JPH034513A - Semiconductor substrate - Google Patents
Semiconductor substrateInfo
- Publication number
- JPH034513A JPH034513A JP14049289A JP14049289A JPH034513A JP H034513 A JPH034513 A JP H034513A JP 14049289 A JP14049289 A JP 14049289A JP 14049289 A JP14049289 A JP 14049289A JP H034513 A JPH034513 A JP H034513A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- substrate
- semiconductor substrate
- small hole
- round shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 239000000758 substrate Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は半導体装置の製造における半導体基板に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION FIELD OF INDUSTRIAL APPLICATION The present invention relates to semiconductor substrates in the manufacture of semiconductor devices.
従来の技術
近年、半導体産業の急速な発展に伴い、半導体製品にお
いて、高集積化、高密度化が要求され、それに伴い信頼
性、歩留りの問題が大きく取り上げられている。BACKGROUND OF THE INVENTION In recent years, with the rapid development of the semiconductor industry, there has been a demand for higher integration and higher density in semiconductor products, and with this, reliability and yield issues have become a major focus.
第２図の通り従来技術では半導体製品の製造時、半導体
基板上に半導体製品をその製造プロセスに伴い、パター
ン形成する際、上下左右の位置確認のために、完円形の
半導体基板１１の周辺部を切りとり端部（以下オリフラ
と称す）１２を設け、これを、赤外線等を利用したセン
サーで検出する方式が利用されてきた。As shown in FIG. 2, in the prior art, when manufacturing a semiconductor product, when forming a pattern on a semiconductor substrate during the manufacturing process, the peripheral part of the perfectly circular semiconductor substrate 11 is used to confirm the vertical and horizontal positions. A method has been used in which an end portion (hereinafter referred to as an orientation flat) 12 is provided by cutting off the end portion, and this is detected by a sensor using infrared rays or the like.
本発明が解決しようとする課題
しかしながら、上記従来の方式では半導体基板が完円形
でないために、半導体製品製造時の製造プロセスの中で
ドライエツチング時の負荷効果によりエラキングの均一
性の問題、半導体基板を水平にしてベルト搬送する際の
確実性等に問題があった。Problems to be Solved by the Present Invention However, in the conventional method described above, since the semiconductor substrate is not a perfect circle, there is a problem of uniformity of the etching due to the load effect during dry etching during the manufacturing process of semiconductor products, and problems arise in the uniformity of the semiconductor substrate. There was a problem with the reliability of conveying the belt horizontally.
本発明は上記従来の方式では問題のあった半導体基板の
加工時の均一性、搬送時の安定性を確保し、信頼性が高
（、高歩留りの半導体製品を製造することのできる半導
体基板を提供するものである。The present invention ensures uniformity during processing and stability during transportation of semiconductor substrates, which were problematic with the conventional methods described above, and provides semiconductor substrates that are highly reliable (and capable of manufacturing high-yield semiconductor products). This is what we provide.
課題を解決するための手段
この目的を達成するために本発明の半導体基板は、完円
形のままで半導体基板上にパターン形成した半導体製品
の上下左右の位置確認ができるように、完円形の半導体
基板の外周部付近に小穴を有している。Means for Solving the Problems In order to achieve this object, the semiconductor substrate of the present invention is a semiconductor substrate having a perfect circular shape so that the vertical and horizontal positions of semiconductor products formed on the semiconductor substrate can be confirmed while the semiconductor substrate remains a perfect circle. There is a small hole near the outer periphery of the board.
作用
この構成によって、半導体基板の加工時の均一性、搬送
時の安定性が確保される。Function: With this configuration, uniformity during processing of the semiconductor substrate and stability during transportation are ensured.
実施例
以下、本発明の一実施例について説明する。第１図に示
す通り、完円形の半導体基板■の外周部付近に直径ＩＩ
ＩＩＩｌ程度のノＩＸ穴■を設け、半導体製品の上下左
右の位置確認が赤外線等のセンサーでできるようにして
いる。EXAMPLE An example of the present invention will be described below. As shown in Figure 1, there is a diameter II near the outer periphery of the completely circular semiconductor substrate
A hole of approximately 300 mm is provided so that the vertical and horizontal positions of semiconductor products can be confirmed using sensors such as infrared rays.
以上の本実施例によれば、半導体基板が完円形のままで
加工や搬送ができるため、均一性や確実性が向上し、半
導体製品の信頼性向上や歩留り向上を実現できる。According to the present embodiment described above, since the semiconductor substrate can be processed and transported while remaining in a perfect circle, uniformity and reliability are improved, and the reliability and yield of semiconductor products can be improved.
なお、半導体基板の外周部付近に設けた小穴はどんな形
状や大きさでもかまわないし、センサーで検知可能であ
れば、小穴でなく刻印であっても半導体基板が完円形で
ある条件を満たしていればかまわない。Note that the small hole provided near the outer periphery of the semiconductor substrate can be of any shape or size, and as long as it can be detected by a sensor, even if it is a stamp rather than a small hole, it must satisfy the condition that the semiconductor substrate is a perfect circle. Don't be silly.
又、小穴検知用のセンサーは赤外線のほかどんな方式で
あってもかまわない。Further, the sensor for detecting small holes may be of any type other than infrared rays.
発明の効果
以上に述べた通り、本発明によれば、完円形の半導体基
板上を利用して、その上と形成した半導体製品の上下左
右の位置決めを行うことにより、加工時により均一な、
搬送時により安定な半導体製品の製造が可能となる。Effects of the Invention As described above, according to the present invention, by utilizing a perfectly circular semiconductor substrate and vertically and horizontally positioning the semiconductor product formed thereon and the semiconductor product formed thereon, more uniform processing can be achieved during processing.
It becomes possible to manufacture semiconductor products more stably during transportation.
第１図は本発明の一実施例を示す平面図、第２図は従来
例を示す平面図である。
■・・・・・・半導体基板、２・・・・・・小穴。FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a plan view showing a conventional example. ■...Semiconductor substrate, 2...Small hole.
Claims (1)
小穴または刻印を設けたことを特徴とする半導体基板。A semiconductor substrate characterized by having a small hole or a stamp near the outer periphery of a perfectly circular semiconductor substrate so that the position can be confirmed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14049289A JPH034513A (en) | 1989-06-01 | 1989-06-01 | Semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14049289A JPH034513A (en) | 1989-06-01 | 1989-06-01 | Semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH034513A true JPH034513A (en) | 1991-01-10 |
Family
ID=15269881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14049289A Pending JPH034513A (en) | 1989-06-01 | 1989-06-01 | Semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH034513A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012127758A1 (en) | 2011-03-18 | 2012-09-27 | 富士フイルム株式会社 | Ink composition, inkjet printing ink, and inkjet printing method |
-
1989
- 1989-06-01 JP JP14049289A patent/JPH034513A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012127758A1 (en) | 2011-03-18 | 2012-09-27 | 富士フイルム株式会社 | Ink composition, inkjet printing ink, and inkjet printing method |
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