JPH034513B2 - - Google Patents
Info
- Publication number
- JPH034513B2 JPH034513B2 JP12391983A JP12391983A JPH034513B2 JP H034513 B2 JPH034513 B2 JP H034513B2 JP 12391983 A JP12391983 A JP 12391983A JP 12391983 A JP12391983 A JP 12391983A JP H034513 B2 JPH034513 B2 JP H034513B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramics
- conductive film
- conductive
- base sheet
- firing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 30
- 239000012700 ceramic precursor Substances 0.000 claims description 13
- 238000010304 firing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 229910010293 ceramic material Inorganic materials 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 43
- 239000000976 ink Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- 230000002411 adverse Effects 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000010023 transfer printing Methods 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- ZCUFMDLYAMJYST-UHFFFAOYSA-N thorium dioxide Chemical compound O=[Th]=O ZCUFMDLYAMJYST-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Producing Shaped Articles From Materials (AREA)
Description
【発明の詳細な説明】
本発明は導電性皮膜を有するセラミツクスの製
造方法に関するものであり、その目的とするとこ
ろは導電性皮膜を有するセラミツクス、殊に立体
形状を呈するセラミツクスを、容易な工程にて効
率的に製造する方法を提供せんとすることにあ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing ceramics having a conductive film, and an object of the present invention is to produce ceramics having a conductive film, particularly ceramics exhibiting a three-dimensional shape, in an easy process. The objective is to provide a method for efficiently manufacturing the same.
従来、導電性皮膜を有するセラミツクスを製造
する方法としては次のような方法がある。即ち、
HP（Hot Press）法、HIP（Hot Isostatic
Press）法、反応焼結法、溶融鋳込法、CVD
（Chemical Vapor Deposition）法等にてセラミ
ツクスを成形した後、スクリーン印刷法、スプレ
ー法、刷毛塗り法、コーティング法、転写印刷法
等にて導電性皮膜を形成し、その後焼成すること
によつて前記セラミツクス表面に導電性皮膜を焼
付ける方法、ラーバプレス法、押出法、射出成
形法、ローラ成形法、ドクターブレード成形法等
にてセラミツクス前駆体（グリーン成形体）を成
形した後、焼結することによつてセラミツクスと
し、その後スクリーン印刷法、スプレー法、刷毛
塗り法、コーテイング法、転写印刷法等にて導電
性皮膜を形成し、しかる後焼成することによつて
前記セラミツクス表面に導電性皮膜を焼付ける方
法、ラバープレス法、押出法、射出成形法、ロ
ーラ成形法、ドクターブレード成形法等にてセラ
ミツクス前駆体を成形した後、該表面にスクリー
ン印刷法、スプレー法、刷毛塗り法、コーテイン
グ法、転写印刷法等にて導電性皮膜を形成し、そ
の後前記セラミツクス前駆体を焼結するとともに
前記導電性皮膜を焼付ける方法等がある。 Conventionally, there are the following methods for producing ceramics having conductive films. That is,
HP (Hot Press) method, HIP (Hot Isostatic)
Press) method, reaction sintering method, melt casting method, CVD
After molding ceramics using a chemical vapor deposition method or the like, a conductive film is formed using a screen printing method, a spray method, a brush coating method, a coating method, a transfer printing method, etc. After forming a ceramic precursor (green molded body) using a method such as baking a conductive film on the ceramic surface, larva press method, extrusion method, injection molding method, roller molding method, doctor blade molding method, etc., it is sintered. Therefore, a conductive film is formed on the surface of the ceramic by forming a conductive film using a screen printing method, a spray method, a brush coating method, a coating method, a transfer printing method, etc., and then firing it. After molding the ceramic precursor using a rubber press method, extrusion method, injection molding method, roller molding method, doctor blade molding method, etc., the surface can be coated with a screen printing method, a spray method, a brush coating method, a coating method, There is a method in which a conductive film is formed by a transfer printing method or the like, and then the ceramic precursor is sintered and the conductive film is baked.
しかしながら前記した方法は何れも次のような
欠点を有するものである。即ち、、、の方
法は何れもセラミツクスの成形工程と導電性皮膜
の形成工程との２工程が必要であること、また立
体形状を呈するセラミツクスに対し、パターン状
の導電性皮膜を形成することは極めて困難である
ということ等の欠点を有するものであり、更に
との方法はセラミツクスを焼結する際の焼成工
程と導電性皮膜を焼付ける際の焼成工程とが各々
必要でありエネルギーコストが著しく高いという
欠点を有するものである。またの方法はと
の方法と比較するとエネルギーコストは低くてす
むものの、セラミツクス前駆体表面に導電性皮膜
を形成する際、セラミツクス前駆体に外部応力が
かかることが避けられず、その結果セラミツクス
の破壊強度を落とし機械特性に悪影響を及ぼすと
いう欠点を有するものである。 However, all of the above methods have the following drawbacks. In other words, both methods require two steps: a ceramic molding step and a conductive film forming step, and it is difficult to form a patterned conductive film on ceramics that have a three-dimensional shape. This method has drawbacks such as being extremely difficult, and furthermore, the method requires a firing process for sintering the ceramics and a firing process for baking the conductive film, resulting in significant energy costs. It has the disadvantage of being expensive. Although this method has lower energy costs than the previous method, it is inevitable that external stress will be applied to the ceramic precursor when forming a conductive film on the surface of the ceramic precursor, resulting in destruction of the ceramic. This has the disadvantage that it reduces strength and adversely affects mechanical properties.
本発明者は前記したような欠点に鑑み、種々研
究、実験の結果、遂に本発明を完成するに至つた
ものである。即ち、本発明は(a)剥離性を有する基
体シート上に、導電性を有し且つ融点が1300℃以
上の金属を主成分とするインキを用いて導電性イ
ンキ層を形成し、その上に接着剤層を形成してな
る転写材を、前記接着剤層と射出成形用セラミツ
クス材料とが接するように、射出成形用金型内に
設置する工程、(b)射出成形用セラミツクス原料を
前記金型内に射出する工程、(c)成形されたセラミ
ツクスを取り出すとともに前記基体シートを剥離
する工程、(d)基体シートを剥離したセラミツクス
前駆体を焼成する工程、からなることを特徴とす
る導電性皮膜を有するセラミツクスの製造方法で
ある。 In view of the above-mentioned drawbacks, the present inventor has finally completed the present invention as a result of various studies and experiments. That is, the present invention (a) forms a conductive ink layer on a releasable base sheet using an ink that is conductive and whose main component is a metal with a melting point of 1300°C or higher, and then (b) placing a transfer material formed with an adhesive layer in an injection mold so that the adhesive layer and the ceramic material for injection molding are in contact with each other; (c) removing the molded ceramic and peeling off the base sheet; (d) firing the ceramic precursor from which the base sheet has been peeled off. This is a method for manufacturing ceramics having a film.
以下、本発明について更に詳しく説明する。 The present invention will be explained in more detail below.
先ず本発明に使用する転写材について説明す
る。 First, the transfer material used in the present invention will be explained.
本発明に使用する転写材１は、剥離性を有する
基体シート２上に導電性インキ層３、接着剤層４
を形成してなるものである（第１図参照）。 The transfer material 1 used in the present invention has a conductive ink layer 3 and an adhesive layer 4 on a releasable base sheet 2.
(See Figure 1).
基体シート２ａとしては、ポリエステル、ポリ
エチレン、ポリプロピレン、ナイロン等のプラス
チツクフイルムを使用することができる。 As the base sheet 2a, a plastic film such as polyester, polyethylene, polypropylene, nylon, etc. can be used.
この基体シート２ａ上には適宜、離型処理を施
し、後述する導電性インキ層３が基体シート２ａ
から剥離可能となるようにしておく。 On this base sheet 2a, a mold release treatment is performed as appropriate, and a conductive ink layer 3, which will be described later, is applied to the base sheet 2a.
Make it so that it can be peeled off.
次に導電性インキ層３は、導電性を有する各種
インキを用い、印刷法あるいはコーテイング法等
の適宜の手段にて前記基体シート２上に形成す
る。この導電性インキは、導電性を有し且つ融点
が1300℃以上の金属を主成分とし、これに樹脂バ
インダー、フリツト、溶剤等を混合してなるもの
である。前記金属としては炭素、トリウム、モリ
ブデン、タングステン、クロム等を挙げることが
できる。 Next, the conductive ink layer 3 is formed on the base sheet 2 by an appropriate method such as a printing method or a coating method using various conductive inks. This conductive ink is mainly composed of a metal that is conductive and has a melting point of 1300° C. or higher, and is mixed with a resin binder, frit, solvent, etc. Examples of the metal include carbon, thorium, molybdenum, tungsten, and chromium.
なお、形成手段として印刷法を用いた場合は複
雑なパターンでも容易に形成することができるも
のである。 Note that when a printing method is used as a forming means, even a complicated pattern can be easily formed.
接着剤層４は、前記導電性インキ層３が乾燥し
た後、感熱性接着剤を用い、各種印刷法あるいは
コーテイング法等の適宜手段にて形成するとよ
い。 After the conductive ink layer 3 has dried, the adhesive layer 4 may be formed using a heat-sensitive adhesive by appropriate means such as various printing methods or coating methods.
なお、この接着剤層４は後述する焼成工程にお
いて、前記導電性インキに悪影響を及ぼさないも
の用いる。 Note that this adhesive layer 4 is made of a material that does not adversely affect the conductive ink in the firing process described later.
次に前記した構成からなる転写材１を用い、導
電性皮膜を有するセラミツクスを製造する方法に
ついて説明する。 Next, a method of manufacturing ceramics having a conductive film using the transfer material 1 having the above-described structure will be described.
先ず前記転写材１を射出成形用金型５内の所定
の位置に設置する（第２図参照）。この際、転写
材１の接着剤層４と後述する射出成形用セラミツ
クス材料とが接するように設置する。 First, the transfer material 1 is placed at a predetermined position within the injection mold 5 (see FIG. 2). At this time, the adhesive layer 4 of the transfer material 1 is placed so as to be in contact with a ceramic material for injection molding, which will be described later.
次に前記金型５を閉じた後、射出成形用セラミ
ツクス材料を前記金型５内に射出する（第３図参
照）。前記セラミツクス材料としては、炭化珪素、
酸化珪素、炭化チタン、炭化タクグステン、アル
ミナ、ジルコニア、ベリリア、トリア等がある。 Next, after closing the mold 5, a ceramic material for injection molding is injected into the mold 5 (see FIG. 3). As the ceramic material, silicon carbide,
Examples include silicon oxide, titanium carbide, tungsten carbide, alumina, zirconia, beryllia, and thoria.
なお、前記セラミツクス材料は、射出するに当
たつては可塑性を与え、また緻密な焼結体を得る
ため適宜添加剤、例えば可塑剤、結合剤、滑剤、
助剤等を加えておく。 In addition, when injecting the ceramic material, appropriate additives such as plasticizers, binders, lubricants, etc. are added to impart plasticity and to obtain a dense sintered body.
Add auxiliary agents, etc.
次に前記金型５内から成形されたセラミツクス
前駆体６を取り出す。この際、セラミツクス前駆
体６表面の基体シート２を剥離する（第４図参
照）。 Next, the molded ceramic precursor 6 is taken out from the mold 5. At this time, the base sheet 2 on the surface of the ceramic precursor 6 is peeled off (see FIG. 4).
その後、このセラミツクス前駆体６を400℃〜
500℃で仮焼成し、前記導電性インキ中の樹脂バ
インダー及び前記セラミツクス前駆体６中の添加
剤等を除法せしめる。 After that, this ceramic precursor 6 was heated to 400℃~
Temporary firing is performed at 500° C. to remove the resin binder in the conductive ink and the additives in the ceramic precursor 6.
しかる後、仮焼成したセラミツクス前駆体６を
1300℃〜1800℃で本焼成し、前記セラミツクス前
駆体６を焼結せしめるとともに前記導電性金属を
焼付ける。 After that, the pre-fired ceramics precursor 6 is
Main firing is performed at 1300° C. to 1800° C. to sinter the ceramic precursor 6 and bake the conductive metal.
このようにすることによつて、導電性を有する
セラミツクス７を得ることができる（第５図参
照）。 By doing so, it is possible to obtain ceramics 7 having electrical conductivity (see FIG. 5).
本発明に係る導電性皮膜を有するセラミツクス
の製造方法は、以上説明した構成からなるもので
あるから、次のような効果を有するものである。
即ち、セラミツクスの成形と同時に導電性皮膜を
形成することが出来るものであるから、導電性皮
膜を有するセラミツクスを効率的に製造すること
ができ、更に立体形状を呈するセラミツクスに対
しても容易に導電性皮膜を形成することができる
ものである。しかも、導電性皮膜の形成はセラミ
ツクスの成形と同時に行うものであるから、導電
性皮膜を形成する際セラミツクスに外部応力がか
かることはなくセラミツクスの機械特性に悪影響
を及ぼすことはない。また、セラミツクスの焼結
工程と導電性皮膜の焼付け工程とを同時に行うこ
とができるものであるから、エネルギーコストも
低くてすむものである。 Since the method for manufacturing ceramics having a conductive film according to the present invention has the configuration described above, it has the following effects.
In other words, since a conductive film can be formed at the same time as ceramics are formed, ceramics having a conductive film can be efficiently produced, and even ceramics with a three-dimensional shape can be easily made conductive. It is capable of forming a sexual film. Moreover, since the formation of the conductive film is carried out simultaneously with the molding of the ceramics, no external stress is applied to the ceramics during the formation of the conductive film, and the mechanical properties of the ceramics are not adversely affected. Furthermore, since the ceramic sintering process and the conductive film baking process can be performed simultaneously, energy costs can be reduced.
従つて、本発明によつて得られた導電性皮膜を
有するセラミツクスは様々な方面に利用すること
ができるものであり、従つて本発明は産業上利用
価値の極めて高いものである。 Therefore, the ceramics having the conductive film obtained by the present invention can be used in various fields, and therefore, the present invention has extremely high industrial utility value.
第１図は本発明に係る転写材の断面模式図、第
２図乃至第４図は本発明に係る製造工程の断面模
式図、第５図は本発明によつて製造されたセラミ
ツクスの斜視図を各々示す。
図中、１……転写材、２……剥離性を有する基
体シート、２ａ……基体シート、２ｂ……剥離
層、３……導電性インキ層、４……接着剤層、５
……射出成形用金型、６……セラミツクス前駆
体、７……セラミツクス。
FIG. 1 is a schematic cross-sectional view of a transfer material according to the present invention, FIGS. 2 to 4 are schematic cross-sectional views of the manufacturing process according to the present invention, and FIG. 5 is a perspective view of ceramics manufactured according to the present invention. are shown respectively. In the figure, 1... Transfer material, 2... Base sheet with peelability, 2a... Base sheet, 2b... Peeling layer, 3... Conductive ink layer, 4... Adhesive layer, 5
... Injection mold, 6... Ceramics precursor, 7... Ceramics.
Claims (1)
を有し且つ融点が1300℃以上の金属を主成分と
するインキを用いて導電性インキ層を形成し、
その上に接着剤層を形成してなる転写材を、前
記接着剤層と射出成形用セラミツクス材料とが
接するように、射出成形用金型内に設置する工
程、 (b) 前記金型を閉じた後、射出成形用セラミツク
ス原料を前記金型内に射出する工程、 (c) 成形されたセラミツクス前駆体を取り出すと
ともに、前記基体シートを剥離する工程、 (d) 基体シートを剥離したセラミツクス前駆体を
焼成する工程、 からなることを特徴とする導電性皮膜を有するセ
ラミツクスの製造方法。 ２ 焼成する工程が、400℃〜500℃で仮焼成する
工程と1300℃〜1800℃で本焼成する工程とからな
ることを特徴とする特許請求の範囲第１項記載の
導電性皮膜を有するセラミツクスの製造方法。[Scope of Claims] 1 (a) A conductive ink layer is formed on a releasable base sheet using an ink that is conductive and whose main component is a metal with a melting point of 1300°C or higher,
placing a transfer material on which an adhesive layer is formed in an injection mold so that the adhesive layer and the injection molding ceramic material are in contact with each other; (b) closing the mold; (c) Taking out the molded ceramic precursor and peeling off the base sheet; (d) The ceramic precursor from which the base sheet has been peeled off. 1. A method for producing ceramics having a conductive film, comprising the step of firing. 2. Ceramics having a conductive film according to claim 1, wherein the firing step consists of a step of pre-firing at 400°C to 500°C and a step of main firing at 1300°C to 1800°C. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12391983A JPS6016884A (en) | 1983-07-06 | 1983-07-06 | Manufacture of ceramic with electroconductive coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12391983A JPS6016884A (en) | 1983-07-06 | 1983-07-06 | Manufacture of ceramic with electroconductive coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6016884A JPS6016884A (en) | 1985-01-28 |
| JPH034513B2 true JPH034513B2 (en) | 1991-01-23 |
Family
ID=14872584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12391983A Granted JPS6016884A (en) | 1983-07-06 | 1983-07-06 | Manufacture of ceramic with electroconductive coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6016884A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS621803A (en) * | 1985-06-26 | 1987-01-07 | Nissha Printing Co Ltd | Manufacture of formed metallic body having film on surface |
| JPH02248206A (en) * | 1989-03-22 | 1990-10-04 | Toshiba Chem Corp | Manufacture of conductive tile |
| ITBO20020337A1 (en) * | 2002-05-31 | 2003-12-01 | Tecno Europa Srl | METHOD FOR THE REALIZATION OF CERAMIC MANUFACTURES |
-
1983
- 1983-07-06 JP JP12391983A patent/JPS6016884A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6016884A (en) | 1985-01-28 |
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