JPH0338036A - Cleaning equipment - Google Patents
Cleaning equipmentInfo
- Publication number
- JPH0338036A JPH0338036A JP17334689A JP17334689A JPH0338036A JP H0338036 A JPH0338036 A JP H0338036A JP 17334689 A JP17334689 A JP 17334689A JP 17334689 A JP17334689 A JP 17334689A JP H0338036 A JPH0338036 A JP H0338036A
- Authority
- JP
- Japan
- Prior art keywords
- brush
- conductive material
- wafer
- cleaning
- foreign matter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Brushes (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ウェハ製造プロセスにおけろ異物除去全目
的としt:洗浄装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cleaning device whose entire purpose is to remove foreign matter in a wafer manufacturing process.
[従来の技術]
従来のウェハプロセスにおける洗浄装置としては、第3
図に示すようなスクラブ洗浄装置があげられる。[Prior art] As a cleaning device in the conventional wafer process, the third
An example is a scrub cleaning device as shown in the figure.
第3図にわいて、1は被洗浄物である、例えば・フ工ハ
、2はこのウェハ1のスクラブl先浄時に1史川されろ
ブラシである。なお、このブラシ2は両端rイけでh
< 、中央部全台め第4図に示すJうに全体にあり、そ
の材料としては、例えばレーヨンやアクリル、またはナ
イロンなどが1史用されている。In FIG. 3, numeral 1 is an object to be cleaned, for example, a cleaning agent, and numeral 2 is a brush that is used to clean the wafer 1 during scrubbing. In addition, this brush 2 has both ends.
It is located on the entire central part of the sea urchin shown in Figure 4, and the materials used for it include, for example, rayon, acrylic, or nylon.
次に動作について説明する。Next, the operation will be explained.
ウェハ製造プロセスにおいて、ウェハ表面に付着する異
物は、パターン欠損、特性劣化などを誘発し、歩留り低
下を引き起こす。それらを低減。In the wafer manufacturing process, foreign matter adhering to the wafer surface induces pattern defects and characteristic deterioration, leading to a decrease in yield. reduce them.
防止するために酸などによるウェット洗浄、プランを用
いたスクラブ洗浄を実施する乙とが必要となっている。In order to prevent this, it is necessary to perform wet cleaning with acid, etc., and scrub cleaning using a plan.
従来、スクラブ洗浄においては、ブラシ材にアクリルや
レーヨン、またはナイロンなどを直接プラン材料とし、
このブラシ材料で形成されたブラシー2を第4図のよう
にウェハ1面に接触させ、異物除去を実施していた。ま
た、ウェハ1面を親水性にして除去効果を高めたり、静
電気発生を抑制するため、洗浄に用いる純水の比抵抗を
下げるためのCO2バブリング、金属イオン、例えばM
gイオンなどを用い、ウェハ1やブラシ2の帯電を防止
していた。Traditionally, in scrub cleaning, acrylic, rayon, or nylon was used as the brush material directly.
A brush 2 made of this brush material was brought into contact with the surface of a wafer as shown in FIG. 4 to remove foreign matter. In addition, in order to make the wafer surface hydrophilic to increase the removal effect and to suppress the generation of static electricity, CO2 bubbling to lower the specific resistance of pure water used for cleaning, metal ions, etc.
The wafer 1 and the brush 2 were prevented from being charged using g ions or the like.
しかしながら、上記のように構成された従来の洗浄装置
においては、ブラシ材自身の帯電や被洗浄物の帯電を防
止するには不十分であり、CO2バブリングや金属イオ
ンの使用は有機異物の増加、金属残渣などを発生させ、
新たな歩留り低下を引き起こすなどの問題点があった。However, in the conventional cleaning device configured as described above, it is insufficient to prevent the brush material itself from being charged and the object to be cleaned from being charged, and the use of CO2 bubbling and metal ions increases the amount of organic foreign matter. Generates metal residue, etc.
There were problems such as causing a new decrease in yield.
この発明は、上記のような問題点を解消するtコめにな
されたものであり、プラン材や被洗浄物への帯電を防止
するとともに、洗浄工程を簡略化した洗浄装置を得るこ
とを目的とする。This invention was made to solve the above-mentioned problems, and aims to provide a cleaning device that prevents charging of plan materials and objects to be cleaned, and that simplifies the cleaning process. shall be.
この発明に係る洗浄装置は、スクラブ洗浄時に用いるブ
ラシを導電性物質により構成し、かつ前記ブラシを接地
したものである。In the cleaning device according to the present invention, the brush used during scrub cleaning is made of a conductive material, and the brush is grounded.
この発明による洗浄装置においてζよ、ブラシ材が導電
性物質であるため、被洗浄物の電荷はブラシ材を通し除
去されるため、帯電によるダメージ・を低減させること
ができる。In the cleaning device according to the present invention, since the brush material is a conductive material, the charge on the object to be cleaned is removed through the brush material, so that damage caused by charging can be reduced.
以下、この発明の一実施例全第1図について説明する。 Hereinafter, one embodiment of the present invention will be explained with reference to FIG.
第1図において、1は被洗7D物であるウェハ、20は
プランで、このブラシ20は、ブラシ材2]として導電
性物質、例えばアクリル、レーUシなどにカーボンを含
んだ素材(金属ブラシ(柔素材))が使・用され、この
導電性物質を経由し、接地電極3に接地される。In FIG. 1, numeral 1 is a wafer which is a 7D object to be cleaned, numeral 20 is a plan, and this brush 20 is made of a conductive material such as acrylic or resin containing carbon (a metal brush) as a brush material 2. (soft material)) is used and is grounded to the ground electrode 3 via this conductive material.
次に動作について説明する6゜
ブラシ20を直接ウエノ)1表面に接触させ、異物除去
を実施する方式は、従来技術と同様であるが、係る工程
において発生した電荷は、ブラシ材2]に使用された導
電性物質全通し除去される。Next, the operation will be explained.The method of bringing the 6° brush 20 into direct contact with the surface of the wafer material 1 to remove foreign matter is the same as in the prior art, but the electric charge generated in this process is used for the brush material 2. The conductive material that has been removed is completely removed.
上記のような方法によれば、ブラシ祠21.ウェハ1へ
の電荷集中を発生させるとと紅へ、洗浄工程において、
異物除去とと右に、スクラブ時まtコは前工程において
発生した電荷除去が可能となる。According to the above method, the brush shrine 21. In the cleaning process, when charge concentration occurs on the wafer 1,
In addition to removing foreign matter, during scrubbing, it is possible to remove charges generated in the previous process.
なお、この発明の他の実施例として、7rラン材21の
それぞれ令弟2図に模式的に示すように、低発塵体の被
膜22でコーティングすることによりスクラブ時の発塵
を防止することができる。In addition, as another embodiment of the present invention, as schematically shown in Fig. 2, the 7r run material 21 is coated with a film 22 of a low dust-emitting substance to prevent dust generation during scrubbing. I can do it.
なお、上記実施例では、被洗浄体としてウェハについて
述べたが、マスクなどへの転用も可能である。In the above embodiments, a wafer was described as an object to be cleaned, but it is also possible to use it for a mask or the like.
以上説明したように、この発明は、ブラシを導電性物質
により構成し、かつ前記ブラシを接地したので、洗浄工
程で発生する電荷は直ちに除去されろことから、被洗浄
物の帯電に上るグメージ令低減でき、歩留りを向上させ
ることができろ。As explained above, in this invention, since the brush is made of a conductive material and the brush is grounded, the electric charge generated in the cleaning process is immediately removed. It is possible to reduce the amount and improve the yield.
第1図はこの発明の一実施例を示す洗浄装置の構成図、
第2図はこの発明の他の実施例を示す洗浄装置の構成図
、第3図は従来の洗浄装置の構成図、第4図はスクラブ
洗浄状態の概略全量す斜視図である。
図において、1は被洗浄物であろウー【ハ、2゜はブラ
シ、21はブラシ材、22は被膜である。
なお、
各図中の同一符号は同一または相当部分を小す。FIG. 1 is a configuration diagram of a cleaning device showing an embodiment of the present invention;
FIG. 2 is a configuration diagram of a cleaning device showing another embodiment of the present invention, FIG. 3 is a configuration diagram of a conventional cleaning device, and FIG. 4 is a perspective view of the entire cleaning device in a scrub cleaning state. In the figure, 1 is an object to be cleaned, 2° is a brush, 21 is a brush material, and 22 is a coating. In addition, the same reference numerals in each figure represent the same or corresponding parts.
Claims (1)
スクラブ洗浄装置において、前記ブラシを導電性物質に
より構成し、かつ前記ブラシを接地したことを特徴とす
る洗浄装置。1. A scrub cleaning device for removing foreign matter by bringing a plan into contact with a cleaning surface of an object to be cleaned, characterized in that the brush is made of a conductive material and the brush is grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17334689A JPH0338036A (en) | 1989-07-04 | 1989-07-04 | Cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17334689A JPH0338036A (en) | 1989-07-04 | 1989-07-04 | Cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0338036A true JPH0338036A (en) | 1991-02-19 |
Family
ID=15958715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17334689A Pending JPH0338036A (en) | 1989-07-04 | 1989-07-04 | Cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0338036A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015032756A (en) * | 2013-08-05 | 2015-02-16 | 東京エレクトロン株式会社 | Substrate cleaning apparatus, substrate back surface cleaning method and cleaning mechanism |
-
1989
- 1989-07-04 JP JP17334689A patent/JPH0338036A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015032756A (en) * | 2013-08-05 | 2015-02-16 | 東京エレクトロン株式会社 | Substrate cleaning apparatus, substrate back surface cleaning method and cleaning mechanism |
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