since a gap 19 is provided between the bent portion 16a of the lead wire 1!16, the pair of lead wires 16 and the capacitor body 11 side are completely isolated due to the existence of the gap 19. Since the heat transferred to the lead wires 16 will not be taken away by the capacitor body 11, the temperature of the pair of lead wires 16 will increase efficiently, and soldering to the printed circuit board can be performed effectively. It is something.
第３図は本発明の他の実施例を示したもので、この第３
図に示す実施例は絶縁板１５の底面の略中央部に設けた
突出部１７ａを円形状に構成したものである。′そして
その他の構成は第１図および第２図で示した一実施例と
同じである。この第３図に示した実施例においても、上
記一実施例と同様の作用効果を奏するものである。FIG. 3 shows another embodiment of the present invention.
In the embodiment shown in the figure, a protrusion 17a provided approximately at the center of the bottom surface of the insulating plate 15 is configured in a circular shape. 'The other configurations are the same as the embodiment shown in FIGS. 1 and 2. The embodiment shown in FIG. 3 also has the same effects as the above-mentioned embodiment.
第４図および第５図は本発明のさらに他の実施例を示し
たもので、この実施例は、第４図に示すように、絶縁板
１５の底面の一対のリード線１６と対向する部分に、一
対のリード線１６が当接する突起２２を設けたもので、
この突起２２を設けることにより、絶縁板１５の底面と
一対のリード線１６との間に隙間２３をもたせている。FIGS. 4 and 5 show still another embodiment of the present invention. In this embodiment, as shown in FIG. is provided with a protrusion 22 on which a pair of lead wires 16 abut,
By providing this projection 22, a gap 23 is provided between the bottom surface of the insulating plate 15 and the pair of lead wires 16.
なお、絶縁板１５の底面の略中央部に設けた突出部１７
は、第１図および第２図で示した一実施例と同様に四角
形状に構成している。また第６図に示した実施例の内容
は、第４図および第５図に示した実施例と略同様であり
、異なる点は、絶縁板１５の底面の略中央部に設けた突
出部１７ａを、第３図に示した実施例と同様に円形状に
構成した点である。 なお、上記一実施例においては、
電子部品の一例としてチップ形アルミ電解コンデンサに
ついて説明したが、この電解コンデンサに限定されるも
のではなく、他の電子部品にも上記した構造を適用でき
ることは言うまでもない。Note that a protrusion 17 provided approximately at the center of the bottom surface of the insulating plate 15
has a rectangular configuration similar to the embodiment shown in FIGS. 1 and 2. The content of the embodiment shown in FIG. 6 is substantially the same as that of the embodiment shown in FIGS. is configured in a circular shape similar to the embodiment shown in FIG. Note that in the above embodiment,
Although a chip-type aluminum electrolytic capacitor has been described as an example of an electronic component, the present invention is not limited to this electrolytic capacitor, and it goes without saying that the above-described structure can be applied to other electronic components.
発明の効果
上記実施例の説明から明らかなように本発明の電子部品
は、電子部品本体とプリント基板との間の絶縁を行う絶
縁板に貫通穴を設け、この貫通穴に、素子から導出され
た一対のリード線を通すとともに、前記絶縁板の底面よ
り外方に突出させ、さらにこの一対のリード線を前記絶
縁板の底面に沿って、絶縁板の底面との間に隙間をもた
せた状態で折り曲げているもので、この電子部品をプリ
ント基板に面実装するために一対のリード線をプリント
基板に載置して半田付けを行う場合、絶縁板の底面より
一対のリード線が外方に突出しているとともに、一対の
リード線の折り曲げ部と絶縁板の底面との間に隙間が存
在することにより、−対のリード線と電子部品本体側は
完全に隔離されることになるため、一対のリード線に伝
達された熱が電子部品本体に奪われるということはなく
なり、その結果、一対のリード線の温度は効率的に上昇
するため、プリント基板への半田付けを効果的に行うこ
とができる。Effects of the Invention As is clear from the description of the embodiments above, the electronic component of the present invention is provided with a through hole in an insulating plate that insulates between the electronic component body and a printed circuit board, and a through hole is provided with a through hole through which the element is led out. A state in which a pair of lead wires are passed through and protrude outward from the bottom surface of the insulating plate, and a gap is provided between the pair of lead wires and the bottom surface of the insulating plate along the bottom surface of the insulating plate. When mounting a pair of lead wires on a printed circuit board and soldering them in order to surface mount this electronic component on a printed circuit board, the pair of lead wires should be bent outward from the bottom of the insulating board. In addition to protruding, there is a gap between the bent part of the pair of lead wires and the bottom of the insulating plate, so the lead wires of the pair and the electronic component body side are completely isolated. The heat transferred to the lead wires is no longer transferred to the electronic component body, and as a result, the temperature of the pair of lead wires increases efficiently, making it possible to solder the wires to the printed circuit board effectively. can.
このように一対のリード線の温度を効率的に上昇させる
ことができるため、同一のプリント基板に熱容量の異な
る面実装部品を半田付けする場合、熱容量の小さい面実
装部品を基準にしてリフロー半田付は温度が低く設定さ
れていたとしても、半田が溶けないという問題点はなく
なり、また、これにより、リフロー半田付は温度を低く
設定することができるため、電子部品の外観の変形や、
特性、性能の劣化も確実に防止することができるもので
ある。Since the temperature of a pair of lead wires can be raised efficiently in this way, when soldering surface mount components with different heat capacities to the same printed circuit board, reflow soldering is performed based on the surface mount component with a smaller heat capacity. This eliminates the problem of solder not melting even if the temperature is set low, and since reflow soldering allows the temperature to be set low, it prevents deformation of the appearance of electronic components,
Deterioration of characteristics and performance can also be reliably prevented.
第１図は本発明の一実施例を示すチップ形アルミ電解コ
ンデンサの破断正面図、第２図は同電解コンデンサの斜
視図、第３図は本発明の他の実施例を示すチップ形アル
ミ電解コンデンサの斜視図、第４図は本発明のさらに他
の実施例を示すチップ形アルミ電解コンデンサの破断正
面図、第５図は同電解コンデンサの斜視図、第６図は本
発明のさらにまた他の実施例を示すチップ形アルミ電解
コンデンサの斜視図、第７図は従来のチップ形アルミ電
解コンデンサの破断正面図、第８図は同電解コンデンサ
の斜視図である。
１１・・・・・・コンデンサ本体く電子部品本体〉、１
２・・・・・・コンデンサ素子、１５・・・・・・絶縁
板、１６・・・・・・一対のリード線、１６ａ・・・・
・・折り曲げ部、１７゜１７ａ・・・・・・突出部、１
８・・・・・・貫通穴、１９・・・・・・隙間、２０・
・・・・・突起部、２１・・・・・・回り止め用突起。
２２・・・・・・突起、２３・・・・・・隙間。FIG. 1 is a cutaway front view of a chip-type aluminum electrolytic capacitor showing one embodiment of the present invention, FIG. 2 is a perspective view of the same electrolytic capacitor, and FIG. 3 is a chip-type aluminum electrolytic capacitor showing another embodiment of the present invention. A perspective view of a capacitor, FIG. 4 is a cutaway front view of a chip-type aluminum electrolytic capacitor showing still another embodiment of the present invention, FIG. 5 is a perspective view of the same electrolytic capacitor, and FIG. 6 is a still another embodiment of the present invention. FIG. 7 is a cutaway front view of a conventional chip-type aluminum electrolytic capacitor, and FIG. 8 is a perspective view of the same electrolytic capacitor. 11...Capacitor body, electronic component body>, 1
2...Capacitor element, 15...Insulating plate, 16...Pair of lead wires, 16a...
・・Bending portion, 17° 17a ・・Protruding portion, 1
8...Through hole, 19...Gap, 20.
...Protrusion, 21...Protrusion for preventing rotation. 22...Protrusion, 23...Gap.
Claims (7)
出された一対のリード線と、前記電子部品本体とプリン
ト基板との間の絶縁を行う絶縁板とを備え、前記絶縁板
に貫通穴を設け、この貫通穴に前記一対のリード線を通
すとともに、前記絶縁板の底面より外方に突出させ、さ
らにこの一対のリード線を前記絶縁板の底面に沿って、
絶縁板の底面との間に隙間をもたせた状態で折り曲げた
ことを特徴とする電子部品。(1) An electronic component body with a built-in element, a pair of lead wires led out from the element, and an insulating plate for insulating between the electronic component body and a printed circuit board, and a through hole is provided in the insulating plate. are provided, the pair of lead wires are passed through the through holes, and are made to protrude outward from the bottom surface of the insulating plate, and the pair of lead wires are passed along the bottom surface of the insulating plate,
An electronic component characterized by being bent with a gap left between it and the bottom of an insulating plate.
出部に貫通穴を設け、この貫通穴に一対のリード線を通
すとともに、絶縁板の突出部より外方に突出させ、さら
にこの一対のリード線を絶縁板の突出部の底面に沿って
折り曲げることにより、絶縁板の底面と一対のリード線
との間に隙間をもたせた請求項１記載の電子部品。(2) A protrusion is provided at approximately the center of the bottom surface of the insulating plate, a through hole is provided in the protrusion, a pair of lead wires are passed through the through hole, and the protrusion is made to protrude outward from the protrusion of the insulating plate; 2. The electronic component according to claim 1, wherein the pair of lead wires are further bent along the bottom surface of the protrusion of the insulating plate to provide a gap between the bottom surface of the insulating plate and the pair of lead wires.
状に構成した請求項２記載の電子部品。(3) The electronic component according to claim 2, wherein the protrusion provided approximately at the center of the bottom surface of the insulating plate has a rectangular shape.
に構成した請求項２記載の電子部品。(4) The electronic component according to claim 2, wherein the protrusion provided approximately at the center of the bottom surface of the insulating plate has a circular shape.
、一対のリード線が当接する突起を設けることにより、
絶縁板の底面と一対のリード線との間に隙間をもたせた
請求項１記載の電子部品。(5) By providing a protrusion on the bottom of the insulating plate that faces the pair of lead wires, the protrusion that the pair of lead wires comes into contact with,
2. The electronic component according to claim 1, wherein a gap is provided between the bottom surface of the insulating plate and the pair of lead wires.
面に回り止め用突起を設けた請求項１〜５のいずれかに
記載の電子部品。(6) The electronic component according to any one of claims 1 to 5, further comprising anti-rotation protrusions provided on the bottom surface of the insulating plate, located on both sides of the pair of lead wires.
電子部品本体のぐらつき防止用の突起部を設けた請求項
１〜５のいずれかに記載の電子部品。(7) The electronic component according to any one of claims 1 to 5, wherein a protrusion for preventing wobbling of the electronic component body is provided on the bottom surface of the insulating plate, located on the side of the pair of lead wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1174477A JP2814580B2 (en) | 1989-07-05 | 1989-07-05 | Electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1174477A JP2814580B2 (en) | 1989-07-05 | 1989-07-05 | Electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0338014A true JPH0338014A (en) | 1991-02-19 |
| JP2814580B2 JP2814580B2 (en) | 1998-10-22 |
Family
ID=15979168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1174477A Expired - Lifetime JP2814580B2 (en) | 1989-07-05 | 1989-07-05 | Electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2814580B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286984A (en) * | 2005-03-31 | 2006-10-19 | Nippon Chemicon Corp | Chip type capacitor |
| JP2008211020A (en) * | 2007-02-27 | 2008-09-11 | Nichicon Corp | Chip type aluminum electrolytic capacitor |
| JP2009135249A (en) * | 2007-11-30 | 2009-06-18 | Gemmy Electronics Co Ltd | Solid-state electrolytic capacitor |
| US7719822B2 (en) * | 2006-12-05 | 2010-05-18 | Sanyo Electric Co., Ltd. | Electrolytic capacitor |
| JP2012244081A (en) * | 2011-05-24 | 2012-12-10 | Nichicon Corp | Chip type electrolytic capacitor |
| JP2013077783A (en) * | 2011-09-30 | 2013-04-25 | Nippon Chemicon Corp | Chip type capacitor |
-
1989
- 1989-07-05 JP JP1174477A patent/JP2814580B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286984A (en) * | 2005-03-31 | 2006-10-19 | Nippon Chemicon Corp | Chip type capacitor |
| US7719822B2 (en) * | 2006-12-05 | 2010-05-18 | Sanyo Electric Co., Ltd. | Electrolytic capacitor |
| JP2008211020A (en) * | 2007-02-27 | 2008-09-11 | Nichicon Corp | Chip type aluminum electrolytic capacitor |
| JP2009135249A (en) * | 2007-11-30 | 2009-06-18 | Gemmy Electronics Co Ltd | Solid-state electrolytic capacitor |
| JP2012244081A (en) * | 2011-05-24 | 2012-12-10 | Nichicon Corp | Chip type electrolytic capacitor |
| JP2013077783A (en) * | 2011-09-30 | 2013-04-25 | Nippon Chemicon Corp | Chip type capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2814580B2 (en) | 1998-10-22 |
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